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Microcontrollers, Microprocessor, FPGA Modules(1588)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0865-02-FBE23MA | 4.0000 |  |
2302 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-FBE23MA | 1 | Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0808-05-6BE81-A | 1.0000 | |
1899 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE81-A | 1 | ||||||||||||||
|
TE0725LP-01-72C-1U | 172.2000 | |
3530 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0725LP-01-72C-1U | 1 | Artix-7 A100T | 25MHz | - | 64MB | FPGA Core | - | 50 Pin | ||||
|
TE0803-02-02EG-1EA | - | |
5048 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-02EG-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0803-02-03CG-1EA | - | |
4624 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-03CG-1EA | OBSOLETE | 1 | - | - | - | - | MPU Core | - | B2B | |||||
|
TE0803-02-05EV-1EA | - | |
7687 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-05EV-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0807-02-04EG-1E | - | |
3141 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Obsolete | download | Not Applicable | 1686-TE0807-02-04EG-1E | OBSOLETE | 1 | ||||||||||||||
|
100-1254-2 | 301.0500 | |
1 | 0.00000000 | BECOM Systems GmbH | Blackfin® | Bulk | Active | 0°C ~ 70°C | 1.220" L x 1.420" W (31.00mm x 36.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3A991A2 | 8471.50.0150 | 1 | CM-BF527 | 600MHz | 64MB | 8MB | MPU Core | - | Expansion 2 x 60 | ||||
|
ME-XU1-9EG-2I-D12E-R5.0 | - | |
2972 | 0.00000000 | Enclustra FPGA Solutions | Mercury+ XU1 | Bulk | Active | -40°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | 2879-ME-XU1-9EG-2I-D12E-R5.0 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-2FFVC900I | 168 Pin | |||||||
 |
100-1500-1 | - | |
4178 | 0.00000000 | BECOM Systems GmbH | i.MX | Bulk | Obsolete | -40°C ~ 85°C | 2.760" L x 2.760" W (70.00mm x 70.00mm) | download | RoHS Compliant | 5A (24 Hours) | 5A002A1 | 8471.50.0150 | 1 | i.MX537 | 800MHz | 1GB | 2GB (NAND), 4MB (NOR) | MPU Core | - | Qseven Card-Edge 230 | ||||
|
101-0562 | - | |
7685 | 0.00000000 | Digi | RabbitCore® | Obsolete | -40°C ~ 85°C | 1.160" L x 1.380" W (29.50mm x 34.90mm) | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 4A994 | 8542.90.0000 | 50 | Rabbit 3000 | 29.4MHz | 256KB | 256KB | MPU Core | - | 2 IDC Headers 2x17 | ||||
|
SOMDM3730-30-1880AKIR | - | |
6079 | 0.00000000 | Beacon EmbeddedWorks | DM37x | Bulk | Obsolete | -40°C ~ 85°C | 0.590" L x 1.060" W (15.00mm x 27.00mm) | download | 1 (Unlimited) | 460-3522 | 5A002A1 LOG | 8473.30.1180 | 1 | ARM® Cortex®-A8, DM3730 | 800MHz | 512MB | 512MB | MPU, DSP Core | TMS320C64x (DSP) | Board-to-Board (BTB) Socket - 200 | ||||
 |
L138-FX-236-RC | 223.3800 | |
8261 | 0.00000000 | Critical Link LLC | MityDSP-L138F | Bulk | Active | 0°C ~ 70°C | 2.660" L x 2.000" W (67.60mm x 50.80mm) | download | RoHS Compliant | 3A991A2 | 8473.30.1180 | 1 | ARM926EJ-S, OMAP-L138 | 456MHz | 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External) | 512MB (NAND), 8MB (NOR) | MPU, DSP, FPGA Core | TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) | SO-DIMM-200 | |||||
 |
TE0726-03-41I64-A | - | |
4511 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Active | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03-41I64-A | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | |||||
 |
XPDNC200S-01 | 75.5500 | |
6764 | 0.00000000 | Lantronix, Inc. | XPort® Direct+™ | Box | Not For New Designs | -40°C ~ 85°C | 1.250" L x 1.700" W (31.80mm x 43.30mm) | XPDNC200 | download | RoHS Compliant | Not Applicable | 8542.31.0001 | 25 | DSTni-EX | 25MHz | 256KB | 512KB | MPU Core | XPort Direct+ | RJ45 | ||||
|
CENGLH7A400-10-402EC | - | |
3725 | 0.00000000 | Beacon EmbeddedWorks | - | Obsolete | 0°C ~ 70°C | 2.370" L x 2.670" W (60.20mm x 67.80mm) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | 4A994B | 8473.30.1180 | 10 | ARM922T, LH7A400 | 200MHz | 64MB | 16MB | MPU Core | - | SO-DIMM-144 | ||||
 |
3354-GX-X38-RC | - | |
3373 | 0.00000000 | Critical Link LLC | MitySOM | Bulk | Obsolete | 0°C ~ 70°C | 2.660" L x 1.500" W (67.60mm x 38.10mm) | download | 1 (Unlimited) | -3354-GX-X38-RC | 5A002A1 | 8473.30.1180 | 1 | ARM® Cortex®-A8, AM3354 | 720MHz | 512MB | 512MB | MPU Core | NEON™ SIMD | SO-DIMM-204 | ||||
 |
ME-XU7-6EG-1I-D11E-R3 | - | |
3161 | 0.00000000 | Enclustra FPGA Solutions | - | Box | Obsolete | -40°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | ME-XU7 | download | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 1 | ARM® Quad-Core Cortex-A53, ARM® Dual-Core Cortex-R5, Mali-400MP2 GPU | 533MHz, 1.333GHz | 1GB, 2GB | 16GB | MPU, FPGA Core | - | 168 Pin | ||||
 |
SOMDIMM-RX63N | 105.0000 | |
9015 | 0.00000000 | Future Designs Inc. | - | Box | Active | - | SOMDIMM | download | RoHS Compliant | 1 (Unlimited) | 622-1073 | EAR99 | 8537.10.9130 | 5 | RX600, RX63N | 100MHz | 128KB | 2MB | MCU Core | - | SO-DIMM-200 | |||
 |
DLP-2232H-SF | - | |
4926 | 0.00000000 | DLP Design Inc. | FPGA (cSoC) | Bulk | Obsolete | 0°C ~ 70°C | 3.000" L x 1.200" W (76.20mm x 30.50mm) | download | 1 (Unlimited) | REACH Unaffected | 813-1045 | EAR99 | 8543.70.9860 | 1 | SmartFusion, A2F200M3F | 100MHz | 64KB (Internal), 4MB (External) | 256KB | MCU/FPGA, USB Core | FT2232H | USB - B, Pin Header | |||
|
EDM1-IMX6U-MSD-BW | 111.0380 | |
5743 | 0.00000000 | Wandboard.Org | - | Box | Active | - | 2.360" L x 3.230" W (60.00mm x 82.00mm) | EDM1-IMX6 | - | ROHS3 Compliant | 0000.00.0000 | 10 | ARM® Cortex®-A9, i.MX6DualLite | - | 1GB | - | MPU Core | - | EDM Connector | |||||
|
DLP-FPGA | 119.9500 | |
6206 | 0.00000000 | FTDI, Future Technology Devices International Ltd | FPGA | Bulk | Active | - | - | download | 768-DLP-FPGA | 1 | Spartan-3E, XC3S250E | - | 128KB | - | FPGA Core | - | USB - B, Pin Header | |||||||
 |
EC-V-H264-8B-30-1080-MXC-ZL | - | |
7011 | 0.00000000 | System-On-Chip (SOC) Technologies Inc. | H.264-HD Encoder | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.700" L x 2.000" W (68.00mm x 51.00mm) | download | RoHS Compliant | Not Applicable | 1962-1000 | 3A991D | 8471.80.4000 | 1 | Artix-7 A200T | - | 256KB | 32MB | FPGA Core | - | SO-DIMM-204 | |||
|
CENGSH7760-10-504HC | - | |
2229 | 0.00000000 | Beacon EmbeddedWorks | - | Obsolete | 0°C ~ 70°C | 2.370" L x 2.670" W (60.20mm x 67.80mm) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | 4A994B | 8473.30.1180 | 1 | SH7760 | 198MHz | 64MB | 32MB | MPU Core | - | SO-DIMM-144 | ||||
 |
MOD5272-100CR | - | |
9330 | 0.00000000 | NetBurner Inc. | - | Tray | Obsolete | 0°C ~ 70°C | 2.600" L x 2.000" W (66.04mm x 50.80mm) | download | 1 (Unlimited) | REACH Unaffected | 3A001A3 | 8471.80.1000 | 1 | ColdFire 5272 | 62MHz | 8.004MB | 2MB | MCU, Ethernet Core | - | RJ-45, 2x50 Header | ||||
 |
DLP-HS-FPGA3 | - | |
8142 | 0.00000000 | DLP Design Inc. | FPGA | Bulk | Obsolete | 0°C ~ 70°C | 3.000" L x 1.200" W (76.20mm x 30.50mm) | download | 1 (Unlimited) | REACH Unaffected | 3A001A7B | 8543.70.9860 | 1 | Spartan-3A, XC3S1400A | 66MHz | 32MB | - | FPGA, USB Core | FT2232H | USB - B, Pin Header | ||||
|
DLP-245PL-G | 65.0000 | |
6110 | 0.00000000 | FTDI, Future Technology Devices International Ltd | - | Bulk | Active | - | 2.800" L x 2.000" W (71.10mm x 50.80mm) | DLP-245 | download | 768-DLP-245PL-G | 1 | PIC16F8722 | - | 3.75KB | 128KB | - | USB - B, Pin Header | |||||||
 |
3354-GX-XX7-RC | - | |
5486 | 0.00000000 | Critical Link LLC | MitySOM | Bulk | Obsolete | 0°C ~ 70°C | 2.660" L x 1.500" W (67.60mm x 38.10mm) | download | 1 (Unlimited) | -3354-GX-XX7-RC | 3A991A2 | 8473.30.1180 | 1 | ARM® Cortex®-A8, AM3354 | 720MHz | 256MB | - | MPU Core | NEON™ SIMD | SO-DIMM-204 | ||||
 |
TE0715-04-52I33-A | - | |
1109 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-52I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||
 |
TE0715-05-51I33-A | 387.4500 | |
3 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-51I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)