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Microcontrollers, Microprocessor, FPGA Modules(1588)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0745-02-91C31-A | 2.0000 |  |
8509 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-91C31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||
|
TE0745-02-71I31-AZ | 597.4500 | |
8559 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 160 | ||
|
TE0745-02-81C31-AK | - | |
3037 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||
|
S00005-02 | - | |
5503 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00005-02 | 1 | ||||||||||||
|
ME-XU1-9EG-3E-D12E-R5.0 | - | |
3283 | 0.00000000 | Enclustra FPGA Solutions | Mercury+ XU1 | Bulk | Active | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | 2879-ME-XU1-9EG-3E-D12E-R5.0 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | MPU Core | Xilinx Zynq UltraScale+ XCZU9EG-3FFVC900E | 168 Pin | |||||
|
ME-XU1-15EG-2I-D12E-G1-R5.0 | - | |
2271 | 0.00000000 | Enclustra FPGA Solutions | Mercury+ XU1 | Bulk | Active | -40°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | 2879-ME-XU1-15EG-2I-D12E-G1-R5.0 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | MPU Core | Xilinx Zynq UltraScale+ XCZU15EG-2FFVC900I | 168 Pin | |||||
|
TE0720-04-31C33MA | 303.4500 | |
4909 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-31C33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |
|
TE0720-04-61Q33ML | 340.2000 | |
4514 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33ML | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
|
TE0720-04-61C530A | 308.7000 | |
5270 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C530A | 1 | ARM® Cortex®-A9 | - | 256MB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
|
TE0720-04-62I33MA | 355.9500 | |
2065 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |
|
SOMIMX8MMQ-11-1BE4SMIR | - | |
8538 | 0.00000000 | Beacon EmbeddedWorks | i.MX 8M | Bulk | Active | -40°C ~ 85°C | 1.100" L x 1.500" W (28.00mm x 38.00mm) | download | 460-SOMIMX8MMQ-11-1BE4SMIR | 1 | ARM® Cortex™-A53, ARM® Cortex™-M4 | 1.8GHz, 400MHz | 4GB | - | MCU Core | - | USB | |||||
|
TE0820-05-4DE21MA | 655.2000 | |
7365 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4DE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E | Pin(s) | |||||
|
TE0820-05-3BE21ML | 534.4500 | |
8388 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3BE21ML | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E | Pin(s) | |||||
|
ME-XU7-9EG-2I-D12E-R4 | - | |
4127 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Obsolete | -40°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | OBSOLETE | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 533MHz, 1.333GHz | 4GB | 16GB | FPGA | - | 168 Pin | |||||
|
ME-XU9-4CG-1E-D11E-R2.1 | - | |
6101 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Active | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | download | 2879-ME-XU9-4CG-1E-D11E-R2.1 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 533MHz, 1.333GHz | 4GB | 16GB | FPGA | - | 168 Pin | |||||
|
ME-XU1-6CG-1E-D11E-G1-R4.1 | - | |
7098 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Obsolete | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | - | OBSOLETE | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | FPGA | - | 168 Pin | |||||
|
ME-XU1-6EG-1I-D11E-R4.2 | - | |
2660 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Active | -40°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | download | 2879-ME-XU1-6EG-1I-D11E-R4.2 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | MPU, FPGA Core | - | 168 Pin | |||||
|
ME-XU1-6CG-1E-D11E-G1-R4.2 | - | |
6726 | 0.00000000 | Enclustra FPGA Solutions | - | Bulk | Active | 0°C ~ 85°C | 2.910" L x 2.130" W (74.00mm x 54.00mm) | download | 2879-ME-XU1-6CG-1E-D11E-G1-R4.2 | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | 600MHz, 1.5GHz | 4GB | 16GB | FPGA | - | 168 Pin | |||||
 |
TE0813-01-4BE11-A | 560.7000 | |
6586 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0813-01-4BE11-A | EAR99 | 8538.90.8180 | 1 | Xilinx Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | |
|
TE0741-04-A2C-1-A | 450.4500 | |
9180 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
|
TE0741-04-B2C-1-AF | 880.9600 | |
4316 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
|
S00014 | - | |
8803 | 0.00000000 | Trenz Electronic GmbH | * | Box | Obsolete | - | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 | |||||||||||
|
TE0821-01-3BI21MA | 611.0000 | |
5570 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BI21MA | 1 | Zynq™ UltraScale+™ XCZU3EG-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 160 Pin | |||
|
TE0820-05-4DE81MA | 622.0000 | |
6570 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4DE81MA | 1 | ||||||||||||
|
TE0715-05-51I33-L | 358.0000 | |
3263 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-51I33-L | 1 | Zynq™ 7015 XC7Z015-1CLG485I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||
|
TE0813-01-3AE11-A | 447.9600 | |
8335 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||
|
TE0820-05-2BE81ML | 414.0000 | |
3489 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81ML | 1 | ||||||||||||
|
AM0010-02-4DE21MA | 673.0000 | |
8421 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-4DE21MA | 1 | Zynq™ UltraScale+™ ZU4EV | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||
|
TE0821-01-2AE31PA | 493.0000 | |
3541 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-2AE31PA | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 4GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||
|
TE0865-02-FBE23MA | 4.0000 | |
2302 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-FBE23MA | 1 | Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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