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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
517-83-401-19-101111 Preci-Dip 517-83-401-19-101111 27.3976
RFQ
ECAD 2711 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 401 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
546-87-223-18-091136 Preci-Dip 546-87-223-18-091136 20.1238
RFQ
ECAD 2936 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold Flash Tin - 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
0787251002 Molex 0787251002 -
RFQ
ECAD 4611 0.00000000 Molex * Bulk Obsolete 078725 - 1 (Unlimited) 2,100
NTE435K64 NTE Electronics, Inc NTE435K64 1.9300
RFQ
ECAD 150 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing - Solder download ROHS3 Compliant 2368-NTE435K64 EAR99 8535.90.8040 1 - - - - - - 64 (2 x 32) - 0.070" (1.78mm) - 0.130" (3.30mm) -
116-41-648-41-007000 Mill-Max Manufacturing Corp. 116-41-648-41-007000 17.1164
RFQ
ECAD 6768 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm
510-93-153-15-061001 Mill-Max Manufacturing Corp. 510-93-153-15-061001 33.4088
RFQ
ECAD 7179 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 153 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
517-87-475-21-121111 Preci-Dip 517-87-475-21-121111 21.9653
RFQ
ECAD 8381 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 475 (21 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
515-91-084-11-041003 Mill-Max Manufacturing Corp. 515-91-084-11-041003 -
RFQ
ECAD 8990 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 84 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
514-87-456M26-001148 Preci-Dip 514-87-456M26-001148 42.7864
RFQ
ECAD 9930 0.00000000 Preci-Dip 514 Bulk Active -55°C ~ 125°C Surface Mount BGA Open Frame 514-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 456 (26 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.055" (1.40mm) 10mOhm
510-87-196-14-000101 Preci-Dip 510-87-196-14-000101 6.4837
RFQ
ECAD 6362 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 196 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
28-6554-16 Aries Electronics 28-6554-16 52.7978
RFQ
ECAD 9560 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6554 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected Q3458807 EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
115-43-640-41-003000 Mill-Max Manufacturing Corp. 115-43-640-41-003000 5.1800
RFQ
ECAD 605 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
511-41-132-14-071001 Mill-Max Manufacturing Corp. 511-41-132-14-071001 -
RFQ
ECAD 6685 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 132 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
523-13-145-15-081001 Mill-Max Manufacturing Corp. 523-13-145-15-081001 -
RFQ
ECAD 4784 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 145 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) -
44-3575-16 Aries Electronics 44-3575-16 58.6350
RFQ
ECAD 9402 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 44-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
110-83-320-41-001151 Preci-Dip 110-83-320-41-001151 1.1392
RFQ
ECAD 8064 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame, No Center Bar 110-83 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
28-3508-302 Aries Electronics 28-3508-302 13.3458
RFQ
ECAD 5707 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 28-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
510-87-124-13-041101 Preci-Dip 510-87-124-13-041101 4.2262
RFQ
ECAD 1018 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 124 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APO-640-T-C Samtec Inc. APO-640-T-C 11.4200
RFQ
ECAD 8127 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-640-T-C 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICA-640-ZSTT Samtec Inc. ICA-640-ZSTT 5.5027
RFQ
ECAD 7748 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-640-ZSTT 11 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
111-47-316-41-001000 Mill-Max Manufacturing Corp. 111-47-316-41-001000 1.6800
RFQ
ECAD 140 0.00000000 Mill-Max Manufacturing Corp. 111 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 111-47 Solder download ROHS3 Compliant Not Applicable REACH Unaffected ED11106 EAR99 8536.69.4040 25 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
APO-316-G-A1 Samtec Inc. APO-316-G-A1 8.5500
RFQ
ECAD 5263 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-316-G-A1 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICO-308-ATT Samtec Inc. ICO-308-ATT 2.7361
RFQ
ECAD 4833 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-308-ATT 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICO-422-MTT Samtec Inc. ICO-422-MTT 3.7600
RFQ
ECAD 5608 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 105°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-422-MTT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-316-WTT-2 Samtec Inc. ICA-316-WTT-2 3.4311
RFQ
ECAD 4724 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-316-WTT-2 28 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
APA-628-G-A1 Samtec Inc. APA-628-G-A1 14.3100
RFQ
ECAD 3008 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-628 Solder download ROHS3 Compliant Not Applicable REACH Affected EAR99 8536.69.4040 15 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICF-316-T-I Samtec Inc. ICF-316-T-I 2.4321
RFQ
ECAD 9290 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-316-T-I 28 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICA-648-ZWGG-3 Samtec Inc. ICA-648-ZWGG-3 24.1222
RFQ
ECAD 4985 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-648-ZWGG-3 9 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
123-87-648-41-001101 Preci-Dip 123-87-648-41-001101 5.5996
RFQ
ECAD 9356 0.00000000 Preci-Dip 123 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 123-87 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.510" (12.95mm) 10mOhm
02-7420-10 Aries Electronics 02-7420-10 4.3632
RFQ
ECAD 5201 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 02-7420 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 2 (1 x 2) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse