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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
ICA-422-SGT Samtec Inc. ICA-422-SGT 5.1355
RFQ
ECAD 6187 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-422-SGT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
117-43-648-41-005000 Mill-Max Manufacturing Corp. 117-43-648-41-005000 6.8009
RFQ
ECAD 5401 0.00000000 Mill-Max Manufacturing Corp. 117 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) -
ICF-320-F-O Samtec Inc. ICF-320-F-O 4.6773
RFQ
ECAD 2212 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-320-F-O 22 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 3.00µin (0.076µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
515-13-153-15-061002 Mill-Max Manufacturing Corp. 515-13-153-15-061002 -
RFQ
ECAD 2629 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 153 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
ICF-308-SM-I Samtec Inc. ICF-308-SM-I -
RFQ
ECAD 9318 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-308-SM-I 56 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold - Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
110-87-314-10-002101 Preci-Dip 110-87-314-10-002101 0.6520
RFQ
ECAD 6881 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 29 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 14 (2 x 7), 8 Loaded Beryllium Copper 0.100" (2.54mm) Brass - 10mOhm
34-3503-21 Aries Electronics 34-3503-21 23.8722
RFQ
ECAD 8150 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 34-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
APA-316-T-J Samtec Inc. APA-316-T-J 2.5511
RFQ
ECAD 5138 0.00000000 Samtec Inc. APA Tube Active - Through Hole - Open Frame APA-316 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 27 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
0475960333 Molex 0475960333 -
RFQ
ECAD 9171 0.00000000 Molex * Bulk Obsolete 047596 - 1 (Unlimited) 240
APO-640-T-R Samtec Inc. APO-640-T-R 14.2700
RFQ
ECAD 2138 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-640-T-R 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICF-322-S-I Samtec Inc. ICF-322-S-I 7.5395
RFQ
ECAD 9559 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-322-S-I 20 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
523-93-121-13-061001 Mill-Max Manufacturing Corp. 523-93-121-13-061001 -
RFQ
ECAD 6121 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 121 (13 x 13) - 0.100" (2.54mm) - 0.510" (12.95mm) -
ICA-624-WGG-3 Samtec Inc. ICA-624-WGG-3 11.9744
RFQ
ECAD 8632 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-624-WGG-3 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
AW 127-64/Z-T Assmann WSW Components AW 127-64/Z-T 0.9739
RFQ
ECAD 9204 0.00000000 Assmann WSW Components * Bulk Active - 100
100-008-050 3M 100-008-050 -
RFQ
ECAD 1441 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 100-008 Solder download 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
ICF-624-TL-O Samtec Inc. ICF-624-TL-O 4.6500
RFQ
ECAD 3950 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-624-TL-O 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
PRT-07938 SparkFun Electronics PRT-07938 0.5000
RFQ
ECAD 1176 0.00000000 SparkFun Electronics - Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder - ROHS3 Compliant 1 (Unlimited) 1568-PRT-07938 1 - - - - - - - 16 (2 x 8) - - - - -
AW 122-15/G-T Assmann WSW Components AW 122-15/G-T -
RFQ
ECAD 4937 0.00000000 Assmann WSW Components * Bulk Active - 16
ICA-422-ZSGT Samtec Inc. ICA-422-ZSGT 5.5230
RFQ
ECAD 3565 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-422-ZSGT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICF-316-F-O Samtec Inc. ICF-316-F-O 3.5614
RFQ
ECAD 4349 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-316-F-O 28 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 3.00µin (0.076µm) Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
347843-5 TE Connectivity AMP Connectors 347843-5 -
RFQ
ECAD 2394 0.00000000 TE Connectivity AMP Connectors - Bulk Obsolete - Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing - 347843 Solder - RoHS non-compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 41 - - 0.100" (2.54mm) Tin-Lead - Tin-Lead - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.126" (3.20mm) 30mOhm
ICO-322-ZSGT Samtec Inc. ICO-322-ZSGT 5.5230
RFQ
ECAD 9861 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-322-ZSGT 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
14-7750-10 Aries Electronics 14-7750-10 10.7988
RFQ
ECAD 9971 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 14-7750 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
40-6573-16 Aries Electronics 40-6573-16 47.0314
RFQ
ECAD 8867 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 40-6573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
1-1825410-1 TE Connectivity AMP Connectors 1-1825410-1 -
RFQ
ECAD 3246 0.00000000 TE Connectivity AMP Connectors Diplomate DL Tray Obsolete -55°C ~ 125°C Through Hole SIP Closed Frame 1825410 Solder - Not applicable 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 800 Thermoplastic, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) 30mOhm
518-77-192M16-001106 Preci-Dip 518-77-192M16-001106 27.0175
RFQ
ECAD 1765 0.00000000 Preci-Dip 518 Bulk Active -55°C ~ 125°C Surface Mount PGA Open Frame 518-77 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 24 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold Flash Gold Flash 192 (16 x 16) Beryllium Copper 0.050" (1.27mm) Brass 0.062" (1.57mm) 10mOhm
517-83-428-19-101111 Preci-Dip 517-83-428-19-101111 29.2421
RFQ
ECAD 7905 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 428 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
523-93-145-15-081003 Mill-Max Manufacturing Corp. 523-93-145-15-081003 -
RFQ
ECAD 6642 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 145 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) -
510-87-240-17-061101 Preci-Dip 510-87-240-17-061101 7.9394
RFQ
ECAD 4124 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 240 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
517-87-447-20-121111 Preci-Dip 517-87-447-20-121111 20.6704
RFQ
ECAD 3033 0.00000000 Preci-Dip 517 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 517-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 447 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse