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Sockets for ICs, Transistors(23296)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
36-6574-11 | 27.5047 |  |
2807 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
36-6575-10 | 16.1088 | |
4327 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
36-6575-11 | 27.5047 | |
3564 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
36-6575-16 | 48.8311 | |
1833 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 36-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-3571-10 | 19.3073 | |
3324 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-3571-11 | 31.5623 | |
1171 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-3571-16 | 55.9738 | |
1787 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |
|
42-3573-11 | 31.5623 | |
2681 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3573 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-3574-10 | 19.3073 | |
7318 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-3575-11 | 31.5623 | |
5199 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-3575-16 | 55.9738 | |
5009 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 42-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-6570-10 | 19.3073 | |
2518 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-6570-11 | 31.5623 | |
4163 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-6570-16 | 55.9738 | |
5300 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |
|
42-6571-10 | 19.3073 | |
6606 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-6571-16 | 55.9738 | |
9679 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 42 (2 x 21) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |
|
42-6573-10 | 19.3073 | |
7899 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6573 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-6574-11 | 31.5623 | |
4393 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
42-6575-11 | 31.5623 | |
9740 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 42-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
44-3570-16 | 58.6350 | |
2457 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3570 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |
|
44-3571-10 | 20.1743 | |
2491 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3571 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
44-3572-16 | 58.6350 | |
7341 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3572 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Nickel Boron | 50.0µin (1.27µm) | 44 (2 x 22) | Beryllium Nickel | 0.100" (2.54mm) | Beryllium Nickel | 0.110" (2.78mm) | - | |
|
44-3575-16 | 58.6350 | |
9402 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 44-3575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
44-6572-10 | 20.1743 | |
9982 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6572 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
44-6572-16 | 58.6350 | |
1305 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6572 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
44-6574-11 | 32.6262 | |
8747 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6574 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
44-6575-11 | 32.6262 | |
1028 | 0.00000000 | Aries Electronics | 57 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Closed Frame | 44-6575 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | |
|
10-6511-11 | 7.0255 | |
1334 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 10-6511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 40 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 10 (2 x 5) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |
|
16-6511-10 | 3.7976 | |
4162 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 16-6511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 30 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 200.0µin (5.08µm) | 16 (2 x 8) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | |
|
18-6511-11 | 9.2900 | |
6538 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 18-6511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 25 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 18 (2 x 9) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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