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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0841-02-0401IL | - |  |
1240 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-0401IL | OBSOLETE | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | |||
|
TEC0850-03-15EG1EA | - | |
5548 | 0.00000000 | Trenz Electronic GmbH | TEC0850 | Bulk | Obsolete | - | - | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-15EG1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | ||
|
TE0841-02-31C21-A | - | |
4458 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-31C21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | |
|
TE0745-02-30-1IA-K | - | |
2648 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-30-1IA-K | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | |||
|
TE0745-02-93E11-A | - | |
1808 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-93E11-A | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec ST5 | ||
|
TE0808-04-06EG-1EK | - | |
8455 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-06EG-1EK | OBSOLETE | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0808-04-15-1EE-S | - | |
4780 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-15-1EE-S | OBSOLETE | 1 | - | - | - | - | MPU Core | - | - | |||
|
TE0820-04-2BE21FL | - | |
4097 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
TE0820-04-3BE21FA | - | |
1155 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3BE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
TE0820-04-3BE21FL | - | |
4697 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3BE21FL | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |
|
TE0807-03-4AI21-A | 1.0000 | |
1594 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4AI21-A | 1 | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0807-03-7DI21-A | 2.0000 | |
2823 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
S00021-02 | - | |
8204 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00021-02 | 1 | |||||||||||||
|
TE0745-02-91C31-A | 2.0000 | |
8509 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-91C31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
TE0745-02-71I31-AZ | 597.4500 | |
8559 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 160 | |||
|
TE0745-02-81C31-AK | - | |
3037 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | ||||
|
S00005-02 | - | |
5503 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00005-02 | 1 | |||||||||||||
|
TE0745-02-81C11-AK | - | |
7747 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C11-AK | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||
|
TE0803-04-3AE11-A | 455.7000 | |
3521 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0803-04-4AE11-A | 518.7000 | |
6135 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4AE11-A | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0803-04-5DI21-A | 1.0000 | |
7358 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DI21-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0720-03-S003C1 | - | |
5124 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S003C1 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
TE0720-03-S002 | - | |
2053 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-S002 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
 |
TE0720-03-62I33MA | - | |
2325 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||
 |
TE0720-03-61Q33ML | - | |
7953 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33ML | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0720-03-S001C1 | - | |
6163 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-S001C1 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
TE0820-04-50121FA | - | |
6439 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-50121FA | OBSOLETE | 1 | - | - | - | - | - | - | ||||
|
TE0820-04-SDR21FA | - | |
5988 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-SDR21FA | OBSOLETE | 1 | - | - | - | - | - | - | ||||
|
TE0820-04-2BI21FL | - | |
2017 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
TE0820-04-2BI21M | - | |
8169 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21M | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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