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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0720-03-S008C1 | - |  |
5491 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S008C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0745-02-92I31-B | - | |
9269 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-B | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0808-05-9BE21-A | 1.0000 | |
9776 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-TE0808-05-9BE21-A | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0820-04-4AE21FA | - | |
7763 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0807-03-7AI21-A | 2.0000 | |
5374 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7AI21-A | 1 | Zynq UltraScale+ XCZU7CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0710-02-72I21-A | 368.7000 | |
43 | 0.00000000 | Trenz Electronic GmbH | TE0710 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0710 | download | ROHS3 Compliant | Not Applicable | 1686-TE0710-02-72I21-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 100MHz | 512MB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0808-05-9BE21-L | 1.0000 | |
5039 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE21-L | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
 |
TE0890-01-25-1C | - | |
4614 | 0.00000000 | Trenz Electronic GmbH | TE0890 | Box | Obsolete | 0°C ~ 70°C | 1.060" L x 2.050" W (27.00mm x 52.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0890-01-25-1C | EAR99 | 8471.50.0150 | 1 | Xilinx Spartan-7 XC7S25 | 100MHz | 64Mbit | 64Mbit | FPGA Core | - | Dual-pinout DIP-40 or 50mil 80 pin connector | |||
 |
TE0726-03M | - | |
1025 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | TE0726 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1021 | 3A991D | 8471.50.0150 | 1 | - | 667MHz | 512MB | 16MB | FPGA Core | Zynq-7000 (Z-7010) | CSI, DSI | |
|
TE0720-04-61Q33MA | 345.4500 | |
1343 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33MA | EAR99 | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
|
TE0741-04-B2I-1-A | 823.2100 | |
3360 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0713-02-72C46-A | 387.4500 | |
9431 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0713-02-72C46-A | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A100T-2FGG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | |||
|
TE0820-05-2BI81ML | 459.0000 | |
3508 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81ML | 1 | ||||||||||||||
 |
TE0726-03IM | - | |
4926 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03IM | OBSOLETE | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | ||||
|
TE0813-01-2BE11-A | 414.2800 | |
9288 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-2BE11-A | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TEC0850-03-BBEX1-A | - | |
4029 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-BBEX1-A | 1 | |||||||||||||
 |
TE0745-02-71I11-A | - | |
2876 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-71I11-A | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | ||
 |
TE0729-02-2IF | - | |
6097 | 0.00000000 | Trenz Electronic GmbH | TE0729 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0729 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1022 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec BTE | ||
|
TE0808-05-BBE81-AK | 1.0000 | |
8978 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE81-AK | 1 | ||||||||||||||
|
TE0808-04-9BE21-AK | - | |
2285 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9BE21-AK | OBSOLETE | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
TE0807-03-5AI21-A | 1.0000 | |
6420 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | - | - | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-5AI21-A | 1 | - | - | - | - | - | - | - | ||||
 |
TE0720-03-62I33MAN | - | |
9415 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MAN | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
 |
TE0745-01-30-1I | - | |
5023 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1007 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | ||||
 |
TE0713-02-200-2C | - | |
8619 | 0.00000000 | Trenz Electronic GmbH | TE0713 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | TE0713 | download | ROHS3 Compliant | Not Applicable | 1686-1167 | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A200T-2FBG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | ||
|
TE0823-01-3PIU1F | - | |
9424 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1F | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
|
TE0745-02-92I11-A | - | |
5380 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Obsolete | - | - | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-92I11-A | 3A991D | 8471.50.0150 | 1 | - | - | - | - | - | - | |||
 |
TE0715-04-21C33-A | - | |
2633 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-21C33-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7012S) | Samtec LSHM | |||
 |
TE0600-02IVFN | - | |
3496 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||||
|
TE0808-04-15EG-1EK | - | |
8526 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-15EG-1EK | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0745-02-72I31-A | 781.2100 | |
3987 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-72I31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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