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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0725-02-15-1C | - |  |
9415 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A15T | 100MHz | - | 32MB | FPGA Core | - | 50 Pin | ||||
 |
TE0808-04-BBE21-A | 1.0000 | |
4526 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0723-03 | 138.6000 | |
4116 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Box | Active | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | B2B | |||
 |
TE0715-04-15-1I3 | - | |
7187 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0715 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | ||
 |
TE0841-01-035-1I | - | |
2094 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
 |
TE0713-02-100-2C | - | |
1858 | 0.00000000 | Trenz Electronic GmbH | TE0713 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | TE0713 | download | Not Applicable | 1686-1166 | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A100T-2FGG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | |||
|
TE0820-05-2BE21MA | 455.7000 | |
6454 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BE21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E | Pin(s) | |||||||
|
TE0820-05-2AI21MA | 455.7000 | |
7712 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-TE0820-05-2AI21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784I | Pin(s) | ||||||
|
TE0820-05-2BI81MA | 459.0000 | |
3339 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81MA | 1 | ||||||||||||||
|
TE0720-04-61C33MA | 279.0000 | |
2903 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C33MA | 1 | Zynq™ XC7Z020-1CLG484C | - | 8GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0813-01-3AE11-A | 447.9600 | |
8335 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0817-01-7DI21-A | 2.0000 | |
6465 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
AM0010-02-5DE21MA | 1.0000 | |
1842 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DE21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0720-03-2IFA | - | |
8521 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-2IFA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||
|
TE0720-03-61C33FA | - | |
6388 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61C33FA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
|
TE0803-04-3AE11-A | 455.7000 | |
3521 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0745-02-81C31-AK | - | |
3037 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0820-04-2BI21M | - | |
8169 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21M | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||||
|
TE0720-03-S001C1 | - | |
6163 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-S001C1 | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
|
TE0741-04-A2C-1-A | 450.4500 | |
9180 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
S00014 | - | |
8803 | 0.00000000 | Trenz Electronic GmbH | * | Box | Obsolete | - | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 | |||||||||||||
|
TE0841-02-0401IL | - | |
1240 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-0401IL | OBSOLETE | 1 | Kintex UltraScale KU40 | - | 2GB | 64MB | MCU, FPGA | - | B2B | ||||
|
TE0803-03-5DI21-A | - | |
5090 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Obsolete | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-5DI21-A | OBSOLETE | 1 | ||||||||||||
|
TE0712-03-42I36-A | 256.2000 | |
6598 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-42I36-A | 1 | Artix-7 XC7A35T-2FGG484I | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
|
TE0720-04-31C33MA | 303.4500 | |
4909 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-31C33MA | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 766MHz | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
|
TE0820-03-2BE21FA | - | |
4555 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Obsolete | download | 1 (Unlimited) | 1686-TE0820-03-2BE21FA | OBSOLETE | 1 | ||||||||||||||
|
TE0803-03-2AE11-A | - | |
3216 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
TE0841-02-31C21-A | - | |
4458 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0841 | download | ROHS3 Compliant | Not Applicable | 1686-TE0841-02-31C21-A | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | ||
|
TE0808-04-06EG-1EE | - | |
3972 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1157 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0821-01-3BI21MA | 611.0000 | |
5570 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BI21MA | 1 | Zynq™ UltraScale+™ XCZU3EG-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 160 Pin |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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