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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0715-05-71I33-A | 560.7000 |  |
6185 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 1686-TE0715-05-71I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||||||
 |
TE0741-04-D2I-1-A | 1.0000 | |
7774 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0725LP-01-72C-1 | 177.4500 | |
1362 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0725LP-01-72C-1 | 1 | Artix-7 A100T | 25MHz | - | 64MB | FPGA Core | - | 50 Pin | ||||
|
TE0720-03-31C33FA | - | |
4170 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-31C33FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7014S) | Samtec LSHM | ||||
|
TE0803-04-4DE21-L | 676.2000 | |
2188 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4DE21-L | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 4GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0820-04-4DE21FA | - | |
6580 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4DE21FA | 3A991A2 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
TE0808-04-9GI21-AS | - | |
6073 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | Not Applicable | 1686-TE0808-04-9GI21-AS | OBSOLETE | 1 | Zynq UltraScale+ ZU9 | - | 4GB | 128MB | FPGA Core | - | B2B | |||
|
TE0782-02-A2I33MA | 2.0000 | |
5666 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-A2I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket | ||||||
 |
TE0741-02-160-2IF | - | |
9256 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0600-02IVF | - | |
3182 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1010 | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||
|
TEC0117-01 | 37.0200 | |
8398 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TEC0117-01 | 1 | ||||||||||||||
 |
TE0714-01-35-2I | - | |
4064 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1006 | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | - | 16MB | FPGA Core | - | Samtec LSHM | ||||
|
TE0741-04-D2C-1-A | 964.9600 | |
6118 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0715-04-51I33-AN | - | |
4994 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-51I33-AN | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||
|
TE0820-04-2AE21FA | - | |
4040 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0745-01-35-1C | - | |
4515 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec UFPS | |||||
|
TE0715-04-73E33-A | - | |
5256 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-73E33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||||
|
TE0841-02-035-1I | - | |
9135 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | |||||
|
TE0745-02-30-2I | - | |
2460 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | B2B | |||||
|
TE0720-03-61Q33FAG | - | |
3857 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-61Q33FAG | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
 |
TE0300-01IBMLP | 167.0000 | |
2740 | 0.00000000 | Trenz Electronic GmbH | TE0300 | Bulk | Not For New Designs | 0°C ~ 70°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0300 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3E | 100MHz | 64MB | 4MB | FPGA, USB Core | Cypress FX2 USB 2.0 | B2B | |||
|
TE0720-03-61Q33FAE | - | |
7751 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FAE | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
 |
TE0745-02-35-1C | - | |
4894 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | REACH Unaffected | 1686-1068 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec UFPS | ||||
 |
TE0600-03IN | - | |
3957 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||
|
TE0741-02-325-2CF | - | |
3843 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 325T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0712-02-100-2C3 | - | |
5519 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0808-04-09EG-1EE | - | |
9719 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0720-04-62I33NA | 382.2000 | |
2748 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33NA | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
|
TEC0850-03-BBEX1-C | - | |
1347 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-BBEX1-C | 1 | |||||||||||||
|
TE0803-02-04EG-1ID | - | |
6788 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-04EG-1ID | OBSOLETE | 1 | - | - | - | - | MPU Core | - | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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