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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0745-02-93E11-KA | - |  |
8013 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-93E11-KA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
 |
TE0820-02-03EG-1EA | - | |
6471 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 1GB | 128MB | MPU Core | - | B2B | |||||
|
AM0010-02-5DI21MA | 1.0000 | |
7444 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DI21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0820-04-4B121PL | - | |
2042 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4B121PL | 1 | - | - | - | - | - | - | ||||||
|
TE0745-02-93E31-A | 2.0000 | |
9075 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-93E31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0720-03-62I12GA | - | |
3757 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I12GA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||
|
TE0820-05-2BE81MA | 426.0000 | |
3844 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81MA | 1 | ||||||||||||||
|
TE0745-02-92I31-AK | 1.0000 | |
8083 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0783-02-92I33MA | 2.0000 | |
8541 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | ROHS3 Compliant | 1686-TE0783-02-92I33MA | 1 | Zynq™ 7000 XC7Z045-2FFG900I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||||
|
TE0741-03-410-2IF | - | |
2508 | 0.00000000 | Trenz Electronic GmbH | - | Box | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-03-410-2IF | OBSOLETE | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
TE0821-01-3BE21MA | 527.0000 | |
5971 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BE21MA | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
 |
TE0723-03 | 138.6000 | |
4116 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Box | Active | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | B2B | |||
 |
TE0841-01-035-1C | - | |
3830 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0715-05-52I33-A | 419.0000 | |
2425 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-52I33-A | 1 | Zynq™ 7015 XC7Z015-2CLG485I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0813-01-3BE11-A | 520.9300 | |
3537 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
 |
TE0715-04-51I33-A | - | |
7498 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-51I33-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||
|
TE0820-04-4AI21FL | - | |
4245 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0803-02-03-1EA-S | - | |
6819 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-03-1EA-S | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | B2B | |||||
 |
TE0711-01-100-2I | 256.2000 | |
4269 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0711 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1011 | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 100MHz | - | 32MB | FPGA Core | - | Samtec LSHM | |
|
TE0782-02-82I33FA | - | |
7041 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-82I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||
 |
TE0808-04-15EG-1EE | - | |
6581 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0741-02-160-2C1 | - | |
8535 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0600-02B | - | |
8866 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||||
|
TE0720-03-1QFA-V1 | - | |
6832 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-1QFA-V1 | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0724-04-61I32-A | 257.1000 | |
8674 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | -40°C ~ 85°C | 2.362" L x 1.575" W (60.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0724-04-61I32-A | 1 | Zynq™ XC7Z020-1CLG400I | 667MHz | 1GB | 32MB | MPU Core | ARM Cortex-A9 | 1 x 160 Pin | |||||
|
TE0720-03-S004 | - | |
4663 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S004 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
|
TE0715-04-51I33-L | - | |
9509 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-51I33-L | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||||
|
TE0782-02-A2I33FA | - | |
2861 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-A2I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0714-03-35-2I3 | - | |
9734 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Last Time Buy | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | - | 1686-TE0714-03-35-2I3 | 1 | Artix-7 A35T | - | - | 16MB | FPGA | Artix-7 | - | |||||||
 |
TE0600-02IMVF | - | |
8750 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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