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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0783-02-92I33MA | 2.0000 |  |
8541 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | ROHS3 Compliant | 1686-TE0783-02-92I33MA | 1 | Zynq™ 7000 XC7Z045-2FFG900I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0803-04-3AE11-AK | 476.0000 | |
7348 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-AK | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | ||||
|
TE0808-05-6BE21-A | 1.0000 | |
1068 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-A | 1 | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | ||||
|
TE0865-02-DGE23MA | 5.0000 | |
1218 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-DGE23MA | 1 | Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | ||||
|
TE0817-01-7DE21-A | 1.0000 | |
4119 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | ||||
|
TE0725LP-01-72I-1T | 212.1900 | |
3317 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | -40°C ~ 85°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0725LP-01-72I-1T | 1 | Artix™ 7 XC7A100T-2CSG324I | 25MHz | - | 64MB | FPGA | - | 2 x 50 Pin | ||||
|
TE0820-05-5DI21MA | 1.0000 | |
4868 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-5DI21MA | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | ||||
|
AM0010-02-5DI21MA | 1.0000 | |
7444 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DI21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | ||||
|
TE0820-05-2AI81MA | 414.0000 | |
7931 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2AI81MA | 1 | |||||||||||||
|
TE0745-02-93E31-AK | 2.0000 | |
5313 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | 1686-TE0745-02-93E31-AK | 1 | Zynq™ 7045 SoC XC7Z045-3FFG676E | - | 1GB | 64MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0813-01-3BE11-A | 520.9300 | |
3537 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | ||||
|
TE0808-05-9GI81-AK | 1.0000 | |
9045 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI81-AK | 1 | |||||||||||||
|
TE0716-01-61C32-A | 313.0000 | |
1239 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 70°C | 2.559" L x 1.772" W (65.00mm x 45.00mm) | - | ROHS3 Compliant | 1686-TE0716-01-61C32-A | 1 | Zynq™ 7000 SoC XC7Z020 | - | 1GB | 32MB | FPGA | - | Board-to-Board (BTB) Socket, USB | |||||
|
TE0821-01-3BE21MA | 527.0000 | |
5971 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BE21MA | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | ||||
|
TE0818-01-9GI21-AK | 1.0000 | |
9517 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | 1686-TE0818-01-9GI21-AK | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0727-02-41C34 | 105.5300 | |
3714 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 2.559" L x 1.181" W (65.00mm x 30.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0727-02-41C34 | 1 | Zynq™ XC7Z010-1CLG225C | - | 512MB | 16MB | FPGA | - | USB | ||||
|
TE0715-05-52I33-A | 419.0000 | |
2425 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-52I33-A | 1 | Zynq™ 7015 XC7Z015-2CLG485I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||
|
TE0808-05-BBE81-AK | 1.0000 | |
8978 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE81-AK | 1 | |||||||||||||
|
TE0808-04-9GI21-A | - | |
1287 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9GI21-A | 5A002A TRE | 8473.30.1180 | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | B2B | |
|
TE0808-04-9GI21-AS | - | |
6073 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | Not Applicable | 1686-TE0808-04-9GI21-AS | OBSOLETE | 1 | Zynq UltraScale+ ZU9 | - | 4GB | 128MB | FPGA Core | - | B2B | ||
|
TE0745-02-92I11-A | - | |
5380 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Obsolete | - | - | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-92I11-A | 3A991D | 8471.50.0150 | 1 | - | - | - | - | - | - | ||
|
TE0808-04-BBE21-A | 1.0000 | |
4526 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0745-02-91C11-A | - | |
6331 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-91C11-A | OBSOLETE | 1 | Xilinx Zynq XC7Z045-1FBG676C | - | 1GB | 64MB | MPU Core | - | Samtec ST5 | ||
|
TE0745-02-72I11-A | - | |
3375 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-72I11-A | 3A991D | 8471.50.0150 | 1 | Xilinx Zynq XC7Z030-2FBG676I | - | 1GB | 64MB | MPU Core | - | Samtec ST5 | |
|
TE0808-04-06EG-1E3 | - | |
7858 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-06EG-1E3 | OBSOLETE | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0808-04-15EG-1EK | - | |
8526 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-15EG-1EK | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0808-04-BBE21-AK | 1.0000 | |
1976 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-BBE21-AK | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0808-04-09EG-1EK | - | |
8697 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-09EG-1EK | OBSOLETE | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | |||
 |
TE0745-02-45-2IA | - | |
4776 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-1110 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||
|
TE0745-02-30-2I | - | |
2460 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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