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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
S00005 | - |  |
5633 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Obsolete | - | ROHS3 Compliant | Not Applicable | 1686-S00005 | OBSOLETE | 1 | ||||||||||||
|
TE0745-02-93E11-KA | - | |
8013 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-93E11-KA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||
|
TE0782-02-82I33FA | - | |
7041 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-82I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | ||||
|
TE0782-02-92I33FH | - | |
3704 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-92I33FH | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
TE0729-02-2IRA | - | |
1815 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-2IRA | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||
 |
TE0720-03-61Q33MA | - | |
7595 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||
|
TE0720-03-S007C1 | - | |
2532 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S007C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
 |
TE0720-03-62I33MAN | - | |
9415 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33MAN | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0720-03-S005 | - | |
2196 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S005 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
TE0720-03-61Q33FAG | - | |
3857 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-61Q33FAG | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
TE0720-03-S004 | - | |
4663 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S004 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | ||||
|
TE0729-02-62I65MM | - | |
7841 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | download | ROHS3 Compliant | Not Applicable | 1686-TE0729-02-62I65MM | 1 | |||||||||||||
|
TE0729-02-62I63MAK | 355.9500 | |
5831 | 0.00000000 | Trenz Electronic GmbH | TE0729 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0729-02-62I63MAK | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||
|
TE0820-04-40121FA | - | |
1680 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-40121FA | OBSOLETE | 1 | - | - | - | - | - | - | ||||
|
TE0820-04-4AI21FL | - | |
4245 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
TE0820-04-2BI21FA | - | |
2168 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||
|
TE0820-04-4B121PL | - | |
2042 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4B121PL | 1 | - | - | - | - | - | - | |||||
|
TE0782-02-92I33MA | 2.0000 | |
1866 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-92I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket | |||||
|
TE0823-01-3PIU1F | - | |
9424 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1F | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | |||||
|
TE0823-01-3PIU1ML | 688.0000 | |
2508 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1ML | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
|
TE0808-05-9BE21-A | 1.0000 | |
9776 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-TE0808-05-9BE21-A | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | |||
|
TE0741-04-B2I-1-A | 823.2100 | |
3360 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
|
TE0741-03-410-2IF | - | |
2508 | 0.00000000 | Trenz Electronic GmbH | - | Box | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-03-410-2IF | OBSOLETE | 1 | Xilinx Kintex-7 FPGA XC7K410T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||
|
TE0741-04-D2C-1-A | 964.9600 | |
6118 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||
 |
TE0715-05-71I33-A | 560.7000 | |
6185 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 1686-TE0715-05-71I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||||||
|
TE0820-05-2AE21MA | 408.4500 | |
5384 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | Pin(s) | ||||||
|
TE0820-05-2BE21MAJ | - | |
3829 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BE21MAJ | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E | Pin(s) | ||||||
|
TE0820-05-4AI21MI | - | |
5669 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | 1686-TE0820-05-4AI21MI | 1 | - | - | 2GB | 128MB | MPU Core | - | - | ||||||
|
TE0820-05-2BI81ML | 459.0000 | |
3508 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81ML | 1 | |||||||||||||
|
TE0820-05-2BE81MA | 426.0000 | |
3844 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81MA | 1 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)