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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0630-01IBF | - |  |
1453 | 0.00000000 | Trenz Electronic GmbH | TE0630 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-75 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | ||||
 |
AM0010-02-4AE21MA | 549.0000 | |
1138 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-4AE21MA | 1 | Zynq™ UltraScale+™ ZU4CG-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0712-02-100-2C | - | |
7080 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0820-05-3AE21MA | 487.2000 | |
7268 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-3AE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU3CG-1SFVC784E | Pin(s) | |||||||
 |
TE0715-04-30-1C | - | |
8988 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0715 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||
 |
TE0745-01-45-1C | - | |
7141 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
 |
TE0803-01-02EG-1EA | - | |
1133 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | download | Not Applicable | 1686-1112 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0720-03-1CR | - | |
5898 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 256MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
|
TE0823-01-3PIU1FA | - | |
8145 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1FA | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
 |
TE0725LP-01-100-2L | - | |
3709 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Obsolete | - | 2.870" L x 1.380" W (73.00mm x 35.00mm) | download | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 25MHz | - | 32MB | FPGA Core | - | 50 Pin | |||||
|
TE0820-05-4DI81MA | 1.0000 | |
8431 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4DI81MA | 1 | ||||||||||||||
|
TE0820-05-2BI21MA | 497.7000 | |
7568 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BI21MA | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784I | Pin(s) | |||||||
 |
TE0803-01-03CG-1EA | - | |
1917 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-1113 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
 |
TE0720-03-1CFA | - | |
1030 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-1120 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||
 |
TE0722-02 | 98.7000 | |
3925 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 0.710" L x 2.010" W (18.00mm x 51.00mm) | TE0722 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1077 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 33MHz | - | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | 40 Pin | |
 |
TE0841-02-040-1I | - | |
7477 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-1116 | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU40 | - | 512MB | 32MB | FPGA Core | - | B2B | ||||
|
TE0820-03-02CG-1ED | - | |
2861 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1177 | 5A002A4 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0813-01-4AE11-A | 509.7100 | |
1532 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4AE11-A | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0729-02-62I65FM | - | |
1974 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I65FM | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
|
TE0817-01-4AI21-A | 1.0000 | |
8040 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-4AI21-A | 1 | Zynq UltraScale+ XCZU4CG-1FBVB900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0808-04-09EG-1EL | - | |
2300 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-09EG-1EL | OBSOLETE | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0820-04-2BE21FAJ | - | |
2106 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21FAJ | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0820-04-4BI21KL | - | |
6501 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4BI21KL | OBSOLETE | 1 | - | - | - | - | - | - | |||||
 |
TE0720-03-62I33ML | - | |
8195 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33ML | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
|
TE0808-05-9BE81-AK | 1.0000 | |
5635 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE81-AK | 1 | ||||||||||||||
|
TE0741-04-A2I-1-A | 502.9500 | |
4754 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0600-03-52I11-M | 208.9500 | |
9364 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-M | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||
|
TE0745-02-71I31-AK | 602.7000 | |
6636 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.130" W (76.00mm x 54.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-71I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0729-02-62I63FA | - | |
7335 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||
|
TE0808-04-6BE21-L | 1.0000 | |
2784 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-L | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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