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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0712-02-72C36-C | - |  |
5299 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-C | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0712-02-100-2C2 | - | |
2900 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-100-2C2 | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0729-02-62I63FA | - | |
7335 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FA | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||
|
TE0729-02-62I65FM | - | |
1974 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I65FM | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
|
TE0782-02-92I33FA | - | |
1971 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-92I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0782-02-045-2IC | - | |
7850 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-045-2IC | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
TE0745-02-71I31-AK | 602.7000 | |
6636 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.130" W (76.00mm x 54.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-71I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0745-02-81C31-A | 1.0000 | |
4139 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 160 | |||
|
TE0745-02-92I11-AK | - | |
3658 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I11-AK | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | ||||
|
TE0803-04-4BE11-A | 581.7000 | |
9324 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4BE11-A | 1 | Zynq UltraScale+ XCZU4EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0803-04-3BE11-A | 513.4500 | |
9497 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0803-04-5DE11-A | 1.0000 | |
4620 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-5DE11-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0803-04-2BE11-A | 418.9500 | |
4673 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2BE11-A | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0803-04-2AE11-A | 371.7000 | |
6277 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-2AE11-A | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0808-05-9BE21-AK | 1.0000 | |
5765 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-05-9BE21-AK | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | ||
 |
TE0715-04-12S-1C | - | |
1817 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0715 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1092 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7012S) | Samtec LSHM | |
 |
TE0722-02 | 98.7000 | |
3925 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 0.710" L x 2.010" W (18.00mm x 51.00mm) | TE0722 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1077 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 33MHz | - | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | 40 Pin | |
|
TE0722-03-41I-4-A | 109.0000 | |
2049 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-TE0722-03-41I-4-A | 1 | |||||||||||||
|
TE0813-01-5DE11-A | 1.0000 | |
1310 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-5DE11-A | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0808-05-6BE21-L | 1.0000 | |
9014 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-L | 1 | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
AM0010-02-2AE21MA | 426.0000 | |
2354 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-2AE21MA | 1 | Zynq™ UltraScale+™ ZU2CG | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0808-05-6BE21-AK | 1.0000 | |
5168 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-AK | 1 | Zynq™ UltraScale+™ ZU6EG-E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0820-05-4AE81MA | 499.0000 | |
2209 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4AE81MA | 1 | ||||||||||||||
|
TE0803-04-4GE21-L | 712.0000 | |
6815 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4GE21-L | 1 | Zynq™ UltraScale+™ XCZU4EG-2SFVC784E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0808-05-9GI21-AK | 1.0000 | |
4888 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI21-AK | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
|
TE0724-04-41I32-A | 172.9000 | |
9574 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | -40°C ~ 85°C | 2.362" L x 1.575" W (60.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0724-04-41I32-A | 1 | Zynq™ XC7Z010-1CLG400I | 667MHz | 1GB | 32MB | MPU Core | ARM Cortex-A9 | 1 x 160 Pin | |||||
|
TE0808-05-9BE81-A | 1.0000 | |
6066 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE81-A | 1 | - | - | 4GB | 128MB | MPU Core | - | - | |||||
|
TE0817-01-4BE21-A | 953.0000 | |
5796 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-4BE21-A | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0807-03-7DE21-A | 1.0000 | |
6516 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
|
TE0808-05-9BE81-L | 1.0000 | |
8760 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE81-L | 1 | - | - | 4GB | 128MB | MPU Core | - | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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