Tel: +86-0755-83501315
Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
TE0820-03-03EG-1EL | - | ![]() |
8976 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-03EG-1EL | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
![]() |
TE0745-02-30-1IA | - | ![]() |
4168 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1108 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | |||||
![]() |
TE0712-03-81I36-A | 413.7000 | ![]() |
1024 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-81I36-A | 1 | Artix-7 XC7A200T-1FBG484I | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
![]() |
TE0807-03-7DI21-A | 2.0000 | ![]() |
2823 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
![]() |
TE0741-03-325-2CF | - | ![]() |
2877 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 325T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
![]() |
TE0712-02-82C36-P | - | ![]() |
2843 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C36-P | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
![]() |
TE0720-03-2IFC3 | - | ![]() |
4941 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
![]() |
TEC0850-03-15EG1EA | - | ![]() |
5548 | 0.00000000 | Trenz Electronic GmbH | TEC0850 | Bulk | Obsolete | - | - | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-15EG1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
TE0600-03-52I11-C | - | ![]() |
8935 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-C | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||||||
![]() |
TE0821-01-3BI21MA | 611.0000 | ![]() |
5570 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BI21MA | 1 | Zynq™ UltraScale+™ XCZU3EG-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 160 Pin | |||||
![]() |
TE0723-03-41C64-A | 161.7000 | ![]() |
7809 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0723-03-41C64-A | 1 | ||||||||||||||
![]() |
S00014 | - | ![]() |
8803 | 0.00000000 | Trenz Electronic GmbH | * | Box | Obsolete | - | ROHS3 Compliant | 1 (Unlimited) | 1686-S00014 | OBSOLETE | 1 | |||||||||||||
![]() |
TE0820-03-04CG-1EA | - | ![]() |
7494 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1160 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
![]() |
TE0818-01-6BE21-A | 1.0000 | ![]() |
9084 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-6BE21-A | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
![]() |
TE0729-02-62I63FAK | - | ![]() |
9110 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FAK | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||
![]() |
TE0713-02-82C46-A | 450.4500 | ![]() |
1451 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0713-02-82C46-A | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A200T-2FBG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | |||
![]() |
TE0820-04-50121FA | - | ![]() |
6439 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-50121FA | OBSOLETE | 1 | - | - | - | - | - | - | |||||
![]() |
TE0820-04-2BI21M | - | ![]() |
8169 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21M | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||||
![]() |
TE0741-04-A2C-1-A | 450.4500 | ![]() |
9180 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-A2C-1-A | 1 | Xilinx Kintex-7 FPGA XC7K70T-2FBG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
![]() |
TE0808-05-BBE21-AZ | 361.2000 | ![]() |
4913 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1 | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
![]() |
TE0712-03-72C36-A | 324.4500 | ![]() |
8721 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0712-03-72C36-A | 1 | Artix-7 XC7A100T-2FGG484C | - | 1GB | 32MB | FPGA | - | Board-to-Board (BTB) Socket - 160 | |||||||
![]() |
TE0741-04-B2C-1-AF | 880.9600 | ![]() |
4316 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
![]() |
S00005-02 | - | ![]() |
5503 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-S00005-02 | 1 | ||||||||||||||
![]() |
TE0715-04-30-1IA | - | ![]() |
4757 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-30-1IA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||||
![]() |
TE0820-05-2BE81ML | 414.0000 | ![]() |
3489 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81ML | 1 | ||||||||||||||
![]() |
TE0725-03-15-1C | 88.2000 | ![]() |
15 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A15T | 100MHz | - | 32MB | FPGA Core | - | 50 Pin | ||
![]() |
AM0010-02-5DE21MA | 1.0000 | ![]() |
1842 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DE21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
![]() |
TE0720-04-61Q33ML | 340.2000 | ![]() |
4514 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33ML | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
![]() |
TEC0850-03-15EG1E | - | ![]() |
3881 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Obsolete | - | - | TEC0850 | download | Not Applicable | 1686-1163 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
![]() |
TE0820-05-4DE81MA | 622.0000 | ![]() |
6570 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-4DE81MA | 1 |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse