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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0745-02-45-1CA | - |  |
3381 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
 |
TE0745-02-30-1IA | - | |
4168 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1108 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | |||||
|
TE0807-02-07EV-1E | - | |
6805 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1169 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0820-03-03EG-1EA | - | |
3978 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 80°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1159 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0803-02-03EG-1EB | 609.0000 | |
2430 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-1152 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 4GB | 128MB | MPU Core | - | B2B | ||
 |
TE0741-02-160-2CF | - | |
7600 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0782-02-035-2I | - | |
8946 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | TE0782 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec QTH | |||
|
TE0818-01-6BE21-A | 1.0000 | |
9084 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-6BE21-A | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0820-02-03CG-1EA | - | |
4611 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 1GB | 128MB | MPU Core | - | B2B | ||||||
 |
TE0712-02-200-2C | - | |
8271 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0803-03-3BE11-AS | - | |
4073 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-3BE11-AS | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
|
TE0803-04-4AE11-A | 518.7000 | |
6135 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4AE11-A | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0713-01-200-2C | - | |
2458 | 0.00000000 | Trenz Electronic GmbH | TE0713 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-1144 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||||
|
TE0808-04-06EG-1EE | - | |
3972 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 1686-1157 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0745-02-30-2IA | - | |
9666 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | - | ||||
|
TE0820-03-04CG-1EA | - | |
7494 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1160 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0600-03-52I11-A | 261.4500 | |
9440 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-A | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||
 |
TE0723-03M | - | |
3396 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Box | Obsolete | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1066 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | B2B | ||
 |
TE0320-00-EV02 | 189.0000 | |
3041 | 0.00000000 | Trenz Electronic GmbH | TE0320 | Bulk | Not For New Designs | 0°C ~ 70°C | 2.700" L x 1.900" W (68.00mm x 48.00mm) | TE0320 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3A DSP | 100MHz | 128MB | 4MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | |||
|
TE0820-04-2AI21FA | - | |
3381 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2AI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0726-03R | - | |
9618 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | TE0726 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8473.30.1180 | 1 | - | 667MHz | 128MB | 16MB | FPGA Core | Zynq-7000 (Z-7010) | CSI, DSI | ||
|
TEC0850-03-15EG1E | - | |
3881 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Obsolete | - | - | TEC0850 | download | Not Applicable | 1686-1163 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
 |
TE0600-03IVFN | 323.4000 | |
6545 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||
|
TE0712-03-82C36-AW | - | |
3778 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-82C36-AW | 1 | Artix-7 XC7A200T-2FBG484C | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
|
TE0865-02-FBE23MA | 4.0000 | |
2302 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-FBE23MA | 1 | Zynq™ UltraScale+™ XCZU19EG-1FFVC1760E | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0714-02-35-2I | - | |
8915 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Obsolete | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | download | 1 (Unlimited) | REACH Unaffected | 1686-1031 | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | - | 16MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0723-02 | - | |
7918 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Bulk | Discontinued at SIC | 0°C ~ 70°C | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 128MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | Arduino | |||||
|
TE0712-02-82C11-P | - | |
4161 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82C11-P | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0720-03-14S-1C | - | |
5617 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1093 | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7014S) | Samtec LSHM | |
|
AM0010-02-3BE21MA | 572.0000 | |
3177 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-3BE21MA | 1 | Zynq™ UltraScale+™ ZU3EG-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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