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Embedded(571)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0820-05-2BI21ML | 459.0000 |  |
9735 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI21ML | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
TE0745-02-71I31-AZ | 597.4500 | |
8559 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 160 | ||||
 |
TE0600-03-52I11-A | 261.4500 | |
9440 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-A | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||
 |
TE0745-02-35-1CA | - | |
6311 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-1109 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec UFPS | |||||
 |
TE0712-02-200-2C3 | - | |
2475 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0830-01-ABI26FAP | - | |
5512 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 4.724" L x 4.724" W (120.00mm x 120.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0830-01-ABI26FAP | 1 | Zynq UltraScale+ ZU11EG-1I | - | 16GB | 128MB | MPU Core | - | 2 x 400 Pin | |||||
|
TE0820-03-2AI21FA | - | |
1029 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-2AI21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||
|
TE0720-04-61C530A | 308.7000 | |
5270 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C530A | 1 | ARM® Cortex®-A9 | - | 256MB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0726-03-11C64-A | 162.4000 | |
3805 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Active | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03-11C64-A | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7007S) | CSI, DSI | |||||
 |
TE0741-03-070-2CF | - | |
7713 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 70T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0741-02-160-2CF | - | |
7600 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
|
TE0600-03-72C11-A | 345.4500 | |
2130 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-72C11-A | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0630-02IBF | 303.4500 | |
5125 | 0.00000000 | Trenz Electronic GmbH | TE0630 | Bulk | Active | -40°C ~ 85°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0630 | - | ROHS3 Compliant | Not Applicable | 0000.00.0000 | 1 | Spartan-6 LX-75 | 100MHz | 128MB | 8MB | FPGA, USB Core | Cypress EZ-USB FX2LP | B2B | ||||
|
TE0820-04-2BI21FL | - | |
2017 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0820-03-2BE21FL | - | |
4396 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-TE0820-03-2BE21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||||
|
TE0745-02-93E11-A | - | |
1808 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-93E11-A | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec ST5 | |||
 |
TE0726-03R | - | |
9618 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | TE0726 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8473.30.1180 | 1 | - | 667MHz | 128MB | 16MB | FPGA Core | Zynq-7000 (Z-7010) | CSI, DSI | ||
|
TE0820-04-40121MA | - | |
9547 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-40121MA | 1 | - | - | - | - | - | - | ||||||
|
TE0820-05-4DE21MA | 655.2000 | |
7365 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-4DE21MA | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E | Pin(s) | |||||||
|
TE0813-01-4DE11-AZ | 614.0800 | |
1091 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4DE11-AZ | 1 | ||||||||||||||
|
TE0820-04-2BE21FL | - | |
4097 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BE21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0715-04-71I33-L | - | |
3070 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-71I33-L | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||
|
TE0712-03-72C36-L | 313.9500 | |
3385 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-72C36-L | 1 | Artix-7 XC7A100T-2C | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
|
TE0712-03-42I36-A | 256.2000 | |
6598 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-42I36-A | 1 | Artix-7 XC7A35T-2FGG484I | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
 |
TE0726-03-07S-1C | - | |
9214 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | TE0726 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 1686-1094 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 766MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7007S) | CSI, DSI | |
|
TEC0850-03-15EG1EA | - | |
5548 | 0.00000000 | Trenz Electronic GmbH | TEC0850 | Bulk | Obsolete | - | - | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-15EG1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
|
TE0820-05-2BE81ML | 414.0000 | |
3489 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81ML | 1 | ||||||||||||||
|
TE0820-04-2BI21M | - | |
8169 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-2BI21M | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | ||||
|
TE0741-04-B2C-1-AF | 880.9600 | |
4316 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0820-04-50121FA | - | |
6439 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-50121FA | OBSOLETE | 1 | - | - | - | - | - | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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