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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
10AS027E2F27E1SG | - |  |
2141 | 0.00000000 | Intel | Arria 10 SX | Tray | Discontinued at SIC | 0°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA, FC (27x27) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 270K Logic Elements | |||
 |
1SX165HU1F50I2VG | 34.0000 | |
3201 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX165HU1F50I2VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1650K Logic Elements | ||||||
 |
BCM33843VKFSBG | - | |
5949 | 0.00000000 | Broadcom Limited | - | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 60 | |||||||||||||||||
 |
5CSEBA5U23I7LN | 286.0778 | |
4692 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 672-FBGA | 672-UBGA (23x23) | download | REACH Unaffected | 984770 | 0000.00.0000 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 925MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 85K Logic Elements | |||||
 |
A2F500M3G-FG484M | 1.0000 | |
2753 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -55°C ~ 125°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A2C | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
 |
10AS057K2F40I1SG | 4.0000 | |
1388 | 0.00000000 | Intel | Arria 10 SX | Tray | Discontinued at SIC | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 696 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 570K Logic Elements | |||
 |
XCZU7CG-2FBVB900I | 4.0000 | |
7433 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU7 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
 |
XCZU6EG-2FFVC900I | 4.0000 | |
1507 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU6 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||
 |
PSB21473FV1.3 | - | |
9953 | 0.00000000 | Lantiq | * | Bulk | Active | - | Not applicable | 3 (168 Hours) | Vendor Undefined | EAR99 | 8542.39.0001 | 850 | |||||||||||||||
|
AGFA012R24C2E4F | 32.0000 | |
4720 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA012R24C2E4F | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.2M Logic Elements | ||||||
|
BCM33843DUIFSBG | - | |
8409 | 0.00000000 | Broadcom Limited | - | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 5,000 | |||||||||||||||||
|
AGIA040R39A2E3E | 119.0000 | |
6822 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIA040R39A2E3E | 3 | |||||||||||||||||||
|
10AS057K1F40E1HG | 7.0000 | |
6935 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965014 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 696 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 570K Logic Elements | ||
 |
M2S060-FG676I | 172.3778 | |
4055 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 676-BGA | M2S060 | 676-FBGA (27x27) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 387 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
114991695 | - | |
6154 | 0.00000000 | Seeed Technology Co., Ltd | Sipeed MAIX-I | Bulk | Obsolete | -30°C ~ 85°C | Module | Module | download | 1 (Unlimited) | 1597-1717 | 3A991A2 | 8542.31.0001 | 1 | MPU | 48 | RISC-V Dual Core 64bit | 400MHz | I²C, SPI, UART/USART | DMA, I²S, PWM, WDT | 8MB | 8MB/16MB/128MB | Audio Processor (APU), Neural Network Processor (KPU) | ||||
 |
XCZU7EV-1FFVF1517E | 3.0000 | |
3088 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | XCZU7 | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 464 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
 |
XCVC1502-1LSEVSVA2197 | 20.0000 | |
3047 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1502-1LSEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 586 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 80k Logic Cells | |||
 |
XCZU1CG-L2UBVA494E | 374.4000 | |
2646 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | 0°C ~ 100°C (TJ) | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU1CG-L2UBVA494E | 1 | MPU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.333GHz | - | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | |||||
 |
MPFS250T-FCSG536T2 | - | |
4573 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-FCSG536T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 168 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | ||||
 |
5ASTFD5G3F35I3G | 9.0000 | |
4717 | 0.00000000 | Intel | Arria V ST | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASTFD5G3F35I3G | 24 | MCU, FPGA | MCU - 208, FPGA - 385 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.05GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | ||||
 |
XC7Z030-3FBG676E | 517.4000 | |
6107 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 100°C (TJ) | 676-BBGA, FCBGA | XC7Z030 | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 125K Logic Cells | ||
 |
10AS027E2F29I2SG | 1.0000 | |
3937 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA, FC (29x29) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 964923 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 360 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 270K Logic Elements | ||
 |
MPFS250T-1FCVG484E | 479.2300 | |
3736 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 150-MPFS250T-1FCVG484E | 5A992C | 8542.31.0001 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||
|
5CSEBA2U23C8N | 104.1200 | |
1737 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | 0°C ~ 85°C (TJ) | 672-FBGA | 672-UBGA (23x23) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 181, FPGA - 145 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 25K Logic Elements | |||
 |
XCVP1502-1LSEVSVA2785 | 28.0000 | |
2373 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA | 2785-BGA (50x50) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-1LSEVSVA2785 | 1 | MPU, FPGA | 702 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | |||||
|
5ASXFB5H4F40I5G | 7.0000 | |
3553 | 0.00000000 | Intel | Arria V SX | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXFB5H4F40I5G | 21 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 462K Logic Elements | ||||
|
AGIB023R31B1E1VB | 34.0000 | |
1371 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B1E1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
10AS032H4F34I3LG | 2.0000 | |
6954 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965347 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 384 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 320K Logic Elements | ||
 |
XCZU47DR-L1FFVG1517I | 25.0000 | |
1649 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU47DR-L1FFVG1517I | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
 |
M2S025T-1FCSG325 | 86.3481 | |
5830 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S025 | 325-FCBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 180 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 25K Logic Modules |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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