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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGIB023R18A2I3V | 63.0000 |  |
2501 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB023R18A2I3V | 3 | |||||||||||||||||||
|
AGFB019R31C2E2V | 53.0000 | |
8189 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB019R31C2E2V | 3 | |||||||||||||||||||
|
AGID023R31B2E2V | 80.0000 | |
1877 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID023R31B2E2V | 3 | |||||||||||||||||||
|
AGFB023R31C2E3E | 61.0000 | |
7924 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB023R31C2E3E | 3 | |||||||||||||||||||
|
AGFA023R31C3E3E | 43.0000 | |
4058 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFA023R31C3E3E | 3 | |||||||||||||||||||
|
AGID019R31B2I3V | 72.0000 | |
4155 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID019R31B2I3V | 3 | |||||||||||||||||||
|
AGIA035R39A2E1VB | 123.0000 | |
9129 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIA035R39A2E1VB | 3 | |||||||||||||||||||
|
AGID019R18A1I2V | 88.0000 | |
1939 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID019R18A1I2V | 3 | |||||||||||||||||||
|
AGFA019R31C2E2V | 53.0000 | |
5382 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFA019R31C2E2V | 3 | |||||||||||||||||||
|
AGFB023R31C2I1V | 83.0000 | |
8523 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB023R31C2I1V | 3 | |||||||||||||||||||
|
AGIC040R39A1I1VB | 203.0000 | |
6178 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIC040R39A1I1VB | 3 | |||||||||||||||||||
|
AGFD023R31C2E1V | 77.0000 | |
2320 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFD023R31C2E1V | 3 | |||||||||||||||||||
|
AGFA019R31C2I3V | 21.0000 | |
2687 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | download | 544-AGFA019R31C2I3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
|
AGIB019R18A2I2V | 63.0000 | |
3047 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB019R18A2I2V | 3 | |||||||||||||||||||
|
AGID019R31B2E3E | 70.0000 | |
5378 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGID019R31B2E3E | 3 | |||||||||||||||||||
|
AGFC023R31C2E4X | 85.0000 | |
7440 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFC023R31C2E4X | 3 | |||||||||||||||||||
|
AGFD023R31C3E3V | 38.0000 | |
2353 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFD023R31C3E3V | 3 | |||||||||||||||||||
|
AGIA040R39A2E3E | 119.0000 | |
6822 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIA040R39A2E3E | 3 | |||||||||||||||||||
|
AGFC023R31C3I3E | 58.0000 | |
1551 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFC023R31C3I3E | 3 | |||||||||||||||||||
|
AGIA040R39A1I1VB | 184.0000 | |
7990 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIA040R39A1I1VB | 3 | |||||||||||||||||||
|
AGIB023R31B2I3V | 68.0000 | |
6696 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB023R31B2I3V | 3 | |||||||||||||||||||
 |
10AS016E3F29E2LG | 1.0000 | |
9623 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 780-BBGA, FCBGA | 780-FBGA, FC (29x29) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 964718 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 288 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 160K Logic Elements | ||
|
XCVM1502-1LSENFVB1369 | 7.0000 | |
4250 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVM1502-1LSENFVB1369 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells | ||||||
 |
M2S050-1VF400I | 167.0984 | |
6124 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 2266-M2S050-1VF400I | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | |
 |
XC7Z030-3FFG676E | 647.4000 | |
6640 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 100°C (TJ) | 676-BBGA, FCBGA | XC7Z030 | 676-FCBGA (27x27) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 125K Logic Cells | ||
 |
XC7Z100-1FF900I | 3.0000 | |
6867 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XC7Z100 | 900-FCBGA (31x31) | download | RoHS non-compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 444K Logic Cells | ||
 |
XC7Z010-2CLG400I | 107.5900 | |
219 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA, CSPBGA | XC7Z010 | 400-CSPBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 122-1852 | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 766MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 28K Logic Cells | |
 |
5CSEBA4U19C8N | 110.5174 | |
2865 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | 0°C ~ 85°C (TJ) | 484-FBGA | 484-UBGA (19x19) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 968239 | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 600MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 40K Logic Elements | ||
|
AGIC041R29D2E2VR0 | 55.0000 | |
4778 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIC041R29D2E2VR0 | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements | |||||||
|
AGIC041R29D1E2VR1 | 57.0000 | |
8570 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIC041R29D1E2VR1 | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 4M Logic Elements |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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