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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AGIB023R18A2I2V | 74.0000 |  |
8107 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIB023R18A2I2V | 3 | |||||||||||||||||||
 |
XCVC1702-1LSIVSVA2197 | 30.0000 | |
9071 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-1LSIVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | |||
 |
XCZU4EV-1SFVC784E | 1.0000 | |
39 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU4 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ||
|
AGFB019R31C2I1VB | 26.0000 | |
1063 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFB019R31C2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
|
AGFA008R24C2I3E | 33.0000 | |
7027 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA008R24C2I3E | 1 | MPU, FPGA | 576 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 764K Logic Elements | ||||||
|
AGFB014R24C2E3E | 44.0000 | |
9659 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB014R24C2E3E | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
 |
10AS066H2F34E1HG | 5.0000 | |
3830 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 973530 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 492 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
|
AGFD023R25A1I1V | 77.0000 | |
5811 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD023R25A1I1V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
XCVE1752-2MLENSVG1369 | 22.0000 | |
7108 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVE1752-2MLENSVG1369 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||
 |
1SX280LU3F50I2VGAS | 33.0000 | |
8537 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280LU3F50I2VGAS | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
 |
XCZU7EV-L2FBVB900E | 4.0000 | |
8048 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EV | Tray | Active | 0°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU7 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
 |
1SX280LH2F55E1VG | 31.0000 | |
9673 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 1160 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | |||
 |
MPFS250T-FCVG484E | 435.6700 | |
8 | 0.00000000 | Microchip Technology | PolarFire™ | Tray | Active | 0°C ~ 100°C | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 150-MPFS250T-FCVG484E | 5A992C | 8542.31.0001 | 1 | MPU, FPGA | MCU - 136, FPGA - 372 | RISC-V | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128kB | FPGA - 254K Logic Modules | ||
|
AGIB027R29A1E2VB | 38.0000 | |
8728 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 2957-BFBGA Exposed Pad | 2957-BGA (56x45) | - | 544-AGIB027R29A1E2VB | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | |||||||
 |
XC7Z015-3CLG485E | 227.5000 | |
8601 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 100°C (TJ) | 485-LFBGA, CSPBGA | XC7Z015 | 485-CSPBGA (19x19) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991A2 | 8542.39.0001 | 84 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 866MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Artix™-7 FPGA, 74K Logic Cells | ||
|
AGIB019R18A1E2V | 60.0000 | |
3850 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB019R18A1E2V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | ||||||
|
AGFB008R24D2I3V | 21.0000 | |
4956 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB008R24D2I3V | 3 | |||||||||||||||||||
 |
M2S060-VF400I | 156.6584 | |
5625 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S060 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
XCZU9EG-3FFVB1156E | 6.0000 | |
4691 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 600MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
|
AGFD023R25A2E3V | 42.0000 | |
6946 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD023R25A2E3V | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
|
TCI6636K2HDAAW24 | - | |
8638 | 0.00000000 | Texas Instruments | * | Bulk | Active | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6636K2HDAAW24 | 1 | |||||||||||||||
|
1SX250HH1F55I2LG | 44.0000 | |
9835 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX250HH1F55I2LG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2500K Logic Elements | ||||||
|
AGIC040R39A2I1VB | 180.0000 | |
5983 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGIC040R39A2I1VB | 3 | |||||||||||||||||||
|
AGFC019R24C2E3E | 20.0000 | |
2106 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | - | 544-AGFC019R24C2E3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
|
XCVE1752-2MSEVSVA2197 | 21.0000 | |
2707 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | - | 4 (72 Hours) | 122-XCVE1752-2MSEVSVA2197 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | ||||||||
 |
XCVC1902-1LLIVSVD1760 | 40.0000 | |
4443 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-1LLIVSVD1760 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 692 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | |||
|
TCI6638K2KDXAAW2LE | - | |
9043 | 0.00000000 | Texas Instruments | KeyStone Multicore | Bulk | Active | 0°C ~ 100°C (TC) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | - | ROHS3 Compliant | 4 (72 Hours) | 296-TCI6638K2KDXAAW2LE | 1 | DSP, MPU | 32 | C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™ | 1.2GHz | Ethernet, I²C, SPI, UART/USART, USB | DDR, DMA, PCIe, POR, WDT | - | - | - | |||||
 |
114991684 | - | |
7879 | 0.00000000 | Seeed Technology Co., Ltd | Sipeed MAIX-I | Bulk | Obsolete | -30°C ~ 85°C | Module | Module | download | 1 (Unlimited) | 1597-1715 | 5A992C SC | 8471.50.0150 | 1 | MPU | 48 | RISC-V Dual Core 64bit | 600MHz | I²C, SPI, UART/USART | DMA, I²S, PWM, WDT | 8MB | 8MB/16MB/128MB | Audio Processor (APU), Neural Network Processor (KPU) | ||||
|
1SX210HU1F50I2VG | 40.0000 | |
4903 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX210HU1F50I2VG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2100K Logic Elements | ||||||
|
XCVM1402-2HSIVSVD1760 | 10.0000 | |
2928 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-2HSIVSVD1760 | 1 | MPU, FPGA | 726 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 800MHz, 1.65GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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