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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
XCVM1402-1MSEVFVC1596 | 5.0000 |  |
8139 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MSEVFVC1596 | 1 | MPU, FPGA | 748 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||
 |
XCVE1752-2LLENSVG1369 | 26.0000 | |
4131 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVE1752-2LLENSVG1369 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | ||
 |
XCVC1502-1LLIVSVA2197 | 30.0000 | |
8098 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1502-1LLIVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 586 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 80k Logic Cells | ||
 |
XCVM1302-2MSENSVF1369 | 4.0000 | |
7558 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2MSENSVF1369 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
|
XCVC1702-2LSENSVG1369 | 24.0000 | |
3371 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-2LSENSVG1369 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | ||
 |
XAZU1EG-1SFVC784I | 408.2000 | |
5 | 0.00000000 | AMD | - | Tray | Active | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XAZU1EG-1SFVC784I | 1 | ||||||||||||||
 |
XCVM1402-1MLIVSVD1760 | 8.0000 | |
6061 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MLIVSVD1760 | 1 | MPU, FPGA | 726 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||
|
XCVM1402-1LLIVSVD1760 | 10.0000 | |
7249 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1LLIVSVD1760 | 1 | MPU, FPGA | 726 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||
 |
XCVM1302-1LSENBVB1024 | 3.0000 | |
3731 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1LSENBVB1024 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
|
XCVM1402-1MSENSVF1369 | 5.0000 | |
8136 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1402-1MSENSVF1369 | 1 | MPU, FPGA | 424 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | ||||
|
XCVM1302-2MLENSVF1369 | 5.0000 | |
2492 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1369-BFBGA | 1369-BGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2MLENSVF1369 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
|
XCVC1802-2HSIVSVA2197 | 39.0000 | |
6421 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2HSIVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 800MHz, 1.65GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | ||
|
XCVM1302-2MSIVSVD1760 | 5.0000 | |
8225 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2MSIVSVD1760 | 1 | MPU, FPGA | 402 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
|
XCVM1302-2LSEVFVC1596 | 5.0000 | |
7518 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1596-BFBGA | 1596-BGA (37.5x37.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2LSEVFVC1596 | 1 | MPU, FPGA | 532 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
|
XCVM1302-1MLINBVB1024 | 4.0000 | |
6773 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-1MLINBVB1024 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
|
XCVC1702-2LLEVSVA2197 | 36.0000 | |
3142 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1702-2LLEVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 608 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ AI Core FPGA, 1M Logic Cells | ||
|
XCVM1302-2LLENBVB1024 | 5.0000 | |
4549 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 100°C (TJ) | 1024-BFBGA | 1024-BGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1302-2LLENBVB1024 | 1 | MPU, FPGA | 316 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | - | - | Versal™ Prime FPGA, 70k Logic Cells | ||||
 |
MPFS250T-1FCVG484T2 | - | |
1195 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-1FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | |||
 |
MPFS095T-FCSG325T2 | - | |
8949 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS095T-FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
|
MPFS160T-FCVG484T2 | - | |
3397 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | - | REACH Unaffected | 150-MPFS160T-FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128KB | FPGA - 161K Logic Modules | |||||
|
MPFS025T-1FCSG325T2 | - | |
2318 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-1FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
|
MPFS025T-1FCVG484T2 | - | |
7475 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | - | REACH Unaffected | 150-MPFS025T-1FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
|
MPFS095T-1FCSG325T2 | - | |
2201 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS095T-1FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | |||||
 |
MPFS250T-FCSG536T2 | - | |
4573 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) | - | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 150-MPFS250T-FCSG536T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 168 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 2.2MB | 128KB | FPGA - 254K Logic Modules | |||
|
MPFS025T-FCVG484T2 | - | |
3826 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | - | REACH Unaffected | 150-MPFS025T-FCVG484T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 108 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | |||||
|
XCVC1902-2LLIVSVA2197 | 52.0000 | |
8265 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1902-2LLIVSVA2197 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.9M Logic Cells | ||||
 |
XCVP1502-1LSEVSVA2785 | 28.0000 | |
2373 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA | 2785-BGA (50x50) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-1LSEVSVA2785 | 1 | MPU, FPGA | 702 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | ||||
|
XCVP1502-2LSEVSVA2785 | 35.0000 | |
6051 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA | 2785-BGA (50x50) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-2LSEVSVA2785 | 1 | MPU, FPGA | 702 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | ||||
 |
XCVP1502-2LSEVSVA3340 | 36.0000 | |
3430 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 3340-BFBGA | 3340-BGA (55x55) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-2LSEVSVA3340 | 1 | MPU, FPGA | 486 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells | ||||
|
XCVP1502-3HSEVSVA2785 | 44.0000 | |
4697 | 0.00000000 | AMD | Versal® Premium | Tray | Active | 0°C ~ 100°C (TJ) | 2785-BFBGA | 2785-BGA (50x50) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVP1502-3HSEVSVA2785 | 1 | MPU, FPGA | 702 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 800MHz, 1.7GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Premium FPGA, 3.7M Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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