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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
XCZU48DR-1FSVG1517I | 27.0000 |  |
9997 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU48DR-1FSVG1517I | 1 | MCU, FPGA | 561 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
 |
XCVC1702-2MLEVSVA1596 | 27.0000 | |
3362 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 110°C (TJ) | 1596-BFBGA, FCBGA | 1596-FCBGA (37.5x37.5) | - | 4 (72 Hours) | 122-XCVC1702-2MLEVSVA1596 | 1 | MPU, FPGA | 500 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1M Logic Cells | ||||||
 |
M2S060-1FCSG325I | 138.5210 | |
3101 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 325-TFBGA, FCBGA | M2S060 | 325-FCBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 200 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
 |
XCZU55DR-2FFVE1156I | 19.0000 | |
3232 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC DR | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU55DR-2FFVE1156I | 1 | MPU, FPGA | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 533MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe, WDT | - | - | Zynq® UltraScale+™ RFSoC | |||||
 |
XCZU7EG-2FFVF1517I | 5.0000 | |
2424 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | XCZU7 | 1517-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 464 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
|
AGID019R18A1I1VB | 36.0000 | |
9457 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | - | 544-AGID019R18A1I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
 |
XC7Z035-1FFG900C | 1.0000 | |
6552 | 0.00000000 | AMD | Zynq®-7000 | Tray | Active | 0°C ~ 85°C (TJ) | 900-BBGA, FCBGA | XC7Z035 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | 130 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 667MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA | 256KB | - | Kintex™-7 FPGA, 275K Logic Cells | ||
 |
XCZU2EG-3SFVA625E | - | |
9617 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Obsolete | 0°C ~ 100°C (TJ) | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | download | 4 (72 Hours) | REACH Unaffected | OBSOLETE | 8542.39.0001 | 1 | MCU, FPGA | 180 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 600MHz, 667MHz, 1.5GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ||||
 |
10AS016E3F27I1HG | 1.0000 | |
4893 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 672-BBGA, FCBGA | 672-FBGA, FC (27x27) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 964678 | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 240 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 160K Logic Elements | ||
|
M2S050-1FCSG325 | 123.7133 | |
9632 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S050 | 325-FCBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 200 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
 |
1SX040HH2F35E2VG | 4.0000 | |
1187 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | download | 3 (168 Hours) | 544-1SX040HH2F35E2VG | 1 | MCU, FPGA | 374 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 400K Logic Elements | ||||||
|
MPFS025T-FCSG325T2 | - | |
9441 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 325-TFBGA | 325-BGA (11x11) | - | REACH Unaffected | 150-MPFS025T-FCSG325T2 | 1 | MPU, FPGA | MCU - 102, FPGA - 80 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 230.4KB | 128KB | FPGA - 23K Logic Modules | ||||||
|
AGIB019R18A1E2VB | 24.0000 | |
3537 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | - | 544-AGIB019R18A1E2VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.9M Logic Elements | |||||||
 |
MPFS095T-1FCSG536T2 | - | |
7393 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) | - | REACH Unaffected | 150-MPFS095T-1FCSG536T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 168 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 857.6KB | 128KB | FPGA - 93K Logic Modules | ||||||
|
XCZU11EG-1FFVC1760E | 5.0000 | |
8575 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | XCZU11 | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 512 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ||
|
AGFD023R25A2I3E | 59.0000 | |
6693 | 0.00000000 | Intel | Agilex F | Tray | Active | -40°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFD023R25A2I3E | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | ||||||
 |
M2S150T-FCG1152 | 451.4117 | |
3753 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
|
AGFA014R24C2E1V | 50.0000 | |
6707 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFA014R24C2E1V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1.4M Logic Elements | ||||||
 |
M2S090-FGG676 | 245.1500 | |
4520 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 676-BGA | M2S090 | 676-FBGA (27x27) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 40 | MCU, FPGA | 425 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 90K Logic Modules | ||
 |
XCZU7EG-2FFVC1156I | 4.0000 | |
3136 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU7 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 360 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ||
|
AGFB027R24C2E3V | 58.0000 | |
3488 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGFB027R24C2E3V | 1 | MPU, FPGA | 744 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
 |
10AS027H1F35I1SG | - | |
8740 | 0.00000000 | Intel | Arria 10 SX | Tray | Discontinued at SIC | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 5A002A1 | 8542.39.0001 | 1 | MCU, FPGA | 384 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 270K Logic Elements | |||
 |
XCZU3EG-L2SFVC784E | 904.8000 | |
1668 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | 0°C ~ 100°C (TJ) | 784-BFBGA, FCBGA | XCZU3 | 784-FCBGA (23x23) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 252 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||
 |
XCZU3CG-1SBVA484I | 557.7000 | |
7477 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC CG | Tray | Active | -40°C ~ 100°C (TJ) | 484-BFBGA, FCBGA | XCZU3 | 484-FCBGA (19x19) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 82 | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ||
 |
1SX110HN1F43E2LG | 20.0000 | |
1821 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FBGA (42.5x42.5) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX110HN1F43E2LG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 1100K Logic Elements | ||||||
|
AGFB019R31C2E1V | 60.0000 | |
5715 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB019R31C2E1V | 3 | |||||||||||||||||||
|
M2S050T-FCSG325 | 118.7738 | |
1521 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 325-TFBGA, FCBGA | M2S050 | 325-FCBGA (11x11) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 176 | MCU, FPGA | 200 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
 |
XCVC1802-1LLIVSVA2197 | 37.0000 | |
3089 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-1LLIVSVA2197 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 400MHz, 1GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||
|
AGFC023R31C2E1VB | 31.0000 | |
4609 | 0.00000000 | Intel | Agilex F | Tray | Active | 0°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGFC023R31C2E1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
|
XCVM1502-2MLENFVB1369 | 9.0000 | |
1820 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | 0°C ~ 110°C (TJ) | 1369-BFBGA, FCBGA | 1369-FCBGA (35x35) | - | 4 (72 Hours) | 122-XCVM1502-2MLENFVB1369 | 1 | MPU, FPGA | 478 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.4GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1M Logic Cells |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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