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System On Chip (SoC)(4664)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Package / Case | Base Product Number | Supplier Device Package | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Architecture | Number of I/O | Core Processor | Speed | Connectivity | Peripherals | RAM Size | Flash Size | Primary Attributes |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
M2S100-FC1152 | - |  |
9392 | 0.00000000 | Microsemi Corporation | SmartFusion®2 | Tray | Obsolete | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S100 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 100K Logic Modules | ||
 |
MPFS160T-1FCSG536T2 | - | |
3587 | 0.00000000 | Microchip Technology | - | Tray | Active | -40°C ~ 125°C (TJ) | 536-LFBGA | 536-BGA (16x16) | - | REACH Unaffected | 150-MPFS160T-1FCSG536T2 | 1 | MPU, FPGA | MCU - 136, FPGA - 168 | RISC-V | - | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | DMA, PCI, PWM | 1.4125MB | 128KB | FPGA - 161K Logic Modules | ||||||
|
M2S150-1FCSG536 | 474.8827 | |
4258 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
AGIB023R31B2I1VB | 36.0000 | |
5679 | 0.00000000 | Intel | Agilex I | Tray | Active | -40°C ~ 100°C (TJ) | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | - | 544-AGIB023R31B2I1VB | 1 | MPU, FPGA | 480 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.3M Logic Elements | |||||||
 |
M2S060TS-VF400I | 187.9709 | |
7338 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S060 | 400-VFBGA (17x17) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 60K Logic Modules | ||
|
BCM33838MKFEBG-B2P | - | |
2682 | 0.00000000 | Broadcom Limited | - | Tray | Active | - | BCM33838 | - | ROHS3 Compliant | 1 (Unlimited) | 0000.00.0000 | 1 | |||||||||||||||
 |
XCVC1802-2LLEVSVD1760 | 36.0000 | |
7240 | 0.00000000 | AMD | Versal™ AI Core | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVC1802-2LLEVSVD1760 | 3A001A7B | 8542.39.0001 | 1 | MPU, FPGA | 692 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 450MHz, 1.08GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ AI Core FPGA, 1.5M Logic Cells | |||
 |
1SX280HU3F50E3VGS3 | 20.0000 | |
2568 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Discontinued at SIC | 0°C ~ 100°C (TJ) | 2397-BBGA, FCBGA | 2397-FBGA, FC (50x50) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HU3F50E3VGS3 | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
|
AGIB027R31B2E2VR0 | 82.0000 | |
1277 | 0.00000000 | Intel | Agilex I | Tray | Active | 0°C ~ 100°C (TJ) | - | - | download | 3 (168 Hours) | 544-AGIB027R31B2E2VR0 | 1 | MPU, FPGA | 720 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | 1.4GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2.7M Logic Elements | ||||||
|
M2S150TS-FC1152 | 519.6763 | |
2405 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | 0°C ~ 85°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
XCZU9EG-L1FFVB1156I | 4.0000 | |
7445 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Bulk | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | XCZU9 | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.31.0001 | 1 | MCU, FPGA | 328 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ||
 |
A2F500M3G-1FGG484I | 121.1375 | |
2176 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | -40°C ~ 100°C (TJ) | 484-BGA | A2F500 | 484-FPBGA (23x23) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 60 | MCU, FPGA | MCU - 41, FPGA - 128 | ARM® Cortex®-M3 | 100MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 512KB | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | ||
 |
5ASXFB3H4F40I3G | 5.0000 | |
2380 | 0.00000000 | Intel | Arria V SX | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 544-5ASXFB3H4F40I3G | 21 | MCU, FPGA | MCU - 208, FPGA - 540 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.05GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 350K Logic Elements | ||||
 |
5CSEBA6U19I7N | 330.0900 | |
5499 | 0.00000000 | Intel | Cyclone® V SE | Tray | Active | -40°C ~ 100°C (TJ) | 484-FBGA | 5CSEBA6 | 484-UBGA (19x19) | - | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 84 | MCU, FPGA | MCU - 151, FPGA - 66 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 800MHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 64KB | - | FPGA - 110K Logic Elements | ||
|
BCM3379KPBG | - | |
4903 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | - | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 60 | |||||||||||||||||
|
M2S050TS-VFG400I | 179.0236 | |
5291 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 400-LFBGA | M2S050 | 400-VFBGA (17x17) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 207 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 256KB | FPGA - 50K Logic Modules | ||
 |
XCZU43DR-1FFVE1156I | 19.0000 | |
4597 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | -40°C ~ 100°C (TJ) | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU43DR-1FFVE1156I | 1 | MCU, FPGA | 366 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
 |
XCVM1802-1MSIVSVA2197 | 11.0000 | |
6298 | 0.00000000 | AMD | Versal™ Prime | Tray | Active | -40°C ~ 100°C (TJ) | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCVM1802-1MSIVSVA2197 | 1 | MPU, FPGA | 770 | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Versal™ Prime FPGA, 1.9M Logic Cells | |||||
|
M2S150-1FCS536I | 531.8869 | |
5769 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 536-LFBGA, CSPBGA | M2S150 | 536-CSPBGA (16x16) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 90 | MCU, FPGA | 293 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
1SX280HH3F55I2LG | 35.0000 | |
2442 | 0.00000000 | Intel | Stratix® 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 2912-BBGA, FCBGA | 2912-FBGA, FC (55x55) | download | 3 (168 Hours) | REACH Unaffected | 544-1SX280HH3F55I2LG | 1 | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | FPGA - 2800K Logic Elements | ||||||
|
AGFB008R24D2E2V | 21.0000 | |
6085 | 0.00000000 | Intel | * | Tray | Active | - | 544-AGFB008R24D2E2V | 3 | |||||||||||||||||||
 |
XCZU6EG-L1FFVC900I | 3.0000 | |
6205 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 900-BBGA, FCBGA | XCZU6 | 900-FCBGA (31x31) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 204 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 500MHz, 600MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ||
|
BCM3309SA01 | - | |
4646 | 0.00000000 | Broadcom Limited | * | Tray | Obsolete | BCM3309 | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | OBSOLETE | 0000.00.0000 | 1 | ||||||||||||||
 |
10AS066N4F40I3LG | 6.0000 | |
9683 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | -40°C ~ 100°C (TJ) | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965106 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 588 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
|
XCZU19EG-2FFVD1760I | 11.0000 | |
4274 | 0.00000000 | AMD | Zynq® UltraScale+™ MPSoC EG | Tray | Active | -40°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | XCZU19 | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | REACH Unaffected | 5A002A4 XIL | 8542.39.0001 | 1 | MCU, FPGA | 308 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 533MHz, 600MHz, 1.3GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, WDT | 256KB | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ||
 |
M2S005S-VF256I | 26.9135 | |
8290 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 256-LFBGA | M2S005 | 256-FPBGA (14x14) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 119 | MCU, FPGA | 161 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | 64KB | 128KB | FPGA - 5K Logic Modules | ||
|
M2S150T-1FC1152I | 564.2600 | |
4451 | 0.00000000 | Microchip Technology | SmartFusion®2 | Tray | Active | -40°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | M2S150 | 1152-FCBGA (35x35) | download | RoHS non-compliant | 3 (168 Hours) | REACH Unaffected | 3A001A7A | 8542.39.0001 | 24 | MCU, FPGA | 574 | ARM® Cortex®-M3 | 166MHz | CANbus, Ethernet, I²C, SPI, UART/USART, USB | DDR, PCIe, SERDES | 64KB | 512KB | FPGA - 150K Logic Modules | ||
 |
XCZU49DR-1FSVF1760E | 22.0000 | |
4662 | 0.00000000 | AMD | Zynq® UltraScale+™ RFSoC | Tray | Active | 0°C ~ 100°C (TJ) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | download | ROHS3 Compliant | 4 (72 Hours) | 122-XCZU49DR-1FSVF1760E | 1 | MCU, FPGA | 622 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 500MHz, 1.2GHz | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DDR, DMA, PCIe | 256KB | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | |||||
 |
10AS066K2F35E2LG | 6.0000 | |
8126 | 0.00000000 | Intel | Arria 10 SX | Tray | Active | 0°C ~ 100°C (TJ) | 1152-BBGA, FCBGA | 1152-FBGA, FC (35x35) | download | RoHS Compliant | 3 (168 Hours) | REACH Unaffected | 965101 | 3A001A7B | 8542.39.0001 | 1 | MCU, FPGA | 396 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 1.5GHz | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | DMA, POR, WDT | 256KB | - | FPGA - 660K Logic Elements | ||
 |
A2F200M3F-PQG208 | - | |
3063 | 0.00000000 | Microchip Technology | SmartFusion® | Tray | Active | 0°C ~ 85°C (TJ) | 208-BFQFP | A2F200 | 208-PQFP (28x28) | download | ROHS3 Compliant | 3 (168 Hours) | REACH Unaffected | 3A991D | 8542.39.0001 | 1 | MCU, FPGA | MCU - 22, FPGA - 66 | ARM® Cortex®-M3 | 80MHz | EBI/EMI, Ethernet, I²C, SPI, UART/USART | DMA, POR, WDT | 64KB | 256KB | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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