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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
317-91-121-41-005000 Mill-Max Manufacturing Corp. 317-91-121-41-005000 13.6760
RFQ
ECAD 2649 0.00000000 Mill-Max Manufacturing Corp. 317 Tube Active -55°C ~ 125°C Through Hole SIP - 317-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 21 (1 x 21) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) 10mOhm
115-93-428-41-001000 Mill-Max Manufacturing Corp. 115-93-428-41-001000 14.3798
RFQ
ECAD 3389 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 115-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
APO-308-T-T Samtec Inc. APO-308-T-T 3.0000
RFQ
ECAD 4495 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-308-T-T 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
126-43-324-41-002000 Mill-Max Manufacturing Corp. 126-43-324-41-002000 16.1272
RFQ
ECAD 3595 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 126-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.543" (13.79mm) 10mOhm
116-93-320-41-001000 Mill-Max Manufacturing Corp. 116-93-320-41-001000 16.3562
RFQ
ECAD 6427 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
614-93-100-10-000001 Mill-Max Manufacturing Corp. 614-93-100-10-000001 -
RFQ
ECAD 3401 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Closed Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
28-6551-11 Aries Electronics 28-6551-11 17.6589
RFQ
ECAD 7497 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 28-6551 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
32-9503-31 Aries Electronics 32-9503-31 23.8067
RFQ
ECAD 4586 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 32-9503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
614-43-432-31-007000 Mill-Max Manufacturing Corp. 614-43-432-31-007000 15.8983
RFQ
ECAD 6494 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 614-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
2-641612-1 TE Connectivity AMP Connectors 2-641612-1 -
RFQ
ECAD 9042 0.00000000 TE Connectivity AMP Connectors Diplomate DL Tube Obsolete -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 Thermoplastic UL94 V-0 0.100" (2.54mm) Tin - Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.120" (3.05mm) 30mOhm
14-1508-20 Aries Electronics 14-1508-20 5.6419
RFQ
ECAD 5125 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 14-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
515-93-225-18-091001 Mill-Max Manufacturing Corp. 515-93-225-18-091001 -
RFQ
ECAD 7008 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 225 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
XR2A2201N Omron Electronics Inc-EMC Div XR2A2201N 4.9741
RFQ
ECAD 4970 0.00000000 Omron Electronics Inc-EMC Div XR2 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame XR2A Solder download RoHS Compliant 1 (Unlimited) XR2A-2201-N EAR99 8536.69.4040 22 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 29.5µin (0.75µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.138" (3.50mm) 20mOhm
510-91-120-13-061002 Mill-Max Manufacturing Corp. 510-91-120-13-061002 27.6366
RFQ
ECAD 4809 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 120 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
44-652000-11-RC Aries Electronics 44-652000-11-RC 52.3167
RFQ
ECAD 7199 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 44-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
110-87-318-41-105191 Preci-Dip 110-87-318-41-105191 1.3183
RFQ
ECAD 4985 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-87 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 550 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
116-83-306-41-007101 Preci-Dip 116-83-306-41-007101 0.7120
RFQ
ECAD 3211 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 70 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
110-47-310-41-105000 Mill-Max Manufacturing Corp. 110-47-310-41-105000 12.2113
RFQ
ECAD 5477 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
09-0503-30 Aries Electronics 09-0503-30 4.1208
RFQ
ECAD 1860 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 09-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
24-3570-11 Aries Electronics 24-3570-11 20.3546
RFQ
ECAD 2958 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
515-13-441-21-000001 Mill-Max Manufacturing Corp. 515-13-441-21-000001 -
RFQ
ECAD 7175 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 441 (21 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
116-93-422-41-008000 Mill-Max Manufacturing Corp. 116-93-422-41-008000 16.0678
RFQ
ECAD 3833 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
110-99-952-61-001000 Mill-Max Manufacturing Corp. 110-99-952-61-001000 22.6825
RFQ
ECAD 5952 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing 110-99 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
APO-316-G-C Samtec Inc. APO-316-G-C 11.1800
RFQ
ECAD 4736 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-316-G-C 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
116-91-642-41-003000 Mill-Max Manufacturing Corp. 116-91-642-41-003000 15.5135
RFQ
ECAD 1846 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.315" (8.00mm) 10mOhm
540-99-052-17-400200 Mill-Max Manufacturing Corp. 540-99-052-17-400200 -
RFQ
ECAD 1969 0.00000000 Mill-Max Manufacturing Corp. 540 Tube Obsolete - Surface Mount PLCC Closed Frame 540-99 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED80018 EAR99 8536.69.4040 20 Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 52 (4 x 13) - 0.050" (1.27mm) - - 20mOhm
ICA-316-SGT Samtec Inc. ICA-316-SGT 4.1200
RFQ
ECAD 4 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame ICA-316 Solder download ROHS3 Compliant 1 (Unlimited) REACH Affected SAM15987 EAR99 8536.69.4040 28 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
612-83-636-41-001101 Preci-Dip 612-83-636-41-001101 3.4848
RFQ
ECAD 8924 0.00000000 Preci-Dip 612 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm
110-13-424-41-001000 Mill-Max Manufacturing Corp. 110-13-424-41-001000 14.9053
RFQ
ECAD 3274 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 110-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
614-93-154-13-021001 Mill-Max Manufacturing Corp. 614-93-154-13-021001 -
RFQ
ECAD 6619 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active - Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 154 (13 x 13) Beryllium Copper 0.100" (2.54mm) - 0.165" (4.19mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse