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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
26-1518-10H Aries Electronics 26-1518-10H 2.8886
RFQ
ECAD 2935 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 26-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
515-13-065-10-051003 Mill-Max Manufacturing Corp. 515-13-065-10-051003 -
RFQ
ECAD 4859 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 65 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
48-6570-11 Aries Electronics 48-6570-11 34.1150
RFQ
ECAD 8654 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
116-43-314-61-008000 Mill-Max Manufacturing Corp. 116-43-314-61-008000 21.9645
RFQ
ECAD 7649 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 28 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
24-6508-212 Aries Electronics 24-6508-212 20.6325
RFQ
ECAD 5260 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
40-6822-90T Aries Electronics 40-6822-90T 18.7509
RFQ
ECAD 4973 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 40-6822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
16-8510-310C Aries Electronics 16-8510-310C 10.0717
RFQ
ECAD 9064 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8510 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
50-9513-10H Aries Electronics 50-9513-10H 13.5549
RFQ
ECAD 2297 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 50-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
126-41-420-41-003000 Mill-Max Manufacturing Corp. 126-41-420-41-003000 17.0052
RFQ
ECAD 5660 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 126-41 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.661" (16.79mm) 10mOhm
612-93-432-41-004000 Mill-Max Manufacturing Corp. 612-93-432-41-004000 18.3133
RFQ
ECAD 7814 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 612-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.273" (6.93mm) 10mOhm
116-87-636-41-004101 Preci-Dip 116-87-636-41-004101 6.8564
RFQ
ECAD 6609 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
614-87-175-16-072112 Preci-Dip 614-87-175-16-072112 19.7846
RFQ
ECAD 8514 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 175 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
NTE419 NTE Electronics, Inc NTE419 2.8800
RFQ
ECAD 503 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole Transistor, TO-5 and TO-39 - Solder download RoHS non-compliant 2368-NTE419 EAR99 8535.90.8040 1 - - - - - - 3 (Round) - - - - -
IC200-2084-010 Yamaichi Electronics IC200-2084-010 230.8200
RFQ
ECAD 7 0.00000000 Yamaichi Electronics - Box Active -40°C ~ 150°C - IC200 Chip Carrier Black - download ROHS3 Compliant 2 (1 Year) 2408-IC200-2084-010 EAR99 8542.39.0000 1 - Polyetherimide (PEI), Glass Filled - 208
116-41-636-41-007000 Mill-Max Manufacturing Corp. 116-41-636-41-007000 15.6727
RFQ
ECAD 2543 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm
100-032-050 3M 100-032-050 -
RFQ
ECAD 2195 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 100-032 Solder download 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
110-87-324-41-001151 Preci-Dip 110-87-324-41-001151 0.7530
RFQ
ECAD 2364 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame, No Center Bar 110-87 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
4601 Keystone Electronics 4601 2.2600
RFQ
ECAD 3 0.00000000 Keystone Electronics - Bulk Active - Chassis Mount Transistor, TO-3 Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polyester, Glass Filled UL94 V-0 - Tin - Tin - 3 (Oval) Brass - Brass - -
515-91-032-01-503002 Mill-Max Manufacturing Corp. 515-91-032-01-503002 -
RFQ
ECAD 7749 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 32 (1 x 1) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
SMPX-28LCC-N-TR Kycon, Inc. SMPX-28LCC-N-TR 0.8908
RFQ
ECAD 6473 0.00000000 Kycon, Inc. SMPX Tape & Reel (TR) Active -50°C ~ 105°C Surface Mount PLCC Closed Frame SMPX-28L Solder download RoHS Compliant 1 (Unlimited) 2092-SMPX-28LCC-N-TR EAR99 8536.69.4040 450 1 A Thermoplastic, Glass Filled - 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin - 28 (4 x 7) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 15mOhm
21-0508-21 Aries Electronics 21-0508-21 14.4432
RFQ
ECAD 3226 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 21-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 21 (1 x 21) Beryllium Copper - Brass 0.360" (9.14mm) -
551-10-168-17-105005 Mill-Max Manufacturing Corp. 551-10-168-17-105005 -
RFQ
ECAD 4082 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 168 (17 x 17) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
ICO-286-S8A-T 3M ICO-286-S8A-T -
RFQ
ECAD 2319 0.00000000 3M ICO Tube Obsolete -65°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame ICO-286 Solder download RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 840 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.130" (3.30mm) -
38-0508-30 Aries Electronics 38-0508-30 13.5721
RFQ
ECAD 7418 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 38-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 38 (1 x 38) Beryllium Copper - Brass 0.500" (12.70mm) -
546-87-192-14-001136 Preci-Dip 546-87-192-14-001136 17.3263
RFQ
ECAD 9423 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold Flash Tin - 192 (14 x 14) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
84-PGM13042-10T Aries Electronics 84-PGM13042-10T 39.1873
RFQ
ECAD 2741 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 84-PGM1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
551-90-323-21-005005 Mill-Max Manufacturing Corp. 551-90-323-21-005005 -
RFQ
ECAD 9260 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 323 (21 x 21) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
117-93-642-41-005000 Mill-Max Manufacturing Corp. 117-93-642-41-005000 7.5600
RFQ
ECAD 71 0.00000000 Mill-Max Manufacturing Corp. 117 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) -
510-91-289-17-000001 Mill-Max Manufacturing Corp. 510-91-289-17-000001 39.1256
RFQ
ECAD 5480 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 289 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
242-1281-39-0602J 3M 242-1281-39-0602J -
RFQ
ECAD 2600 0.00000000 3M Textool™ Box Obsolete -55°C ~ 125°C Through Hole Closed Frame Wire Wrap download 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse