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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
110-87-320-41-605101 Preci-Dip 110-87-320-41-605101 0.7504
RFQ
ECAD 4213 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
115-44-640-41-003000 Mill-Max Manufacturing Corp. 115-44-640-41-003000 13.7996
RFQ
ECAD 8562 0.00000000 Mill-Max Manufacturing Corp. 115 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-44 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.095" (2.41mm) 10mOhm
116-87-420-41-011101 Preci-Dip 116-87-420-41-011101 2.7482
RFQ
ECAD 6739 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
09-0503-31 Aries Electronics 09-0503-31 6.7932
RFQ
ECAD 9772 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 09-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 9 (1 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
50-9508-21 Aries Electronics 50-9508-21 54.6175
RFQ
ECAD 9401 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Open Frame 50-9508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
2134440-3 TE Connectivity AMP Connectors 2134440-3 -
RFQ
ECAD 1196 0.00000000 TE Connectivity AMP Connectors - Tray Obsolete - - 2134440 Backplate Silver LGA 2011 Connectors download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8538.90.8180 100 UL94 V-0 Steel Nickel
220-7201-55-1902 3M 220-7201-55-1902 46.2800
RFQ
ECAD 20 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 220 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
510-93-145-15-002001 Mill-Max Manufacturing Corp. 510-93-145-15-002001 32.6134
RFQ
ECAD 8829 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - 145 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
08-6511-11 Aries Electronics 08-6511-11 6.5821
RFQ
ECAD 2450 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 08-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
191-PGM18015-10T Aries Electronics 191-PGM18015-10T 91.1327
RFQ
ECAD 1700 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 191-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
299-43-306-11-001000 Mill-Max Manufacturing Corp. 299-43-306-11-001000 4.5066
RFQ
ECAD 4165 0.00000000 Mill-Max Manufacturing Corp. 299 Tube Active -55°C ~ 125°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 299-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 68 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.126" (3.20mm) -
0475968735 Molex 0475968735 -
RFQ
ECAD 9140 0.00000000 Molex * Bulk Obsolete 047596 - 1 (Unlimited) 80
116-83-322-41-003101 Preci-Dip 116-83-322-41-003101 1.9796
RFQ
ECAD 1179 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
D01-9971742 Harwin Inc. D01-9971742 -
RFQ
ECAD 2741 0.00000000 Harwin Inc. D01-997 Tube Active -55°C ~ 125°C Through Hole SIP - D01-997 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 300 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin 196.9µin (5.00µm) 17 (1 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
2134440-5 TE Connectivity AMP Connectors 2134440-5 -
RFQ
ECAD 1073 0.00000000 TE Connectivity AMP Connectors - Bulk Active - - 2134440 Backplate Silver LGA 2011 Connectors download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.8000 200 UL94 V-0 Steel Nickel
614-83-324-41-001101 Preci-Dip 614-83-324-41-001101 1.8645
RFQ
ECAD 9915 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
D01-9970342 Harwin Inc. D01-9970342 0.5600
RFQ
ECAD 6744 0.00000000 Harwin Inc. D01-997 Tube Active -55°C ~ 125°C Through Hole SIP - D01-997 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 4,800 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin 196.9µin (5.00µm) 3 (1 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ICF-308-S-O-TR Samtec Inc. ICF-308-S-O-TR 3.9600
RFQ
ECAD 119 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame ICF-308 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 450 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
24-3553-16 Aries Electronics 24-3553-16 44.6840
RFQ
ECAD 5927 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 24-3553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
22-6820-90C Aries Electronics 22-6820-90C 10.4171
RFQ
ECAD 4244 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 22-6820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
116-91-648-41-006000 Mill-Max Manufacturing Corp. 116-91-648-41-006000 15.8091
RFQ
ECAD 1569 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.236" (5.99mm) 10mOhm
ICA-628-WTT-3 Samtec Inc. ICA-628-WTT-3 6.0050
RFQ
ECAD 7635 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-628-WTT-3 16 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
D01-9971142 Harwin Inc. D01-9971142 -
RFQ
ECAD 9063 0.00000000 Harwin Inc. D01-997 Tube Active -55°C ~ 125°C Through Hole SIP - D01-997 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 900 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin 196.9µin (5.00µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
36-6511-11 Aries Electronics 36-6511-11 14.1994
RFQ
ECAD 5888 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 36-6511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
116-83-652-41-011101 Preci-Dip 116-83-652-41-011101 8.9624
RFQ
ECAD 2668 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
18-351000-10 Aries Electronics 18-351000-10 21.0743
RFQ
ECAD 9022 0.00000000 Aries Electronics Correct-A-Chip® 351000 Bulk Active - Through Hole - 18-3510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.3" (7.62mm) Row Spacing 18 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1825093-1 TE Connectivity AMP Connectors 1825093-1 -
RFQ
ECAD 7285 0.00000000 TE Connectivity AMP Connectors Diplomate DL Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 70 Thermoplastic, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 15.0µin (0.38µm) 6 (2 x 3) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.128" (3.24mm) 30mOhm
IC51-0804-808 Yamaichi Electronics IC51-0804-808 55.5500
RFQ
ECAD 10 0.00000000 Yamaichi Electronics IC51 Box Active - - IC51-0804 Chip Carrier Black IC Sockets download ROHS3 Compliant 2 (1 Year) REACH Unaffected 2408-IC51-0804-808 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 80
515-93-256-16-000001 Mill-Max Manufacturing Corp. 515-93-256-16-000001 -
RFQ
ECAD 6168 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 256 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
24-4508-31 Aries Electronics 24-4508-31 24.1665
RFQ
ECAD 1591 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 24-4508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse