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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
SIP050-1X11-160BLF Amphenol ICC (FCI) SIP050-1X11-160BLF -
RFQ
ECAD 1524 0.00000000 Amphenol ICC (FCI) SIP050-1x Bulk Obsolete - Through Hole SIP Closed Frame SIP050 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) -
40-0501-30 Aries Electronics 40-0501-30 16.1856
RFQ
ECAD 3921 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 40-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 40 (1 x 40) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
2-640463-2 TE Connectivity AMP Connectors 2-640463-2 -
RFQ
ECAD 1369 0.00000000 TE Connectivity AMP Connectors Diplomate DL Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 640463 Solder download Not applicable 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 5,200 Thermoplastic, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.128" (3.24mm) 30mOhm
127-41-652-41-002000 Mill-Max Manufacturing Corp. 127-41-652-41-002000 18.0951
RFQ
ECAD 6064 0.00000000 Mill-Max Manufacturing Corp. 127 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 127-41 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.370" (9.40mm) 10mOhm
1571550-8 TE Connectivity AMP Connectors 1571550-8 -
RFQ
ECAD 2851 0.00000000 TE Connectivity AMP Connectors 500 Tube Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 1571550 Solder download RoHS Compliant 1 (Unlimited) 524-AG12D-LF EAR99 8536.69.4040 500 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) 10mOhm
510-13-223-18-098001 Mill-Max Manufacturing Corp. 510-13-223-18-098001 54.4296
RFQ
ECAD 5382 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICA-628-JGG Samtec Inc. ICA-628-JGG 14.5219
RFQ
ECAD 9070 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-628-JGG 16 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-640-ZWGG-2 Samtec Inc. ICA-640-ZWGG-2 17.7855
RFQ
ECAD 9295 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-640-ZWGG-2 11 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICO-648-SGT Samtec Inc. ICO-648-SGT 11.3600
RFQ
ECAD 1359 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-648-SGT 9 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
523-13-072-09-001003 Mill-Max Manufacturing Corp. 523-13-072-09-001003 -
RFQ
ECAD 8955 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 72 (9 x 9) - 0.100" (2.54mm) - 0.510" (12.95mm) -
ICF-624-TM-O-TR Samtec Inc. ICF-624-TM-O-TR 3.0755
RFQ
ECAD 2443 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-624-TM-O-TR 275 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICO-322-JGG Samtec Inc. ICO-322-JGG 12.2305
RFQ
ECAD 7230 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-322-JGG 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICF-632-T-O-TR Samtec Inc. ICF-632-T-O-TR 4.0653
RFQ
ECAD 5868 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-632-T-O-TR 275 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICF-320-T-I-TR Samtec Inc. ICF-320-T-I-TR 2.5068
RFQ
ECAD 3000 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-320-T-I-TR 575 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
ICA-316-ZWGG-3 Samtec Inc. ICA-316-ZWGG-3 8.4689
RFQ
ECAD 6616 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-316-ZWGG-3 28 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICO-314-ZSST Samtec Inc. ICO-314-ZSST 3.0400
RFQ
ECAD 6196 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-314-ZSST 32 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICO-322-LGG Samtec Inc. ICO-322-LGG 8.4880
RFQ
ECAD 8322 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-322-LGG 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
116-41-320-41-008000 Mill-Max Manufacturing Corp. 116-41-320-41-008000 14.8417
RFQ
ECAD 6002 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
7131-108-18 Aries Electronics 7131-108-18 -
RFQ
ECAD 1718 0.00000000 Aries Electronics - Bulk Active - Through Hole - 7131-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead 200.0µin (5.08µm) HB2E Relay DIP, 0.3" (7.62mm) Row Spacing 8 - - Brass 0.125" (3.18mm) FR4 Epoxy Glass
18-6513-11 Aries Electronics 18-6513-11 3.9188
RFQ
ECAD 4675 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 18-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
ICF-328-TL-I-TR Samtec Inc. ICF-328-TL-I-TR 3.2280
RFQ
ECAD 5572 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-328-TL-I-TR 575 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
116-41-324-41-001000 Mill-Max Manufacturing Corp. 116-41-324-41-001000 16.7236
RFQ
ECAD 2359 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.594" (15.09mm) 10mOhm
511-91-179-18-095003 Mill-Max Manufacturing Corp. 511-91-179-18-095003 -
RFQ
ECAD 1910 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 179 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
03-7880-10 Aries Electronics 03-7880-10 7.5417
RFQ
ECAD 8866 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 03-7880 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 3 (1 x 3) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
ICA-318-ZWGG Samtec Inc. ICA-318-ZWGG 9.5444
RFQ
ECAD 1747 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-318-ZWGG 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-308-WGG-3 Samtec Inc. ICA-308-WGG-3 5.3127
RFQ
ECAD 3669 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-308-WGG-3 56 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
APO-324-G-C Samtec Inc. APO-324-G-C 16.0100
RFQ
ECAD 5136 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-324-G-C 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICF-320-TL-I Samtec Inc. ICF-320-TL-I 3.8600
RFQ
ECAD 5636 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-320-TL-I 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
APO-324-T-H Samtec Inc. APO-324-T-H 8.7100
RFQ
ECAD 8773 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-324-T-H 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
115-87-624-41-003101 Preci-Dip 115-87-624-41-003101 1.1502
RFQ
ECAD 5657 0.00000000 Preci-Dip 115 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 115-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.095" (2.41mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse