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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
523-93-059-11-001003 Mill-Max Manufacturing Corp. 523-93-059-11-001003 -
RFQ
ECAD 8482 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 59 (11 x 11) - 0.100" (2.54mm) - 0.510" (12.95mm) -
114-41-952-41-117000 Mill-Max Manufacturing Corp. 114-41-952-41-117000 16.0227
RFQ
ECAD 8976 0.00000000 Mill-Max Manufacturing Corp. 114 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.9" (22.86mm) Row Spacing Open Frame 114-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy - 10mOhm
551-90-299-20-096003 Mill-Max Manufacturing Corp. 551-90-299-20-096003 -
RFQ
ECAD 8478 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 299 (20 x 20) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
612-41-306-41-001000 Mill-Max Manufacturing Corp. 612-41-306-41-001000 13.5113
RFQ
ECAD 8857 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 612-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 68 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
20-7625-10 Aries Electronics 20-7625-10 11.5988
RFQ
ECAD 1853 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7625 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
APO-640-G-A1 Samtec Inc. APO-640-G-A1 16.9110
RFQ
ECAD 5652 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-640-G-A1 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
110-93-318-41-001000 Mill-Max Manufacturing Corp. 110-93-318-41-001000 2.1300
RFQ
ECAD 1 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 22 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
APA-308-T-A1 Samtec Inc. APA-308-T-A1 2.1300
RFQ
ECAD 1617 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-308 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICA-624-SGT Samtec Inc. ICA-624-SGT 5.6172
RFQ
ECAD 5626 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-624-SGT 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
550-10-420M26-001166 Preci-Dip 550-10-420M26-001166 53.6109
RFQ
ECAD 5295 0.00000000 Preci-Dip 550 Bulk Active -55°C ~ 125°C Through Hole BGA Closed Frame 550-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 420 (26 x 26) Beryllium Copper 0.050" (1.27mm) Brass 0.098" (2.50mm) 10mOhm
ICO-624-ZMGG Samtec Inc. ICO-624-ZMGG 10.4117
RFQ
ECAD 5431 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-624-ZMGG 18 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICF-308-S-I Samtec Inc. ICF-308-S-I 3.3300
RFQ
ECAD 3292 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-308-S-I 56 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
510-11-069-11-061001 Mill-Max Manufacturing Corp. 510-11-069-11-061001 28.2698
RFQ
ECAD 5410 0.00000000 Mill-Max Manufacturing Corp. 510 Tube Active -55°C ~ 125°C Through Hole PGA Open Frame 510-11 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) - - - - 69 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
22-6823-90T Aries Electronics 22-6823-90T 9.9626
RFQ
ECAD 8011 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 22-6823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
34-1508-21 Aries Electronics 34-1508-21 21.8595
RFQ
ECAD 3307 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Closed Frame 34-1508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 34 (2 x 17) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
110-83-320-41-105191 Preci-Dip 110-83-320-41-105191 1.8876
RFQ
ECAD 5747 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-83 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 550 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
116-41-320-41-003000 Mill-Max Manufacturing Corp. 116-41-320-41-003000 14.0948
RFQ
ECAD 5528 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.315" (8.00mm) 10mOhm
114-83-320-41-134191 Preci-Dip 114-83-320-41-134191 1.4328
RFQ
ECAD 2681 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-83 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 800 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
21-0518-11 Aries Electronics 21-0518-11 2.8886
RFQ
ECAD 3368 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 21-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 21 (1 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
97-56001-P Aries Electronics 97-56001-P -
RFQ
ECAD 3313 0.00000000 Aries Electronics Correct-A-Chip® 97-56001 Bulk Discontinued at SIC - Through Hole - 97-5600 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) QFP PGA 169 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
ICA-640-ZSGG-L Samtec Inc. ICA-640-ZSGG-L 14.5546
RFQ
ECAD 8657 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-640-ZSGG-L 11 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
510-87-223-18-092101 Preci-Dip 510-87-223-18-092101 7.3773
RFQ
ECAD 6782 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 223 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
10-6822-90C Aries Electronics 10-6822-90C 6.9690
RFQ
ECAD 1211 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 10-6822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
14-3508-302 Aries Electronics 14-3508-302 9.0960
RFQ
ECAD 7197 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 14-3508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
ICA-320-ZWGG Samtec Inc. ICA-320-ZWGG 11.0291
RFQ
ECAD 4501 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-320-ZWGG 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
2013620-3 TE Connectivity AMP Connectors 2013620-3 -
RFQ
ECAD 2952 0.00000000 TE Connectivity AMP Connectors - Tape & Reel (TR) Active - Surface Mount PGA, ZIF (ZIP) Open Frame 2013620 Solder - ROHS3 Compliant 1 (Unlimited) Vendor Undefined 2266-2013620-3 EAR99 8536.69.8000 360 Thermoplastic UL94 V-0 0.039" (1.00mm) Gold 15.0µin (0.38µm) - - 989 (35 x 36) Copper Alloy 0.039" (1.00mm) Copper Alloy - -
116-83-610-41-012101 Preci-Dip 116-83-610-41-012101 1.0388
RFQ
ECAD 1246 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 42 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
515-13-100-13-062001 Mill-Max Manufacturing Corp. 515-13-100-13-062001 -
RFQ
ECAD 2789 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 100 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
117-47-428-41-005000 Mill-Max Manufacturing Corp. 117-47-428-41-005000 14.8057
RFQ
ECAD 9575 0.00000000 Mill-Max Manufacturing Corp. 117 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 117-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold Flash Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) 10mOhm
145-PRS15058-12 Aries Electronics 145-PRS15058-12 94.2640
RFQ
ECAD 5968 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 145-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse