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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
ICA-422-JGG Samtec Inc. ICA-422-JGG 13.8000
RFQ
ECAD 4853 0.00000000 Samtec Inc. ICA Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-422-JGG 1 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
510-83-100-15-001101 Preci-Dip 510-83-100-15-001101 5.8100
RFQ
ECAD 4571 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 100 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
09-0508-31 Aries Electronics 09-0508-31 6.9659
RFQ
ECAD 2814 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 09-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 9 (1 x 9) Beryllium Copper - Brass 0.500" (12.70mm) -
ICA-318-AGG Samtec Inc. ICA-318-AGG 9.2764
RFQ
ECAD 6110 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-318-AGG 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
511-13-121-11-000001 Mill-Max Manufacturing Corp. 511-13-121-11-000001 -
RFQ
ECAD 6799 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 121 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
APO-314-T-A Samtec Inc. APO-314-T-A 3.4300
RFQ
ECAD 3903 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-314-T-A 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
510-83-160-16-081101 Preci-Dip 510-83-160-16-081101 8.4756
RFQ
ECAD 9361 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 160 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
522-13-069-11-061003 Mill-Max Manufacturing Corp. 522-13-069-11-061003 -
RFQ
ECAD 5271 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 69 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
ICF-328-STL-O-TR Samtec Inc. ICF-328-STL-O-TR 6.8993
RFQ
ECAD 2473 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-328-STL-O-TR 350 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
08-7625-10 Aries Electronics 08-7625-10 6.4479
RFQ
ECAD 1017 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7625 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
ICO-318-MGT Samtec Inc. ICO-318-MGT 5.4040
RFQ
ECAD 1806 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-318-MGT 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
ICA-314-ZWGG-3 Samtec Inc. ICA-314-ZWGG-3 7.7794
RFQ
ECAD 4843 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-314-ZWGG-3 32 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
515-13-088-12-052003 Mill-Max Manufacturing Corp. 515-13-088-12-052003 -
RFQ
ECAD 9911 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 88 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
ICA-320-SGG-L Samtec Inc. ICA-320-SGG-L 7.0573
RFQ
ECAD 5666 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-320-SGG-L 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
14-7380-10 Aries Electronics 14-7380-10 10.7988
RFQ
ECAD 2842 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 14-7380 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (1 x 14) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
110-43-640-41-105000 Mill-Max Manufacturing Corp. 110-43-640-41-105000 16.9056
RFQ
ECAD 6338 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICF-314-S-O-TR Samtec Inc. ICF-314-S-O-TR 3.2795
RFQ
ECAD 1184 0.00000000 Samtec Inc. ICF Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-314-S-O-TR 475 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
28-6822-90C Aries Electronics 28-6822-90C 13.5403
RFQ
ECAD 1165 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-6822 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
ICF-648-SM-I Samtec Inc. ICF-648-SM-I -
RFQ
ECAD 6509 0.00000000 Samtec Inc. ICF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-648-SM-I 9 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold - Tin - 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
528-AG12D-LF TE Connectivity AMP Connectors 528-AG12D-LF -
RFQ
ECAD 6381 0.00000000 TE Connectivity AMP Connectors 500 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 528 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 425 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin - Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) 10mOhm
24-6518-10M Aries Electronics 24-6518-10M 4.8167
RFQ
ECAD 7557 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 24-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
612-41-636-41-004000 Mill-Max Manufacturing Corp. 612-41-636-41-004000 18.3558
RFQ
ECAD 1516 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.273" (6.93mm) 10mOhm
100-018-000 3M 100-018-000 -
RFQ
ECAD 8463 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 100-018 Solder - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
2-1571551-2 TE Connectivity AMP Connectors 2-1571551-2 -
RFQ
ECAD 2125 0.00000000 TE Connectivity AMP Connectors 500 Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 1571551 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 60 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Gold Flash 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Nickel 0.125" (3.18mm) 10mOhm
D83028C-46 Harwin Inc. D83028C-46 -
RFQ
ECAD 3259 0.00000000 Harwin Inc. D830 Tube Obsolete -50°C ~ 105°C Surface Mount PLCC Board Guide, Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 33 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.050" (1.27mm) Tin - Tin - 28 (4 x 7) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 30mOhm
8468-21A1-RK-TP 3M 8468-21A1-RK-TP 2.9100
RFQ
ECAD 38 0.00000000 3M 8400 Tube Active -40°C ~ 105°C Surface Mount PLCC Closed Frame 8468 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 19 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 68 (4 x 17) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) -
ICF-308-T-I Samtec Inc. ICF-308-T-I 1.5554
RFQ
ECAD 4289 0.00000000 Samtec Inc. iCF Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame ICF-308 Solder - ROHS3 Compliant 1 (Unlimited) EAR99 8536.69.4040 56 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
20-7420-10 Aries Electronics 20-7420-10 11.5988
RFQ
ECAD 9289 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7420 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
C8124-04 Aries Electronics C8124-04 -
RFQ
ECAD 1494 0.00000000 Aries Electronics Edge-Grip™, C81 Bulk Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame Wire Wrap download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.675" (17.15mm) -
523-13-145-17-001003 Mill-Max Manufacturing Corp. 523-13-145-17-001003 -
RFQ
ECAD 9497 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 145 (17 x 17) - 0.100" (2.54mm) - 0.510" (12.95mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse