SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
515-13-084-12-051002 Mill-Max Manufacturing Corp. 515-13-084-12-051002 -
RFQ
ECAD 4604 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 84 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
ICA-314-SST Samtec Inc. ICA-314-SST 3.1300
RFQ
ECAD 693 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame ICA-314 Solder download ROHS3 Compliant 1 (Unlimited) REACH Affected EAR99 8536.69.4040 32 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APA-422-G-A Samtec Inc. APA-422-G-A 11.9700
RFQ
ECAD 7993 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-422 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
ICA-640-SST-L Samtec Inc. ICA-640-SST-L 7.6100
RFQ
ECAD 5223 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-640-SST-L 11 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
32-3554-18 Aries Electronics 32-3554-18 118.0613
RFQ
ECAD 3827 0.00000000 Aries Electronics 55 Bulk Active -55°C ~ 250°C Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 32-3554 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyetheretherketone (PEEK), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
APO-316-G-A Samtec Inc. APO-316-G-A 8.7300
RFQ
ECAD 4630 0.00000000 Samtec Inc. APO Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-APO-316-G-A 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
105142-8100 Molex 105142-8100 10.1700
RFQ
ECAD 996 0.00000000 Molex * Tray Obsolete - RoHS Compliant 2266-105142-8100 EAR99 8536.69.4040 7
614-43-210-31-012000 Mill-Max Manufacturing Corp. 614-43-210-31-012000 12.9714
RFQ
ECAD 1789 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Carrier, Open Frame 614-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
ICO-422-CGG Samtec Inc. ICO-422-CGG 10.4185
RFQ
ECAD 6728 0.00000000 Samtec Inc. ICO Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICO-422-CGG 20 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
110-83-306-41-105101 Preci-Dip 110-83-306-41-105101 0.4723
RFQ
ECAD 7623 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 69 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.118" (3.00mm) 10mOhm
116-83-642-41-002101 Preci-Dip 116-83-642-41-002101 5.6731
RFQ
ECAD 8507 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
ACA-SPI-004-K01 LOTES ACA-SPI-004-K01 1.7500
RFQ
ECAD 3723 0.00000000 LOTES - Tape & Reel (TR) Active - Surface Mount SOIC Board Guide, Closed Frame Solder - ROHS3 Compliant 3126-ACA-SPI-004-K01TR 50 Liquid Crystal Polymer (LCP) UL94 V-0 0.050" (1.27mm) Gold 1.00µin (0.025µm) Gold 1.00µin (0.025µm) 8 (2 x 4) Phosphor Bronze 0.050" (1.27mm) Phosphor Bronze - 30mOhm
104670-0041 Ironwood Electronics 104670-0041 477.0000
RFQ
ECAD 25 0.00000000 Ironwood Electronics Grypper Bag Active - Surface Mount PGA - Solder download RoHS Compliant 1 (Unlimited) REACH Unaffected 4629-104670-0041 8204.90.0000 2 - - - - - - - 152 - - - - -
550-10-072-11-061101 Preci-Dip 550-10-072-11-061101 10.8366
RFQ
ECAD 9008 0.00000000 Preci-Dip 550 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 550-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 72 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.164" (4.16mm) 10mOhm
550-80-056-09-041101 Preci-Dip 550-80-056-09-041101 6.6078
RFQ
ECAD 1543 0.00000000 Preci-Dip 550 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 550-80 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 23 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 56 (9 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.164" (4.16mm) 10mOhm
475939000 Molex 475939000 12.1200
RFQ
ECAD 441 0.00000000 Molex * Box Active download ROHS3 Compliant Vendor Undefined REACH info available upon request EAR99 1
110-99-636-61-001000 Mill-Max Manufacturing Corp. 110-99-636-61-001000 20.7736
RFQ
ECAD 3724 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing 110-99 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
8059-2G5 TE Connectivity AMP Connectors 8059-2G5 -
RFQ
ECAD 2479 0.00000000 TE Connectivity AMP Connectors - Bulk Obsolete -55°C ~ 125°C Through Hole Transistor, TO-5 Closed Frame 8059 Solder download RoHS non-compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 400 Polyamide (PA), Nylon UL94 V-0 - Gold - Gold - 8 (Round) Copper Alloy - Copper Alloy 0.115" (2.92mm) 20mOhm
614-13-179-18-095012 Mill-Max Manufacturing Corp. 614-13-179-18-095012 -
RFQ
ECAD 3831 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 179 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
NTE429 NTE Electronics, Inc NTE429 0.5500
RFQ
ECAD 129 0.00000000 NTE Electronics, Inc - Bulk Active Through Hole Open Frame Solder download ROHS3 Compliant 2368-NTE429 EAR99 8535.90.8040 1 28 (2 x 14)
114-87-316-41-134191 Preci-Dip 114-87-316-41-134191 1.0607
RFQ
ECAD 8108 0.00000000 Preci-Dip 114 Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 114-87 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,000 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.047" (1.20mm) 10mOhm
614-13-089-12-051012 Mill-Max Manufacturing Corp. 614-13-089-12-051012 -
RFQ
ECAD 6306 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 89 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
510-87-179-18-113101 Preci-Dip 510-87-179-18-113101 5.9213
RFQ
ECAD 2549 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 179 (18 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
116-41-428-41-006000 Mill-Max Manufacturing Corp. 116-41-428-41-006000 15.1577
RFQ
ECAD 1183 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.236" (5.99mm) 10mOhm
511-13-114-13-062002 Mill-Max Manufacturing Corp. 511-13-114-13-062002 -
RFQ
ECAD 3278 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 114 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
144-PLS15026-16 Aries Electronics 144-PLS15026-16 -
RFQ
ECAD 1389 0.00000000 Aries Electronics PLS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
34-0508-21 Aries Electronics 34-0508-21 21.8432
RFQ
ECAD 5452 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 34-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Beryllium Copper - Brass 0.360" (9.14mm) -
614-93-145-15-002007 Mill-Max Manufacturing Corp. 614-93-145-15-002007 -
RFQ
ECAD 3802 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 145 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
714-43-117-31-018000 Mill-Max Manufacturing Corp. 714-43-117-31-018000 4.9900
RFQ
ECAD 9996 0.00000000 Mill-Max Manufacturing Corp. 714 Bulk Active -55°C ~ 125°C Through Hole SIP Carrier 714-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 17 (1 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) -
48-6573-10 Aries Electronics 48-6573-10 20.9433
RFQ
ECAD 9076 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 48-6573 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse