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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
614-13-400-20-000001 Mill-Max Manufacturing Corp. 614-13-400-20-000001 -
RFQ
ECAD 5758 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Closed Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 400 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
522-13-156-15-061001 Mill-Max Manufacturing Corp. 522-13-156-15-061001 -
RFQ
ECAD 7962 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 156 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
IC357-0484-142P-2 Yamaichi Electronics IC357-0484-142P-2 51.4300
RFQ
ECAD 20 0.00000000 Yamaichi Electronics - Box Active -40°C ~ 150°C - IC357 Chip Carrier Black IC Sockets download ROHS3 Compliant 2 (1 Year) 2408-IC357-0484-142P-2 EAR99 8542.39.0000 1 - Polyethersulfone (PES), Glass Filled - 48
216-7224-55-1902 3M 216-7224-55-1902 40.8300
RFQ
ECAD 274 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 216 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
116-93-314-61-001000 Mill-Max Manufacturing Corp. 116-93-314-61-001000 22.5402
RFQ
ECAD 7181 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 28 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
511-91-072-11-042002 Mill-Max Manufacturing Corp. 511-91-072-11-042002 -
RFQ
ECAD 9592 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 72 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
551-10-121-15-061003 Mill-Max Manufacturing Corp. 551-10-121-15-061003 -
RFQ
ECAD 1547 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 121 (15 x 15) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
38-1518-11 Aries Electronics 38-1518-11 5.4883
RFQ
ECAD 8818 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 38-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 38 (2 x 19) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
515-93-089-12-051003 Mill-Max Manufacturing Corp. 515-93-089-12-051003 -
RFQ
ECAD 9485 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 89 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
515-13-240-17-061001 Mill-Max Manufacturing Corp. 515-13-240-17-061001 -
RFQ
ECAD 7515 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 240 (17 x 17) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
22-0513-10T Aries Electronics 22-0513-10T 2.6462
RFQ
ECAD 5450 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 22-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (1 x 22) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
24-6572-16 Aries Electronics 24-6572-16 34.4583
RFQ
ECAD 4585 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-6572 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 24 (2 x 12) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
104-11-424-41-780000 Mill-Max Manufacturing Corp. 104-11-424-41-780000 16.0591
RFQ
ECAD 4825 0.00000000 Mill-Max Manufacturing Corp. 104 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 104-11 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.250" (6.35mm) 10mOhm
14-810-90TWR Aries Electronics 14-810-90TWR 7.0619
RFQ
ECAD 7977 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active - Through Hole, Right Angle, Vertical DIP, 0.3" (7.62mm) Row Spacing Closed Frame 14-810 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.145" (3.68mm) -
523-13-073-11-042003 Mill-Max Manufacturing Corp. 523-13-073-11-042003 -
RFQ
ECAD 7024 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 73 (11 x 11) - 0.100" (2.54mm) - 0.510" (12.95mm) -
510-13-049-07-000001 Mill-Max Manufacturing Corp. 510-13-049-07-000001 26.5580
RFQ
ECAD 5903 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 510-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 56 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 49 (7 x 7) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
612-41-632-41-003000 Mill-Max Manufacturing Corp. 612-41-632-41-003000 16.5302
RFQ
ECAD 7128 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 612-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.183" (4.65mm) 10mOhm
110-43-640-41-801000 Mill-Max Manufacturing Corp. 110-43-640-41-801000 11.9000
RFQ
ECAD 50 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame, Decoupling Capacitor 110-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
44-6552-10 Aries Electronics 44-6552-10 16.1246
RFQ
ECAD 3040 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6552 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
515-13-089-13-082002 Mill-Max Manufacturing Corp. 515-13-089-13-082002 -
RFQ
ECAD 2657 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 89 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
511-91-069-11-061001 Mill-Max Manufacturing Corp. 511-91-069-11-061001 -
RFQ
ECAD 3611 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 69 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
614-91-950-31-012000 Mill-Max Manufacturing Corp. 614-91-950-31-012000 18.0270
RFQ
ECAD 4669 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
116-43-324-61-007000 Mill-Max Manufacturing Corp. 116-43-324-61-007000 23.4402
RFQ
ECAD 4011 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm
510-91-145-15-002003 Mill-Max Manufacturing Corp. 510-91-145-15-002003 29.3652
RFQ
ECAD 4629 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 145 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
08-0508-21 Aries Electronics 08-0508-21 6.5246
RFQ
ECAD 6722 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 08-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 8 (1 x 8) Beryllium Copper - Brass 0.360" (9.14mm) -
14-8620-10 Aries Electronics 14-8620-10 -
RFQ
ECAD 9318 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8620 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.140" (3.56mm) -
122-13-650-41-001000 Mill-Max Manufacturing Corp. 122-13-650-41-001000 23.1052
RFQ
ECAD 8919 0.00000000 Mill-Max Manufacturing Corp. 122 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 122-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) -
551-90-179-18-117005 Mill-Max Manufacturing Corp. 551-90-179-18-117005 -
RFQ
ECAD 7479 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 179 (18 x 18) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
126-91-210-41-002000 Mill-Max Manufacturing Corp. 126-91-210-41-002000 13.3986
RFQ
ECAD 1523 0.00000000 Mill-Max Manufacturing Corp. 126 Tube Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 126-91 Wire Wrap download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.543" (13.79mm) 10mOhm
28-3518-10TLH Aries Electronics 28-3518-10TLH 5.3348
RFQ
ECAD 4481 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 28-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse