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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
50-PLS13118-16 Aries Electronics 50-PLS13118-16 -
RFQ
ECAD 8218 0.00000000 Aries Electronics PLS Bulk Obsolete -65°C ~ 200°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze 50.0µin (1.27µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
122-13-320-41-001000 Mill-Max Manufacturing Corp. 122-13-320-41-001000 15.2227
RFQ
ECAD 1488 0.00000000 Mill-Max Manufacturing Corp. 122 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 122-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) -
36-6556-21 Aries Electronics 36-6556-21 25.7538
RFQ
ECAD 4302 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 36-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.283" (7.19mm) -
614-13-088-12-052007 Mill-Max Manufacturing Corp. 614-13-088-12-052007 -
RFQ
ECAD 1390 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 88 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
1109522 Aries Electronics 1109522 14.0327
RFQ
ECAD 6436 0.00000000 Aries Electronics Correct-A-Chip® 1109522 Bulk Active - Through Hole - 1109522 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing JEDEC 8 Beryllium Copper - Brass 0.125" (3.18mm) FR4 Epoxy Glass
116-83-314-41-008101 Preci-Dip 116-83-314-41-008101 1.6540
RFQ
ECAD 6728 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
614-91-328-41-001000 Mill-Max Manufacturing Corp. 614-91-328-41-001000 16.6325
RFQ
ECAD 2482 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
510-83-068-11-001101 Preci-Dip 510-83-068-11-001101 3.9510
RFQ
ECAD 5557 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 68 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
550-10-069-11-001101 Preci-Dip 550-10-069-11-001101 10.3851
RFQ
ECAD 9212 0.00000000 Preci-Dip 550 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 550-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 69 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.164" (4.16mm) 10mOhm
32-6556-41 Aries Electronics 32-6556-41 47.9733
RFQ
ECAD 8513 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 32-6556 Solder Cup download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.180" (4.57mm) -
614-91-636-41-001000 Mill-Max Manufacturing Corp. 614-91-636-41-001000 16.2756
RFQ
ECAD 6712 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-91 Solder download 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.165" (4.19mm) 10mOhm
917-87-104-41-053101 Preci-Dip 917-87-104-41-053101 0.6188
RFQ
ECAD 1714 0.00000000 Preci-Dip 917 Bulk Active -55°C ~ 125°C Through Hole Transistor, TO-5 - 917-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1,100 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 - Gold Flash Tin - 4 (Round) Beryllium Copper - Brass 0.055" (1.40mm) 10mOhm
APA-314-G-C Samtec Inc. APA-314-G-C 10.6500
RFQ
ECAD 5790 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-314 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
234-3034-01-0602 3M 234-3034-01-0602 88.9020
RFQ
ECAD 4597 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole Zig-Zag, ZIF (ZIP) Closed Frame 234 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 34 (1 x 34) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.192" (4.90mm) 25mOhm
16-820-90CTL Aries Electronics 16-820-90CTL 13.6349
RFQ
ECAD 5856 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 16-820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
222-3343-19-0602J 3M 222-3343-19-0602J 27.8000
RFQ
ECAD 29 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 222 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing 22 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
32-6571-16 Aries Electronics 32-6571-16 40.1775
RFQ
ECAD 6781 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 32-6571 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Nickel Boron 50.0µin (1.27µm) 32 (2 x 16) Beryllium Nickel 0.100" (2.54mm) Beryllium Nickel 0.110" (2.78mm) -
110-91-964-61-001000 Mill-Max Manufacturing Corp. 110-91-964-61-001000 24.3491
RFQ
ECAD 9611 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing 110-91 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 6 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
2-382713-1 TE Connectivity AMP Connectors 2-382713-1 -
RFQ
ECAD 3408 0.00000000 TE Connectivity AMP Connectors Diplomate DL Box Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 382713 Solder download RoHS Compliant 1 (Unlimited) Vendor Undefined EAR99 8536.69.4040 2,300 Thermoplastic, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.128" (3.24mm) 30mOhm
818-AG11D-ES TE Connectivity AMP Connectors 818-AG11D-ES -
RFQ
ECAD 8181 0.00000000 TE Connectivity AMP Connectors 800 Tube Obsolete -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 818 Solder download RoHS non-compliant 1 (Unlimited) REACH Affected EAR99 8536.69.4040 1,040 3 A Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead - 18 (2 x 9) Copper Alloy 0.100" (2.54mm) Copper Alloy 0.125" (3.18mm) 10mOhm
2-1571586-8 TE Connectivity AMP Connectors 2-1571586-8 -
RFQ
ECAD 5868 0.00000000 TE Connectivity AMP Connectors 800 Tube Obsolete -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 1571586 Solder download RoHS Compliant 1 (Unlimited) REACH Affected EAR99 8536.69.4040 500 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 25.0µin (0.63µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Copper 0.125" (3.18mm) 10mOhm
110-47-422-41-001000 Mill-Max Manufacturing Corp. 110-47-422-41-001000 1.6200
RFQ
ECAD 290 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 110-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED11093 EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
523-13-149-15-063001 Mill-Max Manufacturing Corp. 523-13-149-15-063001 -
RFQ
ECAD 3367 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 149 (15 x 15) - 0.100" (2.54mm) - 0.510" (12.95mm) -
515-91-181-14-031002 Mill-Max Manufacturing Corp. 515-91-181-14-031002 -
RFQ
ECAD 3651 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 181 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
522-13-059-11-001002 Mill-Max Manufacturing Corp. 522-13-059-11-001002 -
RFQ
ECAD 3512 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 59 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
515-13-169-13-000003 Mill-Max Manufacturing Corp. 515-13-169-13-000003 -
RFQ
ECAD 6952 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 169 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
116-93-304-61-007000 Mill-Max Manufacturing Corp. 116-93-304-61-007000 12.6028
RFQ
ECAD 2653 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 102 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 4 (2 x 2) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
97-56001 Aries Electronics 97-56001 99.8618
RFQ
ECAD 6309 0.00000000 Aries Electronics Correct-A-Chip® 97-56001 Bulk Active - Through Hole - 97-5600 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.025" (0.64mm) Gold - Tin-Lead 200.0µin (5.08µm) QFP PGA 169 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
0500-0.500 Aries Electronics 0500-0.500 -
RFQ
ECAD 6780 0.00000000 Aries Electronics - - Active - - - - 0500-0 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
515-13-088-13-081003 Mill-Max Manufacturing Corp. 515-13-088-13-081003 -
RFQ
ECAD 8177 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 88 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse