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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
240-5205-00 3M 240-5205-00 99.6300
RFQ
ECAD 4 0.00000000 3M Textool™ Bulk Active - Through Hole QFN Closed Frame 240 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 5 Polyethersulfone (PES) - - Gold - Gold - 40 (4 x 10) Beryllium Copper - Beryllium Copper 0.118" (3.00mm) 25mOhm
84-652000-10 Aries Electronics 84-652000-10 136.7750
RFQ
ECAD 1239 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 84-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 84 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
116-87-322-41-012101 Preci-Dip 116-87-322-41-012101 1.6557
RFQ
ECAD 5423 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
101-93-328-41-560000 Mill-Max Manufacturing Corp. 101-93-328-41-560000 -
RFQ
ECAD 6517 0.00000000 Mill-Max Manufacturing Corp. 101 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 101-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
551-10-109-12-051005 Mill-Max Manufacturing Corp. 551-10-109-12-051005 -
RFQ
ECAD 6549 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA - 551-10 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 109 (12 x 12) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
510-87-068-10-001101 Preci-Dip 510-87-068-10-001101 2.1134
RFQ
ECAD 8545 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 68 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
511-93-121-13-061003 Mill-Max Manufacturing Corp. 511-93-121-13-061003 -
RFQ
ECAD 1158 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 121 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
614-13-059-11-001007 Mill-Max Manufacturing Corp. 614-13-059-11-001007 -
RFQ
ECAD 2641 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 59 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
ICA-632-ZSTT Samtec Inc. ICA-632-ZSTT 4.4021
RFQ
ECAD 1838 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-632-ZSTT 14 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
1109252 Aries Electronics 1109252 -
RFQ
ECAD 9936 0.00000000 Aries Electronics Correct-A-Chip® 1109252 Bulk Active - Through Hole - 1109252 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - Tin-Lead - PLCC DIP, 0.6" (15.24mm) Row Spacing 28 - 0.070" (1.78mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
127-43-628-41-002000 Mill-Max Manufacturing Corp. 127-43-628-41-002000 15.1697
RFQ
ECAD 7402 0.00000000 Mill-Max Manufacturing Corp. 127 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 127-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.370" (9.40mm) 10mOhm
522-93-128-13-041002 Mill-Max Manufacturing Corp. 522-93-128-13-041002 -
RFQ
ECAD 7498 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 128 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
511-13-161-15-005003 Mill-Max Manufacturing Corp. 511-13-161-15-005003 -
RFQ
ECAD 7309 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 161 (15 x 15) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
614-13-089-13-061012 Mill-Max Manufacturing Corp. 614-13-089-13-061012 -
RFQ
ECAD 9684 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 89 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.136" (3.45mm) 10mOhm
123-83-320-41-001101 Preci-Dip 123-83-320-41-001101 3.8000
RFQ
ECAD 3 0.00000000 Preci-Dip 123 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 123-83 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 21 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.510" (12.95mm) 10mOhm
124-83-652-41-002101 Preci-Dip 124-83-652-41-002101 8.7830
RFQ
ECAD 4818 0.00000000 Preci-Dip 124 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 124-83 Wire Wrap - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass 0.630" (16.00mm) 10mOhm
34-7394-10 Aries Electronics 34-7394-10 14.0250
RFQ
ECAD 8450 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 34-7394 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 34 (1 x 34) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
AW 122-21/G-T Assmann WSW Components AW 122-21/G-T 0.5755
RFQ
ECAD 9302 0.00000000 Assmann WSW Components * Bulk Active - 11
16-81250-310C Aries Electronics 16-81250-310C 10.0717
RFQ
ECAD 5670 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8125 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
506-AG10D TE Connectivity AMP Connectors 506-AG10D -
RFQ
ECAD 4679 0.00000000 TE Connectivity AMP Connectors 500 Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 506 Solder download RoHS Compliant 1 (Unlimited) REACH Affected EAR99 8536.69.4040 80 - - 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 25.0µin (0.63µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
546-87-178-18-111136 Preci-Dip 546-87-178-18-111136 16.0628
RFQ
ECAD 1281 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold Flash Tin - 178 (18 x 18) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
510-43-273-21-125002 Mill-Max Manufacturing Corp. 510-43-273-21-125002 43.8428
RFQ
ECAD 4286 0.00000000 Mill-Max Manufacturing Corp. 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 273 (21 x 21) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
04-0503-30 Aries Electronics 04-0503-30 1.8231
RFQ
ECAD 4668 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 04-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
APA-624-T-K Samtec Inc. APA-624-T-K -
RFQ
ECAD 3683 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
612-41-432-41-003000 Mill-Max Manufacturing Corp. 612-41-432-41-003000 16.5302
RFQ
ECAD 5737 0.00000000 Mill-Max Manufacturing Corp. 612 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 612-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.183" (4.65mm) 10mOhm
511-13-084-10-031001 Mill-Max Manufacturing Corp. 511-13-084-10-031001 -
RFQ
ECAD 9850 0.00000000 Mill-Max Manufacturing Corp. 511 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 511-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 84 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
917-83-208-41-005101 Preci-Dip 917-83-208-41-005101 1.2758
RFQ
ECAD 9548 0.00000000 Preci-Dip 917 Bulk Active -55°C ~ 125°C Through Hole Transistor, TO-5 - 917-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 420 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 - Gold 29.5µin (0.75µm) Tin - 8 (Round) Beryllium Copper - Brass 0.125" (3.18mm) 10mOhm
ICF-308-L-RD Samtec Inc. ICF-308-L-RD -
RFQ
ECAD 8396 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-308-L-RD 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
11-0503-21 Aries Electronics 11-0503-21 8.2709
RFQ
ECAD 9594 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 11-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
110-93-324-41-105000 Mill-Max Manufacturing Corp. 110-93-324-41-105000 14.6375
RFQ
ECAD 9257 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame 110-93 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse