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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Body Material Body Finish Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
522-13-085-11-041002 Mill-Max Manufacturing Corp. 522-13-085-11-041002 -
RFQ
ECAD 7454 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 85 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
111-43-322-41-001000 Mill-Max Manufacturing Corp. 111-43-322-41-001000 13.8632
RFQ
ECAD 8511 0.00000000 Mill-Max Manufacturing Corp. 111 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 111-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
24-6554-11 Aries Electronics 24-6554-11 19.4300
RFQ
ECAD 132 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 24-655 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
07-0513-10 Aries Electronics 07-0513-10 1.3600
RFQ
ECAD 3 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 07-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 7 (1 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
29-0508-21 Aries Electronics 29-0508-21 18.6527
RFQ
ECAD 4129 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 29-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 29 (1 x 29) Beryllium Copper - Brass 0.360" (9.14mm) -
116-93-628-61-003000 Mill-Max Manufacturing Corp. 116-93-628-61-003000 23.8779
RFQ
ECAD 8049 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-93 Solder - 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) -
21-0508-30 Aries Electronics 21-0508-30 8.3476
RFQ
ECAD 8788 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 21-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 21 (1 x 21) Beryllium Copper - Brass 0.500" (12.70mm) -
08-7430-10 Aries Electronics 08-7430-10 6.4479
RFQ
ECAD 4007 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 08-7430 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 30 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 8 (1 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
26-6820-90C Aries Electronics 26-6820-90C 12.6692
RFQ
ECAD 7529 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.6" (15.24mm) Row Spacing Closed Frame 26-6820 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 26 (2 x 13) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
21-0513-11H Aries Electronics 21-0513-11H 5.6419
RFQ
ECAD 8640 0.00000000 Aries Electronics 0513 Bulk Active - Through Hole SIP - 21-0513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 21 (1 x 21) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
145-PGM15023-10 Aries Electronics 145-PGM15023-10 18.2274
RFQ
ECAD 1719 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 145-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
APA-314-T-K Samtec Inc. APA-314-T-K -
RFQ
ECAD 1239 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-314 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 14 (2 x 7) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
1051632005 Molex 1051632005 -
RFQ
ECAD 6912 0.00000000 Molex 105163 Tape & Reel (TR) Obsolete - - 105163 Cover Silver Camera Socket download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 105163-2005 EAR99 8536.69.4040 4,000 - Stainless Steel -
614-13-299-20-096007 Mill-Max Manufacturing Corp. 614-13-299-20-096007 -
RFQ
ECAD 5881 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Open Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 299 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
12-8355-310C Aries Electronics 12-8355-310C 8.4437
RFQ
ECAD 7568 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 12-8355 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
2-2822979-3 TE Connectivity AMP Connectors 2-2822979-3 73.0600
RFQ
ECAD 47 0.00000000 TE Connectivity AMP Connectors - Tray Active - Surface Mount LGA Open Frame 2822979 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 0.5 A Thermoplastic UL94 V-0 0.039" (1.00mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 3647 Copper Alloy 0.034" (0.86mm) Copper Alloy - -
3-1571550-3 TE Connectivity AMP Connectors 3-1571550-3 -
RFQ
ECAD 1227 0.00000000 TE Connectivity AMP Connectors 500 Tube Obsolete -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Closed Frame Solder download Not applicable 1 (Unlimited) Vendor Undefined 524-AG66D-LF EAR99 8536.69.4040 700 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 25.0µin (0.63µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) 10mOhm
42-3574-10 Aries Electronics 42-3574-10 19.3073
RFQ
ECAD 7318 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 42-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
15-0508-31 Aries Electronics 15-0508-31 10.8352
RFQ
ECAD 3905 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 15-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper - Brass 0.500" (12.70mm) -
19-7400-10 Aries Electronics 19-7400-10 12.7829
RFQ
ECAD 5742 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 19-7400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
13-7XXXX-10 Aries Electronics 13-7XXXX-10 -
RFQ
ECAD 9261 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 13-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 13 (1 x 13) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
605-43-952-11-480000 Mill-Max Manufacturing Corp. 605-43-952-11-480000 19.5466
RFQ
ECAD 9119 0.00000000 Mill-Max Manufacturing Corp. 605 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 605-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
30-0518-10 Aries Electronics 30-0518-10 2.7876
RFQ
ECAD 7616 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 30-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (1 x 30) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
116-43-324-61-008000 Mill-Max Manufacturing Corp. 116-43-324-61-008000 23.8597
RFQ
ECAD 7642 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
28-8240-610C Aries Electronics 28-8240-610C 16.0982
RFQ
ECAD 9748 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 28-8240 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
510-87-108-12-051101 Preci-Dip 510-87-108-12-051101 3.6812
RFQ
ECAD 5758 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 108 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APA-640-G-B Samtec Inc. APA-640-G-B 32.3000
RFQ
ECAD 1494 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-640 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-320-T-A1 Samtec Inc. APA-320-T-A1 4.9400
RFQ
ECAD 3774 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-320 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 20 (2 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-324-T-K Samtec Inc. APA-324-T-K -
RFQ
ECAD 4211 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-324 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
214-44-318-01-670799 Mill-Max Manufacturing Corp. 214-44-318-01-670799 3.8214
RFQ
ECAD 8555 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-318-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse