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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
28-3575-16 Aries Electronics 28-3575-16 37.3706
RFQ
ECAD 8646 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 28-3575 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 9 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
410-83-224-10-002101 Preci-Dip 410-83-224-10-002101 1.7987
RFQ
ECAD 7515 0.00000000 Preci-Dip 410 Bulk Active -55°C ~ 125°C Through Hole Zig-Zag, Right Stackable - 410-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 700 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
44-6570-11 Aries Electronics 44-6570-11 32.6262
RFQ
ECAD 1021 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6570 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
518-77-652M35-001105 Preci-Dip 518-77-652M35-001105 87.9891
RFQ
ECAD 9593 0.00000000 Preci-Dip 518 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 518-77 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 1 A FR4 Epoxy Glass UL94 V-0 0.050" (1.27mm) Gold Flash Gold Flash 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) Brass 0.110" (2.78mm) 10mOhm
612-83-422-41-001101 Preci-Dip 612-83-422-41-001101 1.9415
RFQ
ECAD 5081 0.00000000 Preci-Dip 612 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Carrier, Open Frame 612-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 18 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.291" (7.39mm) 10mOhm
36-3503-31 Aries Electronics 36-3503-31 25.2629
RFQ
ECAD 7610 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame 36-3503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
84-PRS13125-12 Aries Electronics 84-PRS13125-12 76.9217
RFQ
ECAD 4613 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 84-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
28-3518-102 Aries Electronics 28-3518-102 6.5447
RFQ
ECAD 2343 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 28-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
ICF-624-TL-O Samtec Inc. ICF-624-TL-O 4.6500
RFQ
ECAD 3950 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-624-TL-O 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
14-6513-11H Aries Electronics 14-6513-11H 5.0085
RFQ
ECAD 4089 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 14-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
14-8350-310C Aries Electronics 14-8350-310C 9.4798
RFQ
ECAD 6785 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 14-8350 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
116-41-636-41-007000 Mill-Max Manufacturing Corp. 116-41-636-41-007000 15.6727
RFQ
ECAD 2543 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Elevated, Open Frame 116-41 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.402" (10.21mm) 10mOhm
28-C182-31 Aries Electronics 28-C182-31 22.7922
RFQ
ECAD 2511 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C182 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
36-3553-11 Aries Electronics 36-3553-11 22.9886
RFQ
ECAD 8845 0.00000000 Aries Electronics 55 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 36-3553 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold - 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
24-8750-610C Aries Electronics 24-8750-610C 13.9031
RFQ
ECAD 8853 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 24-8750 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
1109800-20 Aries Electronics 1109800-20 -
RFQ
ECAD 6713 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
APA-322-G-N Samtec Inc. APA-322-G-N -
RFQ
ECAD 3739 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-322 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
515-93-238-19-086001 Mill-Max Manufacturing Corp. 515-93-238-19-086001 -
RFQ
ECAD 2290 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-93 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 238 (19 x 19) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
515-13-120-13-061001 Mill-Max Manufacturing Corp. 515-13-120-13-061001 -
RFQ
ECAD 9383 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 120 (13 x 13) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
10-0511-10 Aries Electronics 10-0511-10 4.9510
RFQ
ECAD 2313 0.00000000 Aries Electronics 511 Bulk Active -55°C ~ 105°C Through Hole SIP - 10-0511 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 50.0µin (1.27µm) 10 (1 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
1051420432 Molex 1051420432 -
RFQ
ECAD 7480 0.00000000 Molex 105142 Bulk Obsolete - Surface Mount LGA Open Frame 105142 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 105142-0432 EAR99 8536.69.4040 200 Thermoplastic UL94 V-0 0.040" (1.02mm) Gold 15.0µin (0.38µm) - - 2011 (47 x 58) Copper Alloy 0.040" (1.01mm) Copper Alloy - -
APA-624-T-K Samtec Inc. APA-624-T-K -
RFQ
ECAD 3683 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-624 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
515-91-073-11-061003 Mill-Max Manufacturing Corp. 515-91-073-11-061003 -
RFQ
ECAD 7415 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-91 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 73 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
APA-422-G-Q Samtec Inc. APA-422-G-Q -
RFQ
ECAD 6710 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-422 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 22 (2 x 11) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-318-G-C Samtec Inc. APA-318-G-C 13.0700
RFQ
ECAD 7203 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-318 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
522-93-100-10-000003 Mill-Max Manufacturing Corp. 522-93-100-10-000003 -
RFQ
ECAD 6254 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Closed Frame 522-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
551-90-089-13-061003 Mill-Max Manufacturing Corp. 551-90-089-13-061003 -
RFQ
ECAD 4464 0.00000000 Mill-Max Manufacturing Corp. 551 Bulk Active - Through Hole PGA Open Frame 551-90 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 200.0µin (5.08µm) 89 (13 x 13) - 0.100" (2.54mm) Brass Alloy 0.154" (3.91mm) -
116-43-210-61-008000 Mill-Max Manufacturing Corp. 116-43-210-61-008000 20.5235
RFQ
ECAD 9107 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.2" (5.08mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 40 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
110-83-428-41-005101 Preci-Dip 110-83-428-41-005101 1.7721
RFQ
ECAD 8342 0.00000000 Preci-Dip 110 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 110-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass - 10mOhm
122-13-624-41-001000 Mill-Max Manufacturing Corp. 122-13-624-41-001000 16.4469
RFQ
ECAD 1699 0.00000000 Mill-Max Manufacturing Corp. 122 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 122-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse