SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
203-2737-55-1102 3M 203-2737-55-1102 48.2600
RFQ
ECAD 7461 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole Transistor, TO-3 and TO-66 Closed Frame 203 Solder download RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 - Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 3 (Rectangular) Beryllium Copper 0.234" (5.94mm) Beryllium Copper 0.370" (9.40mm) 25mOhm
251-5949-51-0602 3M 251-5949-51-0602 -
RFQ
ECAD 6047 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole Zig-Zag, ZIF (ZIP) Closed Frame 251 Solder - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.192" (4.90mm) 25mOhm
235-3019-52-0602 3M 235-3019-52-0602 -
RFQ
ECAD 8513 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole Zig-Zag, ZIF (ZIP) Closed Frame 235 Solder - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.192" (4.90mm) 25mOhm
8452-11B1-RK-TP 3M 8452-11B1-RK-TP 2.6900
RFQ
ECAD 5111 0.00000000 3M 8400 Tube Active -40°C ~ 105°C Through Hole PLCC Closed Frame 8452 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 23 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 52 (4 x 13) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) -
2256-6321-9UA-1902 3M 2256-6321-9UA-1902 -
RFQ
ECAD 4455 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 256 (21 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
400-028-050 3M 400-028-050 -
RFQ
ECAD 5086 0.00000000 3M 400 Box Obsolete - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame - download 1 (Unlimited) EAR99 8536.69.4040 200 - - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8.00µin (0.203µm) 28 (2 x 14) - 0.100" (2.54mm) - - -
272-6311-9UA-1902 3M 272-6311-9UA-1902 -
RFQ
ECAD 9035 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 72 (11 x 11) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
200-6321-9UN-1900 3M 200-6321-9UN-1900 138.2900
RFQ
ECAD 1 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) - 200 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 441 (21 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
255-7322-01-0602 3M 255-7322-01-0602 -
RFQ
ECAD 3514 0.00000000 3M Textool™ Box Obsolete - - - - 255 - - RoHS Compliant Not Applicable 20 - - - - - - - - - - - - -
100-020-000 3M 100-020-000 -
RFQ
ECAD 5734 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 100-020 Solder - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
2400-9220-00-2401 3M 2400-9220-00-2401 -
RFQ
ECAD 8848 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
248-1282-29-0602J 3M 248-1282-29-0602J 40.5200
RFQ
ECAD 166 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
200-6315-9UN-1900 3M 200-6315-9UN-1900 103.8900
RFQ
ECAD 19 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C - PGA, ZIF (ZIP) - 200 - download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) - - - - 225 (15 x 15) - 0.100" (2.54mm) - - -
7010321972 3M 7010321972 166.9000
RFQ
ECAD 1877 0.00000000 3M - Bulk Active - 19-7010321972 5
7100265144 3M 7100265144 127.5040
RFQ
ECAD 1201 0.00000000 3M - Bulk Active - 19-7100265144 5
100-022-050 3M 100-022-050 -
RFQ
ECAD 3036 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing Open Frame 100-022 Solder download 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
8484-21B1-RK-TP 3M 8484-21B1-RK-TP 3.1600
RFQ
ECAD 4190 0.00000000 3M 8400 Tube Active -40°C ~ 105°C Surface Mount PLCC Closed Frame 8484 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 16 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 84 (4 x 21) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) -
220-3342-09-0602J 3M 220-3342-09-0602J 26.2600
RFQ
ECAD 101 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Through Hole Closed Frame 220 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing 20 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
200-6325-9UN-1900 3M 200-6325-9UN-1900 -
RFQ
ECAD 2787 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) - 200 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 625 (25 x 25) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
224-1275-29-0602J 3M 224-1275-29-0602J 26.7900
RFQ
ECAD 38 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 224 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 24 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
100-040-051 3M 100-040-051 -
RFQ
ECAD 8548 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Seal Tape 100-040 Solder download 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
ICO-326-S8-T 3M ICO-326-S8-T -
RFQ
ECAD 9302 0.00000000 3M ICO Tube Obsolete -65°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame ICO-326 Solder download RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 720 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 32 (2 x 16) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.130" (3.30mm) -
2324-9021-02-2421 3M 2324-9021-02-2421 -
RFQ
ECAD 4016 0.00000000 3M Textool™ Bulk Obsolete - - - - - - Not Applicable OBSOLETE 5 - - - - - - - - - - - - -
224-5809-00-0602 3M 224-5809-00-0602 53.4500
RFQ
ECAD 32 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole SIP, ZIF (ZIP) - 224 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold 30.0µin (0.76µm) 24 (1 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
232-5205-01 3M 232-5205-01 116.1800
RFQ
ECAD 17 0.00000000 3M Textool™ Bulk Active - Through Hole QFN Closed Frame 232 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 5 Polyethersulfone (PES) - - Gold - Gold - 32 (4 x 8) Beryllium Copper - Beryllium Copper 0.114" (2.90mm) 25mOhm
240-1280-00-0602J 3M 240-1280-00-0602J 31.6100
RFQ
ECAD 374 0.00000000 3M Textool™ Tube Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 240 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
255-7322-51-0602 3M 255-7322-51-0602 -
RFQ
ECAD 5165 0.00000000 3M Textool™ Box Active - - - - 255 - - RoHS Compliant Not Applicable 20 - - - - - - - - - - - - -
100-048-000 3M 100-048-000 -
RFQ
ECAD 6099 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 100-048 Solder - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
251-5949-52-0602 3M 251-5949-52-0602 -
RFQ
ECAD 7471 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole Zig-Zag, ZIF (ZIP) Closed Frame 251 Solder - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.050" (1.27mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.192" (4.90mm) 25mOhm
232-1285-29-0602J 3M 232-1285-29-0602J 18.2810
RFQ
ECAD 6543 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 232 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 32 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse