SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
7100148803 3M 7100148803 98.3900
RFQ
ECAD 4280 0.00000000 3M - Bulk Active - 19-7100148803 20
2352-9228-01-2401 3M 2352-9228-01-2401 -
RFQ
ECAD 2414 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2529-9288-90-2401 3M 2529-9288-90-2401 -
RFQ
ECAD 6560 0.00000000 3M Textool™ Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
2133-9283-90-2401 3M 2133-9283-90-2401 -
RFQ
ECAD 1457 0.00000000 3M - Bulk Obsolete - - - - - - RoHS Compliant Not Applicable OBSOLETE 1 - - - - - - - - - - - - -
242A-6321-9UA-1902 3M 242A-6321-9UA-1902 -
RFQ
ECAD 1665 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 441 (21 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
2225-6317-9UA-1902 3M 2225-6317-9UA-1902 -
RFQ
ECAD 9387 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 225 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
2144-6315-9UA-1902 3M 2144-6315-9UA-1902 -
RFQ
ECAD 1922 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 144 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
2180-6315-9UA-1902 3M 2180-6315-9UA-1902 -
RFQ
ECAD 9866 0.00000000 3M Textool™ Bulk Obsolete -55°C ~ 150°C Through Hole PGA, ZIF (ZIP) Closed Frame Solder download Not Applicable OBSOLETE 1 1 A Polyethersulfone (PES) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 180 (15 x 15) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
240-1280-29-0602J 3M 240-1280-29-0602J 28.8200
RFQ
ECAD 26 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 240 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
100-032-050 3M 100-032-050 -
RFQ
ECAD 2195 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 100-032 Solder download 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
239-5605-52-0602 3M 239-5605-52-0602 -
RFQ
ECAD 6310 0.00000000 3M - - Active - - - - - - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 - - - - - - - - - - - - 25mOhm
232-1270-51-0602 3M 232-1270-51-0602 -
RFQ
ECAD 7396 0.00000000 3M Textool™ - Obsolete - - - - 232 - - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 - - - - - - - - - - - - 25mOhm
7010354186 3M 7010354186 212.0160
RFQ
ECAD 7619 0.00000000 3M - Bulk Active - 19-7010354186 5
79300-17-011 3M 79300-17-011 -
RFQ
ECAD 3881 0.00000000 3M - Bulk Obsolete - - - - - - Not Applicable OBSOLETE 20 - - - - - - - - - - - - -
248-4205-01 3M 248-4205-01 143.7300
RFQ
ECAD 21 0.00000000 3M Textool™ Bulk Active - Through Hole QFN Closed Frame 248 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 5 Polyethersulfone (PES) - 0.016" (0.40mm) Gold - Gold - 48 (4 x 12) Beryllium Copper - Beryllium Copper 0.114" (2.90mm) 25mOhm
4816-3004-CP 3M 4816-3004-CP 0.7700
RFQ
ECAD 15 0.00000000 3M 4800 Tube Active -25°C ~ 85°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 4816 Solder download RoHS Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 35.4µin (0.90µm) Tin 35.0µin (0.90µm) 16 (2 x 8) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
100-028-001 3M 100-028-001 -
RFQ
ECAD 2059 0.00000000 3M 100 Bulk Obsolete -65°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Seal Tape 100-028 Solder - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold Flash 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.126" (3.20mm) -
240-3639-19-0602J 3M 240-3639-19-0602J 38.5165
RFQ
ECAD 7660 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 240 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
400-032-000 3M 400-032-000 -
RFQ
ECAD 2553 0.00000000 3M 400 - Obsolete - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame - - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 - - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8.00µin (0.203µm) 32 (2 x 16) - 0.100" (2.54mm) - - -
300-014-000 3M 300-014-000 -
RFQ
ECAD 2946 0.00000000 3M 300 - Obsolete - Through Hole SIP Closed Frame - - RoHS non-compliant 1 (Unlimited) EAR99 8536.69.4040 200 - - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 8.00µin (0.203µm) 14 (1 x 14) - 0.100" (2.54mm) - - 25mOhm
232-2601-50-0602 3M 232-2601-50-0602 53.3685
RFQ
ECAD 3010 0.00000000 3M - - Active - - - - 232 - - RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 - - - - - - - - - - - - 25mOhm
224-5809-50-0602 3M 224-5809-50-0602 53.2820
RFQ
ECAD 5976 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole SIP, ZIF (ZIP) - 224 Solder - RoHS Compliant Not Applicable EAR99 8536.69.4040 20 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold 30.0µin (0.76µm) 24 (1 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
255-7322-52-0602 3M 255-7322-52-0602 -
RFQ
ECAD 1194 0.00000000 3M Textool™ Box Active - - - - 255 - - RoHS Compliant Not Applicable 10 - - - - - - - - - - - - -
2352-9228-01-1401 3M 2352-9228-01-1401 -
RFQ
ECAD 8993 0.00000000 3M Textool™ Box Active - - - - 2352 - - RoHS Compliant Not Applicable 5 - - - - - - - - - - - - -
224-5248-00-0602J 3M 224-5248-00-0602J 33.4200
RFQ
ECAD 61 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 224 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
228-1290-00-0602J 3M 228-1290-00-0602J 29.5600
RFQ
ECAD 33 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 228 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
290-1294-00-3302J 3M 290-1294-00-3302J 59.2160
RFQ
ECAD 5700 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole DIP, ZIF (ZIP) Closed Frame 290 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 90 (2 x 45) Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) 15mOhm
222-3343-19-0602J 3M 222-3343-19-0602J 27.8000
RFQ
ECAD 29 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 222 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing 22 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
218-7223-55-1902 3M 218-7223-55-1902 -
RFQ
ECAD 1126 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 218 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
224-7397-55-1902 3M 224-7397-55-1902 41.3285
RFQ
ECAD 1828 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 224 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse