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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
240-4205-01 3M 240-4205-01 -
RFQ
ECAD 8789 0.00000000 3M Textool™ Box Active - - - - 240 - - Not Applicable EAR99 8536.69.4040 5 - - - - - - - - - - - - -
244-5205-00 3M 244-5205-00 131.1160
RFQ
ECAD 7534 0.00000000 3M Textool™ Box Active - - - - 244 - - Not Applicable EAR99 8536.69.4040 5 - - - - - - - - - - - - -
2A8-4204-00 3M 2A8-4204-00 -
RFQ
ECAD 5899 0.00000000 3M Textool™ Box Discontinued at SIC - - - - 2A8 - - Not Applicable EAR99 8536.69.4040 5 - - - - - - - - - - - - -
2528-1361-SB-3302 3M 2528-1361-SB-3302 -
RFQ
ECAD 6195 0.00000000 3M Textool™ Box Obsolete - - - - 2528 - - Not Applicable OBSOLETE 5 - - - - - - - - - - - - -
224-5809-50-0602 3M 224-5809-50-0602 53.2820
RFQ
ECAD 5976 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole SIP, ZIF (ZIP) - 224 Solder - RoHS Compliant Not Applicable EAR99 8536.69.4040 20 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold - Gold 30.0µin (0.76µm) 24 (1 x 24) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
255-7322-52-0602 3M 255-7322-52-0602 -
RFQ
ECAD 1194 0.00000000 3M Textool™ Box Active - - - - 255 - - RoHS Compliant Not Applicable 10 - - - - - - - - - - - - -
2352-9228-01-1401 3M 2352-9228-01-1401 -
RFQ
ECAD 8993 0.00000000 3M Textool™ Box Active - - - - 2352 - - RoHS Compliant Not Applicable 5 - - - - - - - - - - - - -
8428-21B1-RK-TP 3M 8428-21B1-RK-TP 1.9100
RFQ
ECAD 791 0.00000000 3M 8400 Tube Active -40°C ~ 105°C Surface Mount PLCC Closed Frame 8428 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 33 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 28 (4 x 7) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) -
8484-21A1-RK-TP 3M 8484-21A1-RK-TP 3.1600
RFQ
ECAD 1 0.00000000 3M 8400 Tube Active -40°C ~ 105°C Surface Mount PLCC Closed Frame 8484 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 1,584 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 84 (4 x 21) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) -
8420-21B1-RK-TR 3M 8420-21B1-RK-TR 1.1696
RFQ
ECAD 8401 0.00000000 3M 8400 Tape & Reel (TR) Active -40°C ~ 105°C Surface Mount PLCC Closed Frame 8420 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 1,500 1 A Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin 160.0µin (4.06µm) 20 (4 x 5) Copper Alloy 0.050" (1.27mm) Copper Alloy 0.132" (3.35mm) 15mOhm
224-5248-00-0602J 3M 224-5248-00-0602J 33.4200
RFQ
ECAD 61 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 224 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
242-1289-00-0602J 3M 242-1289-00-0602J 44.3500
RFQ
ECAD 2629 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 242 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
228-1290-00-0602J 3M 228-1290-00-0602J 29.5600
RFQ
ECAD 33 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 228 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
232-1291-00-0602J 3M 232-1291-00-0602J 32.8035
RFQ
ECAD 9777 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 232 Press-Fit download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
256-1292-00-0602J 3M 256-1292-00-0602J 47.5100
RFQ
ECAD 19 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Connector DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 256 Press-Fit download RoHS Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 56 (2 x 28) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) 15mOhm
290-1294-00-3302J 3M 290-1294-00-3302J 59.2160
RFQ
ECAD 5700 0.00000000 3M Textool™ Bulk Active -55°C ~ 125°C Through Hole DIP, ZIF (ZIP) Closed Frame 290 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 90 (2 x 45) Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) 15mOhm
222-3343-19-0602J 3M 222-3343-19-0602J 27.8000
RFQ
ECAD 29 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 222 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing 22 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
240-1280-29-0602J 3M 240-1280-29-0602J 28.8200
RFQ
ECAD 26 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 240 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
240-3639-19-0602J 3M 240-3639-19-0602J 38.5165
RFQ
ECAD 7660 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 240 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 1.0" (25.40mm) Row Spacing DIP, 1.0" (25.40mm) Row Spacing 40 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
242-1281-09-0602J 3M 242-1281-09-0602J -
RFQ
ECAD 3617 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 242 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
242-1281-39-0602J 3M 242-1281-39-0602J -
RFQ
ECAD 2600 0.00000000 3M Textool™ Box Obsolete -55°C ~ 125°C Through Hole Closed Frame Wire Wrap download 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
242-1293-29-0602J 3M 242-1293-29-0602J -
RFQ
ECAD 9989 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 242 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 42 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
248-1282-09-0602J 3M 248-1282-09-0602J -
RFQ
ECAD 3320 0.00000000 3M Textool™ Box Obsolete -55°C ~ 125°C Through Hole Closed Frame 248 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.130" (3.30mm) -
248-1282-19-0602J 3M 248-1282-19-0602J -
RFQ
ECAD 9737 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
248-1282-39-0602J 3M 248-1282-39-0602J -
RFQ
ECAD 6916 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 248 Wire Wrap download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 48 Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.620" (15.75mm) -
264-1300-29-0602J 3M 264-1300-29-0602J -
RFQ
ECAD 9623 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 264 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.8" (20.32mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing 64 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
290-1294-09-0602J 3M 290-1294-09-0602J -
RFQ
ECAD 3784 0.00000000 3M Textool™ Box Active -55°C ~ 125°C Through Hole Closed Frame 290 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polysulfone (PSU), Glass Filled UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) DIP, 0.9" (22.86mm) Row Spacing DIP, 0.9" (22.86mm) Row Spacing 90 Beryllium Copper 0.070" (1.78mm) Beryllium Copper 0.130" (3.30mm) -
218-7223-55-1902 3M 218-7223-55-1902 -
RFQ
ECAD 1126 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 218 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
224-7397-55-1902 3M 224-7397-55-1902 41.3285
RFQ
ECAD 1828 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 224 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
228-7396-55-1902 3M 228-7396-55-1902 50.9600
RFQ
ECAD 27 0.00000000 3M Textool™ Bulk Active -55°C ~ 150°C Through Hole SOIC Closed Frame 228 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 10 1 A Polyethersulfone (PES), Glass Filled UL94 V-0 - Gold - Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper - Beryllium Copper 0.140" (3.56mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse