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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance
4818-3000-CP 3M 4818-3000-CP 0.7700
RFQ
ECAD 1 0.00000000 3M 4800 Tube Active -25°C ~ 85°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 4818 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 35.4µin (0.90µm) Tin 35.0µin (0.90µm) 18 (2 x 9) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
42-3574-10 Aries Electronics 42-3574-10 19.3073
RFQ
ECAD 7318 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Closed Frame 42-3574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
15-0508-31 Aries Electronics 15-0508-31 10.8352
RFQ
ECAD 3905 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 15-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper - Brass 0.500" (12.70mm) -
100-PRS17048-12 Aries Electronics 100-PRS17048-12 92.7000
RFQ
ECAD 7335 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 100-PRS Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
33-0508-21 Aries Electronics 33-0508-21 21.2380
RFQ
ECAD 6143 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 125°C Through Hole SIP - 33-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 33 (1 x 33) Beryllium Copper - Brass 0.360" (9.14mm) -
19-7400-10 Aries Electronics 19-7400-10 12.7829
RFQ
ECAD 5742 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 19-7400 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
614-43-320-31-018000 Mill-Max Manufacturing Corp. 614-43-320-31-018000 15.1302
RFQ
ECAD 9624 0.00000000 Mill-Max Manufacturing Corp. 614 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Carrier, Open Frame 614-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.170" (4.32mm) 10mOhm
13-7XXXX-10 Aries Electronics 13-7XXXX-10 -
RFQ
ECAD 9261 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 13-7XXX Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 13 (1 x 13) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
20-711250-10 Aries Electronics 20-711250-10 11.5988
RFQ
ECAD 3528 0.00000000 Aries Electronics 700 Elevator Strip-Line™ Bulk Active -55°C ~ 105°C Through Hole SIP Elevated 20-7112 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1.5 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 20 (1 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.150" (3.81mm) -
605-43-952-11-480000 Mill-Max Manufacturing Corp. 605-43-952-11-480000 19.5466
RFQ
ECAD 9119 0.00000000 Mill-Max Manufacturing Corp. 605 Tube Active -55°C ~ 125°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Carrier, Open Frame 605-43 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 7 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 52 (2 x 26) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.124" (3.15mm) 10mOhm
22-6513-10 Aries Electronics 22-6513-10 3.2522
RFQ
ECAD 4949 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 22-6513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
1106275-20 Aries Electronics 1106275-20 -
RFQ
ECAD 5002 0.00000000 Aries Electronics - - Active - - - - 1106275 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
30-0518-10 Aries Electronics 30-0518-10 2.7876
RFQ
ECAD 7616 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 30-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 30 (1 x 30) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
108-PGM12005-41 Aries Electronics 108-PGM12005-41 39.3346
RFQ
ECAD 1165 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 125°C Through Hole PGA - 108-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
28-C212-30 Aries Electronics 28-C212-30 18.4726
RFQ
ECAD 9614 0.00000000 Aries Electronics EJECT-A-DIP™ Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 28-C212 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.040" (1.02mm) -
14-81250-610C Aries Electronics 14-81250-610C 9.2536
RFQ
ECAD 1566 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 14-8125 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
116-43-324-61-008000 Mill-Max Manufacturing Corp. 116-43-324-61-008000 23.8597
RFQ
ECAD 7642 0.00000000 Mill-Max Manufacturing Corp. 116 Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 16 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.472" (11.99mm) 10mOhm
28-8240-610C Aries Electronics 28-8240-610C 16.0982
RFQ
ECAD 9748 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 28-8240 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
APA-308-T-A Samtec Inc. APA-308-T-A 2.2100
RFQ
ECAD 3763 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-308 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 8 (2 x 4) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
510-87-108-12-051101 Preci-Dip 510-87-108-12-051101 3.6812
RFQ
ECAD 5758 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 17 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 108 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
APA-640-G-B Samtec Inc. APA-640-G-B 32.3000
RFQ
ECAD 1494 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-640 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 20.0µin (0.51µm) 40 (2 x 20) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-320-T-A1 Samtec Inc. APA-320-T-A1 4.9400
RFQ
ECAD 3774 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-320 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 20 (2 x 10) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
APA-324-T-K Samtec Inc. APA-324-T-K -
RFQ
ECAD 4211 0.00000000 Samtec Inc. APA Bulk Active - Through Hole - Open Frame APA-324 Solder download ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Polybutylene Terephthalate (PBT), Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 24 (2 x 12) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze - -
116-87-322-41-007101 Preci-Dip 116-87-322-41-007101 1.9766
RFQ
ECAD 6681 0.00000000 Preci-Dip 116 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Elevated, Open Frame 116-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 19 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
214-44-318-01-670799 Mill-Max Manufacturing Corp. 214-44-318-01-670799 3.8214
RFQ
ECAD 8555 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-318-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-44-320-01-670799 Mill-Max Manufacturing Corp. 214-44-320-01-670799 3.8527
RFQ
ECAD 8131 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-320-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-99-316-01-670799 Mill-Max Manufacturing Corp. 214-99-316-01-670799 3.6226
RFQ
ECAD 2521 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-99 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected 54-214-99-316-01-670799TR EAR99 8536.69.4040 750 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-44-308-01-670799 Mill-Max Manufacturing Corp. 214-44-308-01-670799 1.7281
RFQ
ECAD 1 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Closed Frame 214-44 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected 54-214-44-308-01-670799TR EAR99 8536.69.4040 1,000 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 200.0µin (5.08µm) 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
214-99-628-01-670799 Mill-Max Manufacturing Corp. 214-99-628-01-670799 7.3126
RFQ
ECAD 4504 0.00000000 Mill-Max Manufacturing Corp. 214 Tape & Reel (TR) Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Closed Frame 214-99 Solder - RoHS non-compliant 1 (Unlimited) REACH Unaffected 54-214-99-628-01-670799TR EAR99 8536.69.4040 400 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.056" (1.42mm) -
NTE419 NTE Electronics, Inc NTE419 2.8800
RFQ
ECAD 503 0.00000000 NTE Electronics, Inc - Bulk Active - Through Hole Transistor, TO-5 and TO-39 - Solder download RoHS non-compliant 2368-NTE419 EAR99 8535.90.8040 1 - - - - - - 3 (Round) - - - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse