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IC Sockets(22839)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Mounting Type | Type | Features | Base Product Number | Termination | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Current Rating (Amps) | Housing Material | Material Flammability Rating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Material - Post | Termination Post Length | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
20-3508-301 | 10.1080 |  |
7065 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 20-3508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.360" (9.14mm) | - | ||
|
32-6508-212 | 26.5556 | |
3821 | 0.00000000 | Aries Electronics | 508 | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | 32-6508 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.500" (12.70mm) | - | ||
|
28-3518-102 | 6.5447 | |
2343 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | 28-3518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
ICF-624-TL-O | 4.6500 | |
3950 | 0.00000000 | Samtec Inc. | ICF | Bulk | Active | -55°C ~ 125°C | Surface Mount | DIP, 0.6" (15.24mm) Row Spacing | Open Frame | Solder | download | ROHS3 Compliant | 612-ICF-624-TL-O | 1 | Liquid Crystal Polymer (LCP) | - | 0.100" (2.54mm) | Tin | - | Tin | - | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | - | |||||||
|
14-6513-11H | 5.0085 | |
4089 | 0.00000000 | Aries Electronics | Lo-PRO®file, 513 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 14-6513 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
14-8350-310C | 9.4798 | |
6785 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 14-8350 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||
|
27-0518-10 | 2.5250 | |
3411 | 0.00000000 | Aries Electronics | 518 | Bulk | Active | - | Through Hole | SIP | Open Frame | 27-0518 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 27 (1 x 27) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
116-41-636-41-007000 | 15.6727 | |
2543 | 0.00000000 | Mill-Max Manufacturing Corp. | 116 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Elevated, Open Frame | 116-41 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 11 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 200.0µin (5.08µm) | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.402" (10.21mm) | 10mOhm | ||
|
28-C182-31 | 22.7922 | |
2511 | 0.00000000 | Aries Electronics | EJECT-A-DIP™ | Bulk | Active | -55°C ~ 125°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame | 28-C182 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.040" (1.02mm) | - | ||
 |
40-516-11 | 20.4500 | |
30 | 0.00000000 | Aries Electronics | 516 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP) | Closed Frame | 40-516 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 10 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.150" (3.81mm) | - | ||
|
36-3553-11 | 22.9886 | |
8845 | 0.00000000 | Aries Electronics | 55 | Bulk | Active | - | Through Hole | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Closed Frame | 36-3553 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 7 | 1 A | Polyphenylene Sulfide (PPS), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | - | Gold | - | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | 0.110" (2.78mm) | - | ||
|
24-8750-610C | 13.9031 | |
8853 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.6" (15.24mm) Row Spacing | Closed Frame, Elevated | 24-8750 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||
|
1109800-20 | - | |
6713 | 0.00000000 | Aries Electronics | Correct-A-Chip® 1109800 | Bulk | Active | - | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Programmable | 1109800 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.125" (3.18mm) | - | ||
|
522-93-065-10-051001 | - | |
9551 | 0.00000000 | Mill-Max Manufacturing Corp. | 522 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 522-93 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 65 (10 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.370" (9.40mm) | 10mOhm | ||
|
APA-322-G-N | - | |
3739 | 0.00000000 | Samtec Inc. | APA | Bulk | Active | - | Through Hole | - | Open Frame | APA-322 | Solder | download | ROHS3 Compliant | Not Applicable | EAR99 | 8536.69.4040 | 1 | Polybutylene Terephthalate (PBT), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20.0µin (0.51µm) | 22 (2 x 11) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | - | - | ||||
|
126-43-210-41-001000 | 12.7654 | |
4572 | 0.00000000 | Mill-Max Manufacturing Corp. | 126 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.2" (5.08mm) Row Spacing | Open Frame | 126-43 | Wire Wrap | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 40 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.425" (10.80mm) | 10mOhm | ||
 |
A-CCS84-Z-R | - | |
2911 | 0.00000000 | Assmann WSW Components | - | Tube | Obsolete | -55°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 16 | 1 A | Polybutylene Terephthalate (PBT), Glass Filled | UL94 V-0 | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Tin | 150.0µin (3.81µm) | 84 (4 x 21) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.130" (3.30mm) | 30mOhm | ||||
 |
AR 06-HZL-TT | 0.2300 | |
23 | 0.00000000 | Assmann WSW Components | - | Tube | Active | -40°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Open Frame | AR 06 HZL | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 80 | 3 A | Thermoplastic, Polyester | UL94 V-0 | 0.100" (2.54mm) | Tin | - | Tin | 200.0µin (5.08µm) | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Beryllium Copper | - | 4mOhm | ||
|
40-8785-310C | 22.1379 | |
2609 | 0.00000000 | Aries Electronics | 8 | Bulk | Active | -55°C ~ 105°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Closed Frame, Elevated | 40-8785 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Brass | 0.140" (3.56mm) | - | ||
|
612-43-310-41-001000 | 12.3685 | |
6089 | 0.00000000 | Mill-Max Manufacturing Corp. | 612 | Tube | Active | -55°C ~ 125°C | Through Hole | DIP, 0.3" (7.62mm) Row Spacing | Carrier, Open Frame | 612-43 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 40 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 200.0µin (5.08µm) | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.124" (3.15mm) | 10mOhm | ||
|
515-93-238-19-086001 | - | |
2290 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 238 (19 x 19) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||
|
614-93-068-10-041001 | - | |
7991 | 0.00000000 | Mill-Max Manufacturing Corp. | 614 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Carrier, Open Frame | 614-93 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 200.0µin (5.08µm) | 68 (10 x 10) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.165" (4.19mm) | 10mOhm | ||
|
515-13-120-13-061001 | - | |
9383 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-13 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10.0µin (0.25µm) | 120 (13 x 13) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||
|
10-0511-10 | 4.9510 | |
2313 | 0.00000000 | Aries Electronics | 511 | Bulk | Active | -55°C ~ 105°C | Through Hole | SIP | - | 10-0511 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 20 | 1 A | Polyamide (PA46), Nylon 4/6, Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 50.0µin (1.27µm) | 10 (1 x 10) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | 0.150" (3.81mm) | - | ||
|
1051420432 | - | |
7480 | 0.00000000 | Molex | 105142 | Bulk | Obsolete | - | Surface Mount | LGA | Open Frame | 105142 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 105142-0432 | EAR99 | 8536.69.4040 | 200 | Thermoplastic | UL94 V-0 | 0.040" (1.02mm) | Gold | 15.0µin (0.38µm) | - | - | 2011 (47 x 58) | Copper Alloy | 0.040" (1.01mm) | Copper Alloy | - | - | ||
|
APA-624-T-K | - | |
3683 | 0.00000000 | Samtec Inc. | APA | Bulk | Active | - | Through Hole | - | Open Frame | APA-624 | Solder | download | ROHS3 Compliant | Not Applicable | EAR99 | 8536.69.4040 | 1 | Polybutylene Terephthalate (PBT), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Tin | - | Tin | - | 24 (2 x 12) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | - | - | ||||
|
5-6437504-5 | - | |
5931 | 0.00000000 | TE Connectivity AMP Connectors | - | Bulk | Obsolete | -55°C ~ 125°C | Chassis Mount | Transistor, TO-3 | Closed Frame | 6437504 | Solder | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | Phenolic | - | - | Gold | - | Gold | - | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | - | - | |||
|
D83032B-46R | - | |
7635 | 0.00000000 | Harwin Inc. | D830 | Tube | Obsolete | -50°C ~ 105°C | Surface Mount | PLCC | Board Guide, Closed Frame | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 1 A | Polyphenylene Sulfide (PPS) | UL94 V-0 | 0.050" (1.27mm) | Tin | - | Tin | - | 32 (4 x 8) | Phosphor Bronze | 0.050" (1.27mm) | Phosphor Bronze | - | 30mOhm | |||
|
515-91-073-11-061003 | - | |
7415 | 0.00000000 | Mill-Max Manufacturing Corp. | 515 | Bulk | Active | -55°C ~ 125°C | Through Hole | PGA | Open Frame | 515-91 | Solder | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8536.69.4040 | 1 | 3 A | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | UL94 V-0 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 200.0µin (5.08µm) | 73 (11 x 11) | Beryllium Copper | 0.100" (2.54mm) | Brass Alloy | 0.108" (2.74mm) | 10mOhm | ||
|
APA-422-G-Q | - | |
6710 | 0.00000000 | Samtec Inc. | APA | Bulk | Active | - | Through Hole | - | Open Frame | APA-422 | Solder | download | ROHS3 Compliant | Not Applicable | EAR99 | 8536.69.4040 | 1 | Polybutylene Terephthalate (PBT), Glass Filled | UL94 V-0 | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 20.0µin (0.51µm) | 22 (2 x 11) | Phosphor Bronze | 0.100" (2.54mm) | Phosphor Bronze | - | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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