SIC
close
Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Features Base Product Number Termination Ingress Protection Style RoHS Status Moisture Sensitivity Level (MSL) ECCN HTSUS Standard Package Connector Type Number of Rows Current Rating (Amps) Contact Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Shrouding Fastening Type Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post
HTSW-208-09-T-D-LA Samtec Inc. HTSW-208-09-T-D-LA -
RFQ
ECAD 2601 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.240" (6.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-T-Q-LA Samtec Inc. HTSW-208-09-T-Q-LA -
RFQ
ECAD 8287 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-T-S-LA Samtec Inc. HTSW-208-09-T-S-LA -
RFQ
ECAD 9415 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-10-F-S-RA Samtec Inc. HTSW-208-10-F-S-RA -
RFQ
ECAD 5866 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.122" (3.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-10-G-D-RA Samtec Inc. HTSW-208-10-G-D-RA -
RFQ
ECAD 8395 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-10-G-Q-RA Samtec Inc. HTSW-208-10-G-Q-RA -
RFQ
ECAD 2250 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-10-G-S-RE Samtec Inc. HTSW-208-10-G-S-RE -
RFQ
ECAD 6077 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-10-S-D-RA Samtec Inc. HTSW-208-10-S-D-RA -
RFQ
ECAD 4271 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.240" (6.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-10-S-Q-RA Samtec Inc. HTSW-208-10-S-Q-RA -
RFQ
ECAD 4488 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.320" (8.13mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-10-S-S-RE Samtec Inc. HTSW-208-10-S-S-RE -
RFQ
ECAD 9272 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-10-T-Q-RA Samtec Inc. HTSW-208-10-T-Q-RA -
RFQ
ECAD 5110 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-11-F-Q-RA Samtec Inc. HTSW-208-11-F-Q-RA -
RFQ
ECAD 5870 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.320" (8.13mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-11-F-S-RA Samtec Inc. HTSW-208-11-F-S-RA -
RFQ
ECAD 9635 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.122" (3.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-11-G-S-RA Samtec Inc. HTSW-208-11-G-S-RA 3.6900
RFQ
ECAD 2920 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-11-G-S-RE Samtec Inc. HTSW-208-11-G-S-RE -
RFQ
ECAD 4640 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.390" (9.91mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-11-L-Q-RA Samtec Inc. HTSW-208-11-L-Q-RA -
RFQ
ECAD 2825 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-11-L-S-RA Samtec Inc. HTSW-208-11-L-S-RA -
RFQ
ECAD 4232 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-11-S-D-RA Samtec Inc. HTSW-208-11-S-D-RA -
RFQ
ECAD 8289 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.240" (6.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-12-G-Q-RA Samtec Inc. HTSW-208-12-G-Q-RA -
RFQ
ECAD 8626 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-12-G-S-RE Samtec Inc. HTSW-208-12-G-S-RE -
RFQ
ECAD 8150 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-12-L-S-RA Samtec Inc. HTSW-208-12-L-S-RA -
RFQ
ECAD 5476 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.590" (14.99mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-12-L-S-RE Samtec Inc. HTSW-208-12-L-S-RE -
RFQ
ECAD 6780 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-12-T-S-RE Samtec Inc. HTSW-208-12-T-S-RE -
RFQ
ECAD 1757 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.490" (12.45mm) - 0.122" (3.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-13-F-S-RE Samtec Inc. HTSW-208-13-F-S-RE -
RFQ
ECAD 8025 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.690" (17.53mm) - 0.122" (3.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-13-G-D-RA Samtec Inc. HTSW-208-13-G-D-RA -
RFQ
ECAD 5363 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.790" (20.07mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-13-S-S-RE Samtec Inc. HTSW-208-13-S-S-RE -
RFQ
ECAD 8174 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.690" (17.53mm) - 0.122" (3.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-13-T-D-RA Samtec Inc. HTSW-208-13-T-D-RA -
RFQ
ECAD 8300 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.790" (20.07mm) - 0.240" (6.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-13-T-S-RE Samtec Inc. HTSW-208-13-T-S-RE -
RFQ
ECAD 9487 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.690" (17.53mm) - 0.122" (3.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-15-G-S Samtec Inc. HTSW-208-15-G-S 3.0300
RFQ
ECAD 5065 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.520" (13.21mm) 0.110" (2.79mm) 0.730" (18.54mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-16-F-S-RA Samtec Inc. HTSW-208-16-F-S-RA -
RFQ
ECAD 9177 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.320" (8.13mm) 0.200" (5.08mm) - 0.122" (3.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse