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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Applications Mounting Type Features Base Product Number Termination Ingress Protection Style RoHS Status Moisture Sensitivity Level (MSL) ECCN HTSUS Standard Package Connector Type Number of Rows Current Rating (Amps) Contact Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Row Spacing - Mating Number of Positions Loaded Shrouding Fastening Type Contact Length - Mating Contact Length - Post Overall Contact Length Insulation Height Contact Shape Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Insulation Material Insulation Color Voltage Rating Mated Stacking Heights Contact Finish Thickness - Post
HTSW-207-30-T-D-RA Samtec Inc. HTSW-207-30-T-D-RA -
RFQ
ECAD 2643 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-207 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 14 0.100" (2.54mm) All Unshrouded Push-Pull 0.320" (8.13mm) 0.600" (15.24mm) - 0.240" (6.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-06-G-S Samtec Inc. HTSW-208-06-G-S 2.9300
RFQ
ECAD 9556 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.105" (2.67mm) 0.095" (2.41mm) 0.300" (7.62mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-07-G-S Samtec Inc. HTSW-208-07-G-S 2.6300
RFQ
ECAD 3579 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.100" (2.54mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-07-SM-D Samtec Inc. HTSW-208-07-SM-D -
RFQ
ECAD 2368 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.100" (2.54mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-07-T-Q Samtec Inc. HTSW-208-07-T-Q -
RFQ
ECAD 4014 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.100" (2.54mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-07-TM-Q Samtec Inc. HTSW-208-07-TM-Q 3.4300
RFQ
ECAD 7722 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.100" (2.54mm) 0.430" (10.92mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-F-D-LA Samtec Inc. HTSW-208-08-F-D-LA -
RFQ
ECAD 9034 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.240" (6.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-F-S-LA Samtec Inc. HTSW-208-08-F-S-LA -
RFQ
ECAD 8255 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-G-D-LA Samtec Inc. HTSW-208-08-G-D-LA -
RFQ
ECAD 7507 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-08-G-D-RA Samtec Inc. HTSW-208-08-G-D-RA -
RFQ
ECAD 7386 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-08-G-S-NA Samtec Inc. HTSW-208-08-G-S-NA 3.1000
RFQ
ECAD 1452 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.109" (2.76mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-08-L-D Samtec Inc. HTSW-208-08-L-D 4.4400
RFQ
ECAD 9587 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.200" (5.08mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-L-Q-RA Samtec Inc. HTSW-208-08-L-Q-RA -
RFQ
ECAD 5041 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-L-S-LA Samtec Inc. HTSW-208-08-L-S-LA -
RFQ
ECAD 5878 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-S-S-RA Samtec Inc. HTSW-208-08-S-S-RA -
RFQ
ECAD 6524 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-T-Q-LA Samtec Inc. HTSW-208-08-T-Q-LA -
RFQ
ECAD 4918 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-T-Q-RA Samtec Inc. HTSW-208-08-T-Q-RA -
RFQ
ECAD 6768 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.320" (8.13mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-T-S Samtec Inc. HTSW-208-08-T-S 1.6400
RFQ
ECAD 9086 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.200" (5.08mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-T-S-RA Samtec Inc. HTSW-208-08-T-S-RA 1.7500
RFQ
ECAD 9427 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.090" (2.29mm) - 0.122" (3.10mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-08-T-T Samtec Inc. HTSW-208-08-T-T -
RFQ
ECAD 5203 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 105°C - Through Hole - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.200" (5.08mm) 0.530" (13.46mm) 0.100" (2.54mm) Square Tin - Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-F-D-RA Samtec Inc. HTSW-208-09-F-D-RA -
RFQ
ECAD 9756 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.240" (6.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-F-Q-LA Samtec Inc. HTSW-208-09-F-Q-LA -
RFQ
ECAD 5192 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.320" (8.13mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-F-S-RA Samtec Inc. HTSW-208-09-F-S-RA -
RFQ
ECAD 9115 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold 3.00µin (0.076µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-G-Q-RA Samtec Inc. HTSW-208-09-G-Q-RA -
RFQ
ECAD 8122 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.320" (8.13mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-09-G-S-LA Samtec Inc. HTSW-208-09-G-S-LA -
RFQ
ECAD 7906 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Gold Liquid Crystal Polymer (LCP) Natural - - 3.00µin (0.076µm)
HTSW-208-09-L-D-RA Samtec Inc. HTSW-208-09-L-D-RA -
RFQ
ECAD 9690 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 2 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 16 0.100" (2.54mm) All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.240" (6.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-L-S-RE Samtec Inc. HTSW-208-09-L-S-RE -
RFQ
ECAD 1233 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.190" (4.83mm) - 0.122" (3.10mm) Square Gold 10.0µin (0.25µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-S-Q-LA Samtec Inc. HTSW-208-09-S-Q-LA -
RFQ
ECAD 3886 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 3 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 24 0.100" (2.54mm) 16 Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.320" (8.13mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-S-S-LA Samtec Inc. HTSW-208-09-S-S-LA -
RFQ
ECAD 2490 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Kinked Pin, Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
HTSW-208-09-S-S-RA Samtec Inc. HTSW-208-09-S-S-RA -
RFQ
ECAD 9815 0.00000000 Samtec Inc. HTSW Bulk Active -55°C ~ 125°C - Through Hole, Right Angle - HTSW-208 Solder - Board to Board or Cable ROHS3 Compliant Not Applicable EAR99 8536.69.4040 1 Header 1 Varies by Wire Gauge Phosphor Bronze UL94 V-0 Male Pin 0.200" (5.08mm) 8 - All Unshrouded Push-Pull 0.230" (5.84mm) 0.290" (7.37mm) - 0.122" (3.10mm) Square Gold 30.0µin (0.76µm) Tin Liquid Crystal Polymer (LCP) Natural - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse