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Soldering, Desoldering, Rework Products(1194)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Accessory Type | For Use With/Related Products | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CQ100GE.020 1LB | 64.0300 |  |
27 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | CQ100G | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-CQ100GE.0201LB | EAR99 | 8311.90.0000 | 1 | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | Lead Free | ||||||
 |
EXB-SN96.5AG3.0CU0.5-0.5LB | 34.4400 | |
60 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN96 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN96.5AG3.0CU0.5-0.5LB | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 0.5 lb (227g) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | Leaded | ||||||
 |
NC191LTA500T5C | 135.9000 | |
1 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA500T5C | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Cartridge, 17.64 oz (500g) | - | 279°F (137°C) | No-Clean | - | - | 5 | |||||
 |
NC191LTA50 | 18.9500 | |
6823 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA50 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 1.76 oz (50g) | - | 279°F (137°C) | No-Clean | - | - | 4 | |||||
 |
EXB-SN96AG4 | 64.1300 | |
11 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN96 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN96AG4 | EAR99 | 8311.90.0000 | 1 | Sn96Ag4 (96/4) | Bar, 1 lb (454g) | - | 430°F (221°C) | - | - | Leaded | ||||||
 |
NC191LTA50T5 | 27.9500 | |
1338 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA50T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 1.76 oz (50g) | - | 279°F (137°C) | No-Clean | - | - | 5 | |||||
 |
NC191AX500C | 89.9000 | |
2 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX500C | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | |||||
 |
NC3SW.020 0.3OZ | 5.9900 | |
35 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC3SW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC3SW.0200.3OZ | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||||
 |
NC2SWLF.031 0.5OZ | 2.6900 | |
30 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC2SWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | ||||||
 |
NC191LTA250 | 57.9500 | |
8544 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA250 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 8.8 oz (250g) | - | 279°F (137°C) | No-Clean | - | - | 4 | |||||
 |
NCSW.020 0.3OZ | 3.1800 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NCSW.0200.3OZ | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Tube, 0.3 oz (8.51g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | ||||||
 |
NC191LTA250T5 | 67.9500 | |
3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA250T5 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 8.8 oz (250g) | - | 279°F (137°C) | No-Clean | - | - | 5 | |||||
 |
NCSWLF.031 0.5OZ | 4.6700 | |
627 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NCSWLF.0310.5OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.50 oz (14.17g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | - | ||||||
 |
REM4.5 | 24.5200 | |
13 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Removal Alloy | SMD Components | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-REM4.5 | EAR99 | 8311.30.6000 | 1 | |||||||||||||
 |
SMD2SWLT.047 1OZ | 22.3700 | |
14 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD2SWLT.0471OZ | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Spool, 1 oz (28.35g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||||
 |
TS991SNL500T4 | 97.0900 | |
6 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | TS991S | 12 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-TS991SNL500T4 | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | No-Clean | - | Lead Free | 4 | ||||||
 |
WS991AX500T4 | 105.7700 | |
2 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | WS991 | 6 Months | Date of Manufacture | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-WS991AX500T4 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | - | 361°F (183°C) | Water Soluble | - | Leaded | 4 | ||||||
 |
REM8 | 47.1700 | |
1 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Removal Alloy | SMD Components | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-REM8 | EAR99 | 8311.90.0000 | 1 | |||||||||||||
 |
SMDSWLT.047 1OZ | 16.3100 | |
8 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLT.0471OZ | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Spool, 1 oz (28.35g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||||
 |
SMD3SWLT.047 8OZ | 66.3400 | |
4 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.0478OZ | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 8 oz (227g), 1/2 lb | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||||
 |
REM16 | 70.4900 | |
3 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Removal Alloy | SMD Components | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-REM16 | EAR99 | 8311.30.3000 | 1 | |||||||||||||
 |
WS991SNL500T4 | 97.0900 | |
2271 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | WS991 | 6 Months | Date of Manufacture | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-WS991SNL500T4 | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | 4 | ||||||
 |
SMD2SWLT.047 8OZ | 67.7500 | |
4 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD2SWLT.0478OZ | EAR99 | 8311.30.6000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Spool, 8 oz (227g), 1/2 lb | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||||
 |
SMD3SWLT.047 2OZ | 24.6200 | |
11 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.0472OZ | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 2 oz (56.70g) | 0.047" (1.19mm) | 280°F (138°C) | - | - | Lead Free | |||||||
 |
SMD4300LTLFP250T4 | 106.8000 | |
4295 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | - | 6 Months | Date of Manufacture | 32°F ~ 77°F (0°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 280°F (138°C) | No-Clean | - | Lead Free | ||||||
 |
TS391SNL250 | 69.9500 | |
8241 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | |||||
 |
TS391SNL500C | 119.9500 | |
2964 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | |||||
|
TS391SNL50 | 17.9500 | |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | |||||
 |
TS391LT250 | 84.9500 | |
1121 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | |||||
 |
TS391LT50 | 21.9500 | |
9665 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)