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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Type Material Base Product Number Accessory Type For Use With/Related Products Thickness Weight Shelf Life Shelf Life Start Storage/Refrigeration Temperature Shipping Info DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Composition Form Pitch Diameter Number of Positions Melting Point Flux Type Wire Gauge Process SIC Storage Mesh Type Inner Dimension Outer Dimension Thermal Center Pad
SMD291AX10T4 Chip Quik Inc. SMD291AX10T4 24.9500
RFQ
ECAD 3935 0.00000000 Chip Quik Inc. - Syringe Active Solder Paste SMD291 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Syringe, 1.23 oz (35g), 10cc - 361°F (183°C) No-Clean - Leaded Refrigerated 4
SMD4300AX250T4 Chip Quik Inc. SMD4300AX250T4 51.9500
RFQ
ECAD 9 0.00000000 Chip Quik Inc. CHIPQUIK® SMD4300 Jar Active Solder Paste SMD4300 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Jar, 8.8 oz (250g) - 361°F (183°C) No-Clean, Water Soluble - Leaded Refrigerated 4
SMDLTLFP10T4 Chip Quik Inc. SMDLTLFP10T4 26.9500
RFQ
ECAD 3315 0.00000000 Chip Quik Inc. - Syringe Active Solder Paste SMDLTL 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc - 281°F (138°C) No-Clean - Lead Free Refrigerated 4
SMD291AX250T3 Chip Quik Inc. SMD291AX250T3 41.9500
RFQ
ECAD 3453 0.00000000 Chip Quik Inc. - Jar Active Solder Paste SMD291 0.551 lb (249.93 g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn63Pb37 (63/37) Jar, 8.8 oz (250g) - 361°F (183°C) No-Clean - Leaded Refrigerated 3
SMDLTLFP250T3 Chip Quik Inc. SMDLTLFP250T3 69.9500
RFQ
ECAD 5134 0.00000000 Chip Quik Inc. - Jar Active Solder Paste SMDLTL 0.551 lb (249.93 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g) - 281°F (138°C) No-Clean - Lead Free Refrigerated 3
SMD291AX250T5 Chip Quik Inc. SMD291AX250T5 90.9500
RFQ
ECAD 4023 0.00000000 Chip Quik Inc. - Jar Active Solder Paste SMD291 0.551 lb (249.93 g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn63Pb37 (63/37) Jar, 8.8 oz (250g) - 361°F (183°C) No-Clean - Leaded Refrigerated 5
SMD4300SNL250T5 Chip Quik Inc. SMD4300SNL250T5 103.9500
RFQ
ECAD 8 0.00000000 Chip Quik Inc. CHIPQUIK® SMD4300 Jar Active Solder Paste SMD4300 0.551 lb (249.93 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 8311.30.6000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - Lead Free Refrigerated 5
BGA0006-S Chip Quik Inc. BGA0006-S 20.9900
RFQ
ECAD 4 0.00000000 Chip Quik Inc. Proto-Advantage BGA Bulk Active BGA Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected BGA0006S EAR99 8515.19.0000 1 0.039" (1.00mm) 484 - 2.600" L x 1.800" W (66.04mm x 45.72mm) -
BGA0002-S Chip Quik Inc. BGA0002-S 20.9900
RFQ
ECAD 1 0.00000000 Chip Quik Inc. Proto-Advantage BGA Bulk Active BGA Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected BGA0002S EAR99 8515.19.0000 1 0.031" (0.80mm) 324 - 1.950" L x 1.350" W (49.53mm x 34.29mm) -
SMD4300SNL10T5 Chip Quik Inc. SMD4300SNL10T5 38.9500
RFQ
ECAD 3763 0.00000000 Chip Quik Inc. CHIPQUIK® SMD4300 Syringe Active Solder Paste SMD4300 0.077 lb (34.93 g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C) Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. download ROHS3 Compliant Not Applicable REACH Unaffected EAR99 3810.10.0000 1 Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - Lead Free Refrigerated 5
SMDSW.031 1LB Chip Quik Inc. SMDSW.031 1LB 40.6700
RFQ
ECAD 1 0.00000000 Chip Quik Inc. - Bulk Active Wire Solder SMDSW - - - - download RoHS non-compliant Not Applicable REACH Affected EAR99 8311.30.3000 1 Sn63Pb37 (63/37) Spool, 1 lb (454 g) 0.031" (0.79mm) 361°F (183°C) No-Clean, Water Soluble 20 AWG, 22 SWG Leaded -
SMD2SW.020 1LB Chip Quik Inc. SMD2SW.020 1LB 40.0500
RFQ
ECAD 1 0.00000000 Chip Quik Inc. SMD2 Bulk Active Wire Solder SMD2S - - - - download RoHS non-compliant Not Applicable REACH Affected EAR99 8311.30.3000 1 Sn60Pb40 (60/40) Spool, 1 lb (454 g) 0.020" (0.51mm) 361 ~ 370°F (183 ~ 188°C) No-Clean, Water Soluble 24 AWG, 25 SWG Leaded -
SMD3SW.031 1LB Chip Quik Inc. SMD3SW.031 1LB 75.5400
RFQ
ECAD 8951 0.00000000 Chip Quik Inc. SMD3 Bulk Active Wire Solder SMD3S - - - - download ROHS3 Compliant Not Applicable REACH Affected EAR99 8311.30.3000 1 Sn62Pb36Ag2 (62/36/2) Spool, 1 lb (454 g) 0.031" (0.79mm) 354°F (179°C) No-Clean, Water Soluble 20 AWG, 22 SWG Leaded -
TS391AX250 Chip Quik Inc. TS391AX250 54.9500
RFQ
ECAD 8359 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste TS391A 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C) - download RoHS non-compliant Not Applicable REACH Affected EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Jar, 8.8 oz (250g) - 361°F (183°C) No-Clean - Leaded 4
TS391AX50 Chip Quik Inc. TS391AX50 13.9500
RFQ
ECAD 2118 0.00000000 Chip Quik Inc. - Bulk Active Solder Paste TS391A 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C) - download RoHS non-compliant Not Applicable REACH Affected EAR99 3810.10.0000 1 Sn63Pb37 (63/37) Jar, 1.76 oz (50g) - 361°F (183°C) No-Clean - Leaded 4
SMD3SW.031 8OZ Chip Quik Inc. SMD3SW.031 8OZ 45.3200
RFQ
ECAD 1 0.00000000 Chip Quik Inc. SMD3 Bulk Active Wire Solder SMD3S - - - - download ROHS3 Compliant 1 (Unlimited) REACH Affected EAR99 8311.30.3000 1 Sn62Pb36Ag2 (62/36/2) Spool, 8 oz (227g), 1/2 lb 0.031" (0.79mm) 354°F (179°C) No-Clean, Water Soluble 20 AWG, 22 SWG Leaded -
SMD2SWLF.020 8OZ Chip Quik Inc. SMD2SWLF.020 8OZ 38.4200
RFQ
ECAD 1 0.00000000 Chip Quik Inc. SMD2 Bulk Active Wire Solder SMD2S - - - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8311.30.6000 1 Sn99.3Cu0.7 (99.3/0.7) Spool, 8 oz (227g), 1/2 lb 0.020" (0.51mm) 441°F (227°C) No-Clean, Water Soluble 24 AWG, 25 SWG Lead Free -
BGA0019-S Chip Quik Inc. BGA0019-S 20.9900
RFQ
ECAD 1 0.00000000 Chip Quik Inc. Proto-Advantage BGA Bulk Active BGA Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 7326.90.8688 1 0.016" (0.40mm) 36 - 1.300" L x 0.900" W (33.02mm x 22.86mm) -
SMD8NL Chip Quik Inc. SMD8NL 63.0000
RFQ
ECAD 2 0.00000000 Chip Quik Inc. CHIPQUIK® Tube Active SMD8 Removal Alloy - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected SMD 8NL EAR99 8311.30.6000 1
IPC0250-S Chip Quik Inc. IPC0250-S 11.5900
RFQ
ECAD 10 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active - Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant Not Applicable REACH Unaffected 315-IPC0250-S 1 0.150" (3.81mm) 8 0.400" L x 0.390" W (10.16mm x 9.91mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) -
JET551AX30T5 Chip Quik Inc. JET551AX30T5 91.9500
RFQ
ECAD 7299 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 12 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Affected 315-JET551AX30T5 1 Sn63Pb37 (63/37) Syringe, 3.53 oz (100g) - 361°F (183°C) No-Clean - Leaded
SMDLTB35T4 Chip Quik Inc. SMDLTB35T4 25.9500
RFQ
ECAD 4707 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 6 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-SMDLTB35T4 1 Sn60Bi40 (60/40) Syringe, 1.23 oz (35g), 10cc - 280°F ~ 338°F (138°C ~ 170°C) No-Clean - -
IPC0252-S Chip Quik Inc. IPC0252-S 11.5900
RFQ
ECAD 10 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active PowerPAK Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant Not Applicable REACH Unaffected 315-IPC0252-S 1 0.026" (0.65mm) 8 0.130" L x 0.130" W (3.30mm x 3.30mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) -
WS995 Chip Quik Inc. WS995 17.9500
RFQ
ECAD 46 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Flux - Lead Free, Water-Soluble 24 Months Date of Manufacture 37°F ~ 77°F (3°C ~ 25°C) - download ROHS3 Compliant Not Applicable REACH Unaffected 315-WS995 1 Syringe, 0.35 oz (10g), 10cc
SMDSN90AU10-2FT Chip Quik Inc. SMDSN90AU10-2FT 39.9500
RFQ
ECAD 18 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Wire Solder - 60 Months Date of Manufacture - - download ROHS3 Compliant Not Applicable REACH Unaffected 315-SMDSN90AU10-2FT EAR99 8311.30.6000 1 Sn90Au10 (90/10) Spool 0.016" (0.40mm) 423°F (217°C) - - Lead Free
NFIPA-500ML Chip Quik Inc. NFIPA-500ML 34.9500
RFQ
ECAD 9120 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Flux Remover 24 Months Date of Manufacture 20°C ~ 25°C - download ROHS3 Compliant Not Applicable REACH Unaffected 315-NFIPA-500ML EAR99 2903.29.0000 1 Can, 22.399 oz (635g)
IPC0244-S Chip Quik Inc. IPC0244-S 11.5900
RFQ
ECAD 10 0.00000000 Chip Quik Inc. Proto-Advantage IPC Bulk Active BGA Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant Not Applicable REACH Unaffected 315-IPC0244-S 1 0.014" (0.35mm) 4 0.033" L x 0.033" W (0.85mm x 0.85mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) -
IPC0248-S Chip Quik Inc. IPC0248-S 11.5900
RFQ
ECAD 10 0.00000000 Chip Quik Inc. Proto-Advantage IPC Bulk Active PLCC Stainless Steel 0.0040" (0.102mm) download ROHS3 Compliant Not Applicable REACH Unaffected 315-IPC0248-S 1 0.050" (1.27mm) 12 0.197" L x 0.197" W (5.00mm x 5.00mm) 1.300" L x 0.900" W (33.02mm x 22.86mm) -
JET551LT30T5 Chip Quik Inc. JET551LT30T5 99.9500
RFQ
ECAD 2191 0.00000000 Chip Quik Inc. CHIPQUIK® Bulk Active Solder Paste - 12 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected 315-JET551LT30T5 1 Sn42Bi57.6Ag0.4 (42/57.6/0.4) Syringe, 3.53 oz (100g) - 280°F (138°C) No-Clean - -
CQ-SS-SNBIAG-0.60MM-25000 Chip Quik Inc. CQ-SS-SNBIAG-0.60MM-25000 76.9500
RFQ
ECAD 6 0.00000000 Chip Quik Inc. - Bulk Active Solder Sphere - 24 Months Date of Manufacture - - download ROHS3 Compliant 1 (Unlimited) 315-CQ-SS-SNBIAG-0.60MM-25000 EAR99 8311.90.0000 1 Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar 0.024" (0.61mm) 280°F (138°C) - - -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse