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Soldering, Desoldering, Rework Products(1194)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Material | Base Product Number | Accessory Type | For Use With/Related Products | Thickness | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Pitch | Diameter | Number of Positions | Melting Point | Flux Type | Wire Gauge | Process | Mesh Type | Inner Dimension | Outer Dimension | Thermal Center Pad |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TS391SNL50 | 17.9500 |  |
8 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391S | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 4 | ||||||||||||
 |
TS391LT250 | 84.9500 | |
1121 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||||||||||
 |
TS391LT50 | 21.9500 | |
9665 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||||||||||
 |
CQNTRM-0.5 | 9.9500 | |
5 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux Remover - Lead Free | CQNTRM | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3814.00.5090 | 1 | Bottle, 0.50 oz (14.17g) | ||||||||||||||||||||
 |
SMD2SW.031 2OZ | 10.0800 | |
3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn60Pb40 (60/40) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | Leaded | ||||||||||||
 |
SMD3SW.031 1OZ | 14.3500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | - | Leaded | ||||||||||||
 |
SMDSWLF.015 4OZ | 31.9900 | |
3 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 4 oz (113.40g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||||||||||
 |
SMD2150 | 103.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.010" (0.25mm) | 361°F (183°C) | - | - | Leaded | |||||||||||||
 |
SMD2195-25000 | 16.7900 | |
13 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.022" (0.56mm) | 361°F (183°C) | - | - | Leaded | |||||||||||||
 |
SMD2020-25000 | 28.9900 | |
7617 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||||||||||
 |
CQ2LF-128 | 245.9500 | |
2643 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Rosin Activated (RA), Lead Free, Water-Soluble, Liquid | CQ2LF | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Jug, 128 oz (3.62kg) | ||||||||||||||||||||
 |
RASW.031 2OZ | 6.1100 | |
20 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0312OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Leaded | |||||||||||||||
 |
RASW.020 4OZ | 10.8700 | |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0204OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||||||||
 |
RASWLF.031 2OZ | 11.2000 | |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | 60 Months | Date of Manufacture | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0312OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Lead Free | ||||||||||||||
 |
RASWLF.015 1LB | 96.9500 | |
6411 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0151LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||||||||||||
 |
RASWLF.015 8OZ | 67.8700 | |
2565 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | 60 Months | Date of Manufacture | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0158OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | ||||||||||||||
 |
RASWLF.020 .4OZ | 11.1500 | |
11 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.020.4OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.4 oz (11.34g) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Lead Free | |||||||||||||||
 |
NC2SW.020 1LB | 40.0500 | |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC2SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC2SW.0201LB | EAR99 | 8311.30.3000 | 1 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||||||||
 |
NC4SW.020 1LB | 36.7500 | |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NC4SW | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | NC4SW.0201LB | EAR99 | 8311.30.3000 | 1 | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||||||||||
 |
SMDIN100-R | 67.0000 | |
2126 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Ribbon Solder | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | In100 (100) | Spool | - | 315°F (157°C) | - | - | Lead Free | ||||||||||||||
 |
SMDIN52SN48-R | 44.0000 | |
17 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Ribbon Solder | SMDIN | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | In52Sn48 (52/48) | Spool | - | 244°F (118°C) | - | - | Lead Free | ||||||||||||||
 |
BGA0030-S | 20.9900 | |
4 | 0.00000000 | Chip Quik Inc. | Proto-Advantage BGA | Bulk | Active | BGA | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 7326.90.8688 | 1 | 0.020" (0.50mm) | 36 | - | 1.300" L x 0.900" W (33.02mm x 22.86mm) | - | ||||||||||||||||||
 |
SMD3SWLT.040 50G | 70.9500 | |
6128 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04050G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 1.8 oz (50g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | |||||||||||||
 |
REMKIT-NL | 11.9500 | |
7 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Removal Alloy | SMD Components | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-REMKIT-NL | EAR99 | 8311.30.3000 | 1 | ||||||||||||||||||||
 |
RMA591NL | 24.9900 | |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Rosin Mildly Activated (RMA) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-RMA591NL | EAR99 | 3402.90.5030 | 1 | Syringe, 0.35 oz (10g), 10cc | ||||||||||||||||||||
 |
RMA591 | 24.9900 | |
5 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Rosin Mildly Activated (RMA) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-RMA591 | EAR99 | 3402.90.5030 | 1 | Syringe, 0.35 oz (10g), 10cc | ||||||||||||||||||||
 |
NDR040P040-S | 11.5900 | |
6 | 0.00000000 | Chip Quik Inc. | Proto-Advantage NDR | Bulk | Active | - | Stainless Steel | NDR040 | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NDR040P040-S | EAR99 | 7326.90.8688 | 1 | 0.016" (0.40mm) | 40 | - | - | - | ||||||||||||||||
 |
SMD291SNL50T6 | 99.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291SNL50T6 | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | 6 | ||||||||||||
 |
NDR050P080-S | 11.5900 | |
2461 | 0.00000000 | Chip Quik Inc. | Proto-Advantage NDR | Bulk | Active | - | Stainless Steel | NDR050 | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NDR050P080-S | EAR99 | 7326.90.8688 | 1 | 0.020" (0.50mm) | 80 | - | - | - | ||||||||||||||||
 |
CQ100GE 35G | 28.9500 | |
1 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | CQ100G | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-CQ100GE35G | EAR99 | 8311.90.0000 | 1 | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Syringe, 1.23 oz (35g), 10cc | - | 441°F (227°C) | No-Clean | - | Lead Free | 4 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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