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Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Material | Base Product Number | Accessory Type | For Use With/Related Products | Thickness | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Pitch | Diameter | Number of Positions | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type | Inner Dimension | Outer Dimension | Thermal Center Pad |
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CQ9LF-1.0 | 14.9500 | 6 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Rosin Mildly Activated (RMA) | CQ9LF | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-CQ9LF-1.0 | EAR99 | 3810.10.0000 | 1 | Bottle, 1 oz (28.35g) | ||||||||||||||||||||||
SMDSWLF.031 1OZ | 11.3800 | 25 | 0.00000000 | Chip Quik Inc. | - | Spool | Active | Wire Solder | SMDSW | 0.062 lb (28.12 g) | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Lead Free | - | ||||||||||||||
SMD3SWLT.040 20G | 33.0500 | 9684 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04020G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 0.7 oz (20g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | ||||||||||||||||
WS991AX35T4 | 39.2900 | 7 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-WS991AX35T4 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (34.869g) | - | 361°F (183°C) | Water Soluble | - | - | 4 | ||||||||||||||
EXB-SN99.3CU0.7 | 36.4500 | 5 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN99 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN99.3CU0.7 | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | - | 441°F (227°C) | - | - | Leaded | ||||||||||||||||
SMD291SNLT4 | 18.9900 | 3 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 4 | ||||||||||||||
SGF991-5CC | 13.0300 | 5622 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Lead Free, Water-Soluble | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-SGF991-5CC | EAR99 | 3810.10.0000 | 1 | Syringe, 0.176 oz (5g), 5cc | ||||||||||||||||||||||
SMDSWLF.020 .4OZ | 11.4900 | 1 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | SMDSWLF.020.4OZ | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Tube, 0.4 oz (11.34g) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | ||||||||||||||
NC191AX35 | 16.9500 | 3 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX35 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | No-Clean | - | Leaded | 4 | |||||||||||||||
NCSWLF.031 1LB | 87.5500 | 9 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | NCSW | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | NCSWLF.0311LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 20 AWG, 21 SWG | Lead Free | ||||||||||||||||
CQNTRM-1.0 | 14.9500 | 13 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux Remover - Lead Free | CQNTRM | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3814.00.5090 | 1 | Bottle, 1 oz (28.35g) | |||||||||||||||||||||||
SMDSW.020 8OZ | 24.9100 | 7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Leaded | - | |||||||||||||||
SMD2020 | 125.9500 | 1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | ||||||||||||||||
NC191LTA15 | 10.9500 | 12 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA15 | EAR99 | 8311.30.6000 | 1 | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | - | 279°F (137°C) | No-Clean | - | - | 4 | |||||||||||||||
NC191LT50T5 | 27.9500 | 9933 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LT50T5 | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | - | 280°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 5 | |||||||||||||
NC191AX250T5 | 77.9500 | 2695 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-NC191AX250T5 | EAR99 | 3810.10.0000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | 5 | |||||||||||||||
NCSWLF.015 1LB | 99.7800 | 11 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | NCSW | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-NCSWLF.0151LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.592g) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | ||||||||||||||
REM32 | 109.2300 | 2 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Removal Alloy | SMD Components | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-REM32 | EAR99 | 8311.90.0000 | 1 | |||||||||||||||||||||||
BARSN99.3CU0.7-8OZ | 25.6700 | 34 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN99.3 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 0.5 lb (227g) | - | 441°F (227°C) | - | - | Lead Free | |||||||||||||||||
SMD291-5M | 9.9500 | 38 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - No Clean | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD291-5M | EAR99 | 3810.10.0000 | 1 | Syringe, 0.18 oz (5g), 5cc | ||||||||||||||||||||||
PA0108-S | 11.5900 | 8440 | 0.00000000 | Chip Quik Inc. | Proto-Advantage PA | Bulk | Active | PLCC/JLCC | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8515.19.0000 | 1 | 0.050" (1.27mm) | 68 | 0.984" L x 0.984" W (25.00mm x 25.00mm) | 1.950" L x 1.350" W (49.53mm x 34.29mm) | - | |||||||||||||||||||||
IPC0077-S | 11.5900 | 2230 | 0.00000000 | Chip Quik Inc. | Proto-Advantage IPC | Bulk | Active | MSOP | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 7218.10.0000 | 1 | 0.020" (0.50mm) | 10 | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 1.300" L x 0.900" W (33.02mm x 22.86mm) | 0.110" L x 0.079" W (2.80mm x 2.00mm) | |||||||||||||||||||||
NFIPA-AERO | 14.9500 | 44 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Flux Remover - Rosin Activated (RA) | 24 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-NFIPA-AERO | 1 | Aerosol, 5.75 oz (163.009g) | |||||||||||||||||||||||||
SMDSWLF.004 20G | 199.9500 | 6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | - | ROHS3 Compliant | 1 (Unlimited) | 315-SMDSWLF.00420G | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.7 oz (20g) | 0.004" (0.10mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | ||||||||||||||||
COSOLV55-1.0 | 17.9500 | 44 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Flux Remover | - | - | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-COSOLV55-1.0 | EAR99 | 3810.10.0000 | 1 | Bottle, 1 oz (28.35g) | |||||||||||||||||||||||
CQ-SS-SNBIAG-0.45MM-25000 | 59.9500 | 10 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.45MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.018" (0.46mm) | 280°F (138°C) | - | - | - | ||||||||||||||||
COSOLV165-1.0 | 14.9500 | 49 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Flux Remover | - | - | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-COSOLV165-1.0 | EAR99 | 3810.10.0000 | 1 | Bottle, 1 oz (28.35g) | |||||||||||||||||||||||
CQ-SS-SNBIAG-0.20MM-25000 | 57.9500 | 9 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | 1 (Unlimited) | 315-CQ-SS-SNBIAG-0.20MM-25000 | EAR99 | 8311.90.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar | 0.008" (0.20mm) | 280°F (138°C) | - | - | - | ||||||||||||||||
SMDSWLF.006 10G | 39.9900 | 3 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.00610G | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 0.35 oz (10g) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | |||||||||||||||
ST0002-S | 49.9500 | 4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | - | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-ST0002-S | EAR99 | 8515.19.0000 | 1 | - | - | 5.000" L x 4.000" W (127.00mm x 101.60mm) | - |
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