Tel: +86-0755-83501315
Email: sales@sic-components.com
Pricing(USD) |
Quantity |
ECAD |
Mfr |
Series |
Package |
Product Status |
Operating Temperature |
Package / Case |
Supplier Device Package |
Other Names |
Standard Package |
Architecture |
Number of I/O |
Core Processor |
Speed |
Connectivity |
Peripherals |
RAM Size |
Flash Size |
Primary Attributes |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
- |
Intel |
* |
Tray |
Active |
544-AGFC019R31C3E3V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIA035R39A2E3E |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIC040R39A2E3E |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFB023R31C2E3V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIB023R18A1I2V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIB019R31B2I2V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFB023R31C3I3E |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGID019R31B1E1V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFD019R31C2E3V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFD019R31C2I2V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFD023R31C3I3E |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIA035R39A2E2VB |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIB027R31A2I1VB |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFD019R31C2I1V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGFD019R31C3E3E |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGID041R29D2E3V |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIB027R31A2E1VB |
3 |
||||||||||||||
- |
Intel |
* |
Tray |
Active |
544-AGIA040R39A2I3E |
3 |
||||||||||||||
- |
Intel |
Agilex F |
Tray |
Active |
-40°C ~ 100°C (TJ) |
2340-BFBGA Exposed Pad |
2340-BGA (45x42) |
544-AGFB014R24C2I1VB |
1 |
MPU, FPGA |
744 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 1.4M Logic Elements |
||
- |
Intel |
Agilex I |
Tray |
Active |
-40°C ~ 100°C (TJ) |
1805-BBGA Exposed Pad |
1805-BGA (42.5x42.5) |
544-AGID019R18A1I1VB |
1 |
MPU, FPGA |
480 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 1.9M Logic Elements |
||
- |
Intel |
Agilex I |
Tray |
Active |
-40°C ~ 100°C (TJ) |
3184-BFBGA Exposed Pad |
3184-BGA (56x45) |
544-AGID019R31B1I1VB |
1 |
MPU, FPGA |
480 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 1.9M Logic Elements |
||
- |
Intel |
Agilex F |
Tray |
Active |
0°C ~ 100°C (TJ) |
3184-BFBGA Exposed Pad |
3184-BGA (56x45) |
544-AGFB023R31C2E1VB |
1 |
MPU, FPGA |
480 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.3M Logic Elements |
||
- |
Intel |
Agilex F |
Tray |
Active |
-40°C ~ 100°C (TJ) |
3184-BFBGA Exposed Pad |
3184-BGA (56x45) |
544-AGFA027R31C2I1VB |
1 |
MPU, FPGA |
720 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.7M Logic Elements |
||
- |
Intel |
Agilex I |
Tray |
Active |
0°C ~ 100°C (TJ) |
3184-BFBGA Exposed Pad |
3184-BGA (56x45) |
544-AGIB027R31A3E3V |
1 |
MPU, FPGA |
720 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.7M Logic Elements |
||
- |
Intel |
Agilex I |
Tray |
Active |
0°C ~ 100°C (TJ) |
3184-BFBGA Exposed Pad |
3184-BGA (56x45) |
544-AGIB022R31B2E1VB |
1 |
MPU, FPGA |
720 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.2M Logic Elements |
||
- |
Intel |
Agilex F |
Tray |
Active |
-40°C ~ 100°C (TJ) |
2340-BFBGA Exposed Pad |
2340-BGA (45x42) |
544-AGFB023R24C2I2VB |
1 |
MPU, FPGA |
480 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.3M Logic Elements |
||
- |
Intel |
Agilex I |
Tray |
Active |
-40°C ~ 100°C (TJ) |
3184-BFBGA Exposed Pad |
3184-BGA (56x45) |
544-AGIB023R31B2I2VB |
1 |
MPU, FPGA |
480 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.3M Logic Elements |
||
- |
Intel |
Agilex F |
Tray |
Active |
0°C ~ 100°C (TJ) |
2340-BFBGA Exposed Pad |
2340-BGA (45x42) |
544-AGFD023R24C3E4X |
1 |
MPU, FPGA |
480 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 2.3M Logic Elements |
||
- |
Intel |
* |
Tray |
Active |
544-AGFA019R31C2E2VB |
3 |
||||||||||||||
- |
Intel |
Agilex F |
Tray |
Active |
-40°C ~ 100°C (TJ) |
1546-BFBGA Exposed Pad |
1546-BGA (37.5x34) |
544-AGFB006R16A2I1VB |
1 |
MPU, FPGA |
384 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point |
1.4GHz |
EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
DMA, WDT |
256KB |
- |
FPGA - 573K Logic Elements |
Daily average RFQ Volume
Standard Product Unit
Worldwide Manufacturers
In-stock Warehouse