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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0820-05-2BI81MA | 459.0000 |  |
3339 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81MA | 1 | ||||||||||||||
|
TE0720-04-61C33MA | 279.0000 | |
2903 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61C33MA | 1 | Zynq™ XC7Z020-1CLG484C | - | 8GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0813-01-3AE11-A | 447.9600 | |
8335 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3AE11-A | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0817-01-7DI21-A | 2.0000 | |
6465 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
AM0010-02-5DE21MA | 1.0000 | |
1842 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DE21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0803-03-2AE11-A | - | |
3216 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
 |
TE0745-01-45-2I | - | |
1818 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | |||||
|
TE0807-03-4BE21-A | 1.0000 | |
3404 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-4BE21-A | 1 | Zynq™ UltraScale+™ XCZU4EG-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0803-03-3BE11-AS | - | |
4073 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-3BE11-AS | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
 |
TE0720-03-61Q33FA | - | |
7695 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0714-04-42I-7-L | - | |
3402 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Active | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | - | 1686-TE0714-04-42I-7-L | 1 | Artix-7 A35T | - | - | 16MB | FPGA | Artix-7 | - | |||||||
|
TE0821-01-2AE31PA | 493.0000 | |
3541 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-2AE31PA | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 4GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
 |
TE0723-02 | - | |
7918 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Bulk | Discontinued at SIC | 0°C ~ 70°C | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 128MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | Arduino | |||||
|
TE0741-04-B2C-1-AF | 880.9600 | |
4316 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-B2C-1-AF | 1 | Xilinx Kintex-7 FPGA XC7K160T-2FFG676C | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0712-03-72C36-A | 324.4500 | |
8721 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0712-03-72C36-A | 1 | Artix-7 XC7A100T-2FGG484C | - | 1GB | 32MB | FPGA | - | Board-to-Board (BTB) Socket - 160 | |||||||
|
TE0820-05-3BE81ML | 515.0000 | |
3016 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-3BE81ML | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
TE0820-03-3AE21FA | - | |
1578 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Obsolete | download | 1 (Unlimited) | 1686-TE0820-03-3AE21FA | OBSOLETE | 1 | ||||||||||||||
|
TE0807-03-7DI21-A | 2.0000 | |
2823 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Box | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0807 | download | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DI21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900I | - | 4GB | 128MB | MPU Core | - | B2B | ||||
 |
TE0782-02-035-2I | - | |
8946 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Obsolete | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | TE0782 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec QTH | |||
|
TE0723-03-11C64-A | 156.4500 | |
1740 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0723-03-11C64-A | 1 | ||||||||||||||
 |
TE0713-02-82C46-A | 450.4500 | |
1451 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0713-02-82C46-A | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A200T-2FBG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | |||
|
TE0821-01-3BI21MA | 611.0000 | |
5570 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BI21MA | 1 | Zynq™ UltraScale+™ XCZU3EG-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 160 Pin | |||||
|
TE0803-02-05EV-1EA | - | |
7687 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-05EV-1EA | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0729-02-62I63FAK | - | |
9110 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-62I63FAK | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||
|
TE0712-03-82I36-A | 466.2000 | |
8931 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | Not Applicable | 1686-TE0712-03-82I36-A | 1 | Artix-7 XC7A200T-2FBG484I | - | 1GB | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | ||||||
|
TE0803-02-04CG-1EB | 724.5000 | |
9854 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-1153 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 256MB | MPU Core | - | B2B | ||
|
TE0820-04-SDR21FA | - | |
5988 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-SDR21FA | OBSOLETE | 1 | - | - | - | - | - | - | |||||
 |
TE0715-04-30-1IA | - | |
4757 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-30-1IA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||||
|
TE0820-04-3BE21FA | - | |
1155 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3BE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0745-02-93E11-A | - | |
1808 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-93E11-A | OBSOLETE | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec ST5 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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