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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0818-01-9GI21-AK | 1.0000 |  |
9517 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | 1686-TE0818-01-9GI21-AK | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | ||||||
|
TEC0850-03-BBEX1-A | - | |
4029 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-BBEX1-A | 1 | |||||||||||||
|
TE0729-02-62I65MM | - | |
7841 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | download | ROHS3 Compliant | Not Applicable | 1686-TE0729-02-62I65MM | 1 | ||||||||||||||
|
TE0841-02-035-1I | - | |
9135 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | |||||
 |
TE0713-02-72C46-A | 387.4500 | |
9431 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0713-02-72C46-A | 3A991D | 8471.50.0150 | 1 | Artix-7 XC7A100T-2FGG484C | 200MHz | 1GB | 32MB | FPGA Core | - | B2B | |||
 |
TE0600-03IN | - | |
3957 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||
 |
TE0600-03-52I11-W | - | |
2592 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-52I11-W | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0720-04-61Q33MA | 345.4500 | |
1343 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-61Q33MA | EAR99 | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||
|
TE0720-03-62I33FA | - | |
4632 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I33FA | 3A991D | 8473.30.1180 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
 |
TE0712-02-82I36-A | - | |
4636 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82I36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0712-02-72C36-A | - | |
7432 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0813-01-2BE11-A | 414.2800 | |
9288 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-2BE11-A | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
 |
TE0720-03-61Q33MA | - | |
7595 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q33MA | EAR99 | 8473.30.1180 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
|
TE0820-04-4AI21FL | - | |
4245 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AI21FL | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784I | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0715-04-51I33-A | - | |
7498 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-51I33-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7015) | Samtec LSHM | |||
|
TE0820-05-2BE21ML | 445.2000 | |
3585 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BE21ML | 1 | ARM® Cortex®-A53, ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E | Pin(s) | |||||||
 |
TE0741-03-160-2IF | - | |
2598 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0820-05-4AI21MI | - | |
5669 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | 1686-TE0820-05-4AI21MI | 1 | - | - | 2GB | 128MB | MPU Core | - | - | |||||||
|
TE0803-04-3AE11-AK | 476.0000 | |
7348 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-3AE11-AK | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0745-02-30-2I | - | |
2460 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | OBSOLETE | 0000.00.0000 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | B2B | |||||
|
TE0715-05-52I33-A | 419.0000 | |
2425 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0715-05-52I33-A | 1 | Zynq™ 7015 XC7Z015-2CLG485I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | |||||
|
TE0823-01-3PIU1F | - | |
9424 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-3PIU1F | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | 1GB | 128MB | MCU, FPGA | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I | USB | ||||||
|
TE0745-02-72I11-A | - | |
3375 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-72I11-A | 3A991D | 8471.50.0150 | 1 | Xilinx Zynq XC7Z030-2FBG676I | - | 1GB | 64MB | MPU Core | - | Samtec ST5 | ||
 |
TE0745-02-45-2IA | - | |
4776 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-1110 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS | ||||
|
TE0808-04-BBE21-AK | 1.0000 | |
1976 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-BBE21-AK | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0725LP-01-72C-1T | 177.4500 | |
2096 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0725LP-01-72C-1T | 1 | Artix-7 A100T | 25MHz | - | 64MB | FPGA Core | - | 50 Pin | ||||
 |
TE0808-04-15EG-1EE | - | |
6581 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
|
TE0745-02-72I31-A | 781.2100 | |
3987 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-72I31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0782-02-92I33MA | 2.0000 | |
1866 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-92I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket | ||||||
 |
TE0741-02-410-2CF | - | |
2980 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 410T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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