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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0820-05-2BI81ML | 459.0000 |  |
3508 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81ML | 1 | ||||||||||||||
 |
TE0741-02-160-2IF | - | |
9256 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0712-02-100-1I | - | |
1786 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0720-04-62I33NA | 382.2000 | |
2748 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33NA | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0782-02-A2I33MA | 2.0000 | |
5666 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | Not Applicable | 1686-TE0782-02-A2I33MA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket | ||||||
|
TE0803-03-4BI21-A | - | |
3292 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Active | TE0803 | - | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-4BI21-A | 1 | |||||||||||||
|
TE0720-03-S008C1 | - | |
5491 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S008C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0808-04-9GI21-AS | - | |
6073 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | Not Applicable | 1686-TE0808-04-9GI21-AS | OBSOLETE | 1 | Zynq UltraScale+ ZU9 | - | 4GB | 128MB | FPGA Core | - | B2B | |||
 |
TE0726-03-41C74-Q | - | |
8051 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Active | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03-41C74-Q | 1 | ARM Cortex-A9 | - | 128MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | |||||
|
TE0745-02-92I31-B | - | |
9269 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-B | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0716-01-61C32-A | 313.0000 | |
1239 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 70°C | 2.559" L x 1.772" W (65.00mm x 45.00mm) | - | ROHS3 Compliant | 1686-TE0716-01-61C32-A | 1 | Zynq™ 7000 SoC XC7Z020 | - | 1GB | 32MB | FPGA | - | Board-to-Board (BTB) Socket, USB | ||||||
|
TE0808-05-9BE21-A | 1.0000 | |
9776 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | 1686-TE0808-05-9BE21-A | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0720-03-62I12GA | - | |
3757 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-62I12GA | OBSOLETE | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | ||||
 |
TE0600-03-83I21-A | 476.7000 | |
2807 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0600-03-83I21-A | 1 | Spartan-6 LX-150 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0808-04-06EG-1E3 | - | |
7858 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-06EG-1E3 | OBSOLETE | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
TE0808-05-BBE81-AK | 1.0000 | |
8978 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE81-AK | 1 | ||||||||||||||
|
TE0720-03-S005 | - | |
2196 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | - | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S005 | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
|
TE0820-04-4AE21FA | - | |
7763 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0600-02B | - | |
8866 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0715-05-71I33-A | 560.7000 | |
6185 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | 1686-TE0715-05-71I33-A | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | |||||||
|
TE0741-04-D2I-1-A | 1.0000 | |
7774 | 0.00000000 | Trenz Electronic GmbH | - | Box | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0741-04-D2I-1-A | 1 | Xilinx Kintex-7 FPGA XC7K325T-2FBG676I | - | - | 32MB | FPGA Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0820-05-2BE81MA | 426.0000 | |
3844 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BE81MA | 1 | ||||||||||||||
|
TE0783-02-92I33MA | 2.0000 | |
8541 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | - | ROHS3 Compliant | 1686-TE0783-02-92I33MA | 1 | Zynq™ 7000 XC7Z045-2FFG900I | - | 1GB | 32MB | MPU Core | ARM Cortex-A9 | Board-to-Board (BTB) Socket | ||||||
|
TEC0117-01 | 37.0200 | |
8398 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TEC0117-01 | 1 | ||||||||||||||
|
TE0724-04-61I32-A | 257.1000 | |
8674 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | -40°C ~ 85°C | 2.362" L x 1.575" W (60.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0724-04-61I32-A | 1 | Zynq™ XC7Z020-1CLG400I | 667MHz | 1GB | 32MB | MPU Core | ARM Cortex-A9 | 1 x 160 Pin | |||||
|
TE0865-02-DGE23MA | 5.0000 | |
1218 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 3.937" L x 2.953" W (100.00mm x 75.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0865-02-DGE23MA | 1 | Zynq™ UltraScale+™ XCZU17EG-2FFVC1760E | - | 4GB | 256MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0817-01-7DE21-A | 1.0000 | |
4119 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0817-01-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0820-05-5DI21MA | 1.0000 | |
4868 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-5DI21MA | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784I | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin | |||||
|
AM0010-02-5DI21MA | 1.0000 | |
7444 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DI21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0821-01-3BE21MA | 527.0000 | |
5971 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0821-01-3BE21MA | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | ARM® Cortex®-A53, ARM® Cortex®-R5 | 2 x 100 Pin |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)