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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0729-02-2IRA | - |  |
1815 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0729-02-2IRA | 1 | ARM Cortex-A9 | - | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | B2B | |||||
|
TE0803-01-04CG-1EA | 708.7500 | |
3388 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | TE0803 | download | ROHS3 Compliant | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0782-02-A2I33FA | - | |
2861 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-A2I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7100) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0782-02-82I33FA | - | |
7041 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-82I33FA | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0782-02-92I33FH | - | |
3704 | 0.00000000 | Trenz Electronic GmbH | TE0782 | Bulk | Active | -40°C ~ 85°C | 3.350" L x 3.350" W (85.00mm x 85.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0782-02-92I33FH | 1 | ARM Cortex-A9 | - | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
|
TE0803-04-4DE11-A | 649.9500 | |
9559 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-04-4DE11-A | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||||
 |
TE0715-04-30-3E | - | |
4475 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-30-3E | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec LSHM | ||||
|
TE0727-02-41C34 | 105.5300 | |
3714 | 0.00000000 | Trenz Electronic GmbH | TE0722 | Bulk | Active | 0°C ~ 70°C | 2.559" L x 1.181" W (65.00mm x 30.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0727-02-41C34 | 1 | Zynq™ XC7Z010-1CLG225C | - | 512MB | 16MB | FPGA | - | USB | |||||
|
TE0803-02-04EG-1ID | - | |
6788 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | - | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-04EG-1ID | OBSOLETE | 1 | - | - | - | - | MPU Core | - | B2B | |||||
|
TE0808-05-9GI81-AK | 1.0000 | |
9045 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI81-AK | 1 | ||||||||||||||
|
TE0820-05-2BE21MAJ | - | |
3829 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0820-05-2BE21MAJ | 1 | ARM® Cortex®-R5 | - | 2GB | 128MB | MPU Core | Xilinx Zynq UltraScale+ XCZU2EG-1SFVC784E | Pin(s) | |||||||
 |
TE0741-02-325-2CF | - | |
3843 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 325T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||||
 |
TE0841-02-035-2I | - | |
8573 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1 (Unlimited) | 1686-1114 | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | ||||
|
TE0715-04-21C33-A | - | |
2633 | 0.00000000 | Trenz Electronic GmbH | TE0715 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0715-04-21C33-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 125MHz | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7012S) | Samtec LSHM | |||
|
TE0813-01-3BE11-A | 520.9300 | |
3537 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-3BE11-A | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0808-05-6BE21-A | 1.0000 | |
1068 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-A | 1 | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
|
TE0745-02-92I31-AK | 1.0000 | |
8083 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-AK | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
 |
TE0725-02-15-1C | - | |
9415 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A15T | 100MHz | - | 32MB | FPGA Core | - | 50 Pin | ||||
|
TE0745-02-91C11-A | - | |
6331 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-91C11-A | OBSOLETE | 1 | Xilinx Zynq XC7Z045-1FBG676C | - | 1GB | 64MB | MPU Core | - | Samtec ST5 | |||
|
TE0803-02-03-1EA-S | - | |
6819 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-03-1EA-S | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | B2B | |||||
 |
TE0300-01IBMLP | 167.0000 | |
2740 | 0.00000000 | Trenz Electronic GmbH | TE0300 | Bulk | Not For New Designs | 0°C ~ 70°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0300 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3E | 100MHz | 64MB | 4MB | FPGA, USB Core | Cypress FX2 USB 2.0 | B2B | |||
|
TE0808-05-9BE21-L | 1.0000 | |
5039 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE21-L | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 160 | |||||
|
TE0745-02-92I31-A | 1.0000 | |
5510 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-92I31-A | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7045) | Board-to-Board (BTB) Socket - 480 | |||||
 |
TE0723-03 | 138.6000 | |
4116 | 0.00000000 | Trenz Electronic GmbH | TE0723 | Box | Active | 0°C ~ 70°C | TE0723 | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 12MHz | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | B2B | |||
|
TE0820-05-5DR21MA | - | |
7442 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Active | - | - | download | 1686-TE0820-05-5DR21MA | 1 | - | - | 2GB | 128MB | MPU Core | - | - | |||||||
|
TE0720-03-61Q33FAE | - | |
7751 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FAE | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
 |
TE0726-03IM | - | |
4926 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03IM | OBSOLETE | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | ||||
 |
TE0741-03-325-2IF | - | |
1985 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 325T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0720-03-61Q33FAD | - | |
7096 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FAD | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0808-04-9GI21-A | - | |
1287 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9GI21-A | 5A002A TRE | 8473.30.1180 | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | B2B |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
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