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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TEC0117-01 | 37.0200 |  |
8398 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TEC0117-01 | 1 | ||||||||||||||
|
TE0820-04-4AE21FA | - | |
7763 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-4AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU4CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
 |
TE0729-02-2IF | - | |
6097 | 0.00000000 | Trenz Electronic GmbH | TE0729 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0729 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 1686-1022 | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | 512MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec BTE | ||
 |
TE0745-01-30-1I | - | |
5023 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | REACH Unaffected | 1686-1007 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec UFPS | ||||
|
TE0820-04-3AE21FA | - | |
3514 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0820 | download | ROHS3 Compliant | Not Applicable | 1686-TE0820-04-3AE21FA | OBSOLETE | 1 | Zynq UltraScale+ XCZU3CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Samtec LSHM | |||
|
TE0813-01-2BE11-A | 414.2800 | |
9288 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-2BE11-A | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0820-03-4AE21FA | - | |
6151 | 0.00000000 | Trenz Electronic GmbH | * | Bulk | Obsolete | download | 1 (Unlimited) | 1686-TE0820-03-4AE21FA | OBSOLETE | 1 | ||||||||||||||
 |
TE0300-01IBMLP | 167.0000 | |
2740 | 0.00000000 | Trenz Electronic GmbH | TE0300 | Bulk | Not For New Designs | 0°C ~ 70°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0300 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3E | 100MHz | 64MB | 4MB | FPGA, USB Core | Cypress FX2 USB 2.0 | B2B | |||
|
TE0720-03-61Q33FAG | - | |
3857 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | - | - | - | Not Applicable | 1686-TE0720-03-61Q33FAG | OBSOLETE | 1 | - | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | - | |||||
 |
TE0841-01-035-1C | - | |
3830 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU35 | 4GB | 32MB | FPGA Core | - | Samtec LSHM | |||||
 |
TE0600-03IN | - | |
3957 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-45 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||
|
TE0720-03-61Q33FL | - | |
4524 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-61Q33FL | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 1GB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0803-02-03-1EA-S | - | |
6819 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | - | Not Applicable | 1686-TE0803-02-03-1EA-S | OBSOLETE | 1 | Zynq UltraScale+ XCZU3EG-1SFVC784E | - | 2GB | 128MB | FPGA Core | - | B2B | |||||
|
TE0720-03-64I63FA | - | |
8786 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0720-03-64I63FA | OBSOLETE | 1 | ARM Cortex-A9 | 125MHz | 512MB | 4GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | ||||
|
TE0808-04-9GI21-A | - | |
1287 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-9GI21-A | 5A002A TRE | 8473.30.1180 | 1 | Zynq UltraScale+ XCZU9EG-2FFVC900I | - | 4GB | 128MB | MPU Core | - | B2B | ||
 |
TE0726-03IM | - | |
4926 | 0.00000000 | Trenz Electronic GmbH | TE0726 | Bulk | Obsolete | 0°C ~ 70°C | 1.180" L x 1.570" W (30.00mm x 40.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0726-03IM | OBSOLETE | 1 | ARM Cortex-A9 | - | 512MB | 16MB | MCU, FPGA | Zynq-7000 (Z-7010) | CSI, DSI | ||||
|
TE0808-05-6BE21-A | 1.0000 | |
1068 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-6BE21-A | 1 | Zynq™ UltraScale+™ ZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
 |
TE0712-02-82I36-A | - | |
4636 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-82I36-A | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0745-02-71I11-A | - | |
2876 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-71I11-A | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7030) | Samtec ST5 | ||
 |
TE0745-02-35-1C | - | |
4894 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | Not Applicable | REACH Unaffected | 1686-1068 | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7035) | Samtec UFPS | ||||
|
TE0725LP-01-72C-1T | 177.4500 | |
2096 | 0.00000000 | Trenz Electronic GmbH | TE0725 | Bulk | Active | 0°C ~ 70°C | 2.870" L x 1.380" W (73.00mm x 35.00mm) | TE0725 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0725LP-01-72C-1T | 1 | Artix-7 A100T | 25MHz | - | 64MB | FPGA Core | - | 50 Pin | ||||
|
TE0808-04-9GI21-AS | - | |
6073 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Box | Obsolete | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | Not Applicable | 1686-TE0808-04-9GI21-AS | OBSOLETE | 1 | Zynq UltraScale+ ZU9 | - | 4GB | 128MB | FPGA Core | - | B2B | |||
 |
TE0820-03-02CG-1EA | - | |
7489 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | Not Applicable | 1686-1150 | 5A002A1 | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2CG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
AM0010-02-5DI21MA | 1.0000 | |
7444 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | -40°C ~ 85°C | 2.220" L x 1.575" W (56.40mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-5DI21MA | 1 | Zynq™ UltraScale+™ ZU5EV-1I | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
|
TE0720-03-S007C1 | - | |
2532 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-S007C1 | 1 | ARM Cortex-A9 | - | - | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0745-02-92I11-A | - | |
5380 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Obsolete | - | - | TE0745 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0745-02-92I11-A | 3A991D | 8471.50.0150 | 1 | - | - | - | - | - | - | |||
 |
TE0890-01-25-1C | - | |
4614 | 0.00000000 | Trenz Electronic GmbH | TE0890 | Box | Obsolete | 0°C ~ 70°C | 1.060" L x 2.050" W (27.00mm x 52.00mm) | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0890-01-25-1C | EAR99 | 8471.50.0150 | 1 | Xilinx Spartan-7 XC7S25 | 100MHz | 64Mbit | 64Mbit | FPGA Core | - | Dual-pinout DIP-40 or 50mil 80 pin connector | |||
|
TE0820-03-04EV-1EA | - | |
8249 | 0.00000000 | Trenz Electronic GmbH | TE0820 | Bulk | Obsolete | 0°C ~ 85°C | 1.570" L x 1.970" W (40.00mm x 50.00mm) | download | Not Applicable | 1686-1161 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0818-01-9BE21-A | 1.0000 | |
8157 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0818-01-9BE21-A | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0820-05-2BI81ML | 459.0000 | |
3508 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0820-05-2BI81ML | 1 |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)