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Integrated Circuits (ICs)(572)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Operating Temperature | Size / Dimension | Base Product Number | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Core Processor | Speed | RAM Size | Flash Size | Module/Board Type | Co-Processor | Connector Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TE0841-02-035-1C | - |  |
5472 | 0.00000000 | Trenz Electronic GmbH | TE0841 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | 3A991D | 8471.50.0150 | 1 | Kintex UltraScale KU035 | - | 2GB | 64MB | FPGA Core | - | B2B | |||||
 |
TE0300-01IBM | 164.0000 | |
9586 | 0.00000000 | Trenz Electronic GmbH | TE0300 | Bulk | Not For New Designs | 0°C ~ 70°C | 1.600" L x 1.900" W (40.50mm x 47.50mm) | TE0300 | download | ROHS3 Compliant | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-3E | 125MHz | 64MB | 4MB | FPGA, USB Core | Cypress FX2 USB 2.0 | B2B | |||
|
TE0807-03-7DE21-A | 1.0000 | |
6516 | 0.00000000 | Trenz Electronic GmbH | TE0807 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0807-03-7DE21-A | 1 | Zynq UltraScale+ XCZU7EV-1FBVB900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
 |
TE0712-02-100-2C | - | |
7080 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0712 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A100T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0712-02-71I06-M | - | |
5976 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-71I06-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0720-03-1CR | - | |
5898 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0720 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | 256MB | 32MB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
 |
TE0600-03IMVF | - | |
7584 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-150 | 125MHz | 1GB | 16MB | FPGA Core | - | Samtec LSHM | ||
|
TEC0850-03-015EG1E | - | |
9065 | 0.00000000 | Trenz Electronic GmbH | TEC0850 | Bulk | Obsolete | - | - | TEC0850 | - | ROHS3 Compliant | Not Applicable | 1686-TEC0850-03-015EG1E | OBSOLETE | 1 | Zynq UltraScale+ XCZU15EG-1FFVB1156E | - | 8GB | 128MB | MCU, FPGA | - | CompactPCI Serial Backplane | |||
|
TE0808-05-9GI81-A | 1.0000 | |
1856 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9GI81-A | 1 | ||||||||||||||
 |
TE0714-02-50-2I | - | |
4175 | 0.00000000 | Trenz Electronic GmbH | TE0714 | Bulk | Obsolete | -40°C ~ 85°C | 1.570" L x 1.180" W (40.00mm x 30.00mm) | download | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A50T | - | 16MB | FPGA Core | - | Samtec LSHM | |||||
|
TE0808-05-BBE21-A | 1.0000 | |
2614 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-BBE21-A | 1 | Zynq UltraScale+ XCZU15EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | 4 x 160 Pin | |||||
|
TE0712-02-72C03-M | - | |
8151 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | 0°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-72C03-M | 3A991D | 8471.50.0150 | 1 | - | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
|
TE0823-01-S001 | - | |
2954 | 0.00000000 | Trenz Electronic GmbH | TE0823 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | 1686-TE0823-01-S001 | OBSOLETE | 1 | ARM Cortex-A53, ARM® Cortex®-R5 | - | - | - | MCU, FPGA | - | USB | ||||||
|
TE0813-01-4DE11-A | 633.2000 | |
6859 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0813-01-4DE11-A | 1 | Zynq UltraScale+ XCZU4EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket - 240 | |||||
|
TE0808-04-6BE21-AK | 1.0000 | |
4607 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | download | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-04-6BE21-AK | 1 | Zynq UltraScale+ XCZU6EG-1FFVC900E | - | 4GB | 128MB | MPU Core | - | B2B | ||||
|
AM0010-02-2AE21MA | 426.0000 | |
2354 | 0.00000000 | Trenz Electronic GmbH | Zynq® UltraScale+™ | Bulk | Active | 0°C ~ 85°C | 2.205" L x 1.575" W (56.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-AM0010-02-2AE21MA | 1 | Zynq™ UltraScale+™ ZU2CG | - | 4GB | 128MB | MPU Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0741-03-160-2C1 | - | |
6425 | 0.00000000 | Trenz Electronic GmbH | TE0741 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0741 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Kintex-7 160T | 200MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0600-03B | - | |
1316 | 0.00000000 | Trenz Electronic GmbH | TE0600 | Bulk | Obsolete | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0600 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Spartan-6 LX-100 | 125MHz | 256MB | 16MB | FPGA Core | - | Samtec LSHM | ||
|
TE0745-02-81C31-A | 1.0000 | |
4139 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Active | -40°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0745-02-81C31-A | 3A991D | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 64MB | MCU, FPGA | Zynq-7000 (Z-7035) | Board-to-Board (BTB) Socket - 160 | |||
 |
TE0720-03-62I33ML | - | |
8195 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-62I33ML | EAR99 | 8471.50.0150 | 1 | ARM Cortex-A9 | - | 1GB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||
|
TE0720-03-61Q42NA | - | |
6234 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | - | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-61Q42NA | 1 | ARM Cortex-A9 | - | - | 32GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
 |
TE0803-01-02EG-1EA | - | |
1133 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Discontinued at SIC | 0°C ~ 85°C | 2.990" L x 2.050" W (76.00mm x 52.00mm) | download | Not Applicable | 1686-1112 | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU2EG-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | ||||
|
TE0803-03-5DE11-A | - | |
2661 | 0.00000000 | Trenz Electronic GmbH | TE0803 | Bulk | Obsolete | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0803 | download | ROHS3 Compliant | Not Applicable | 1686-TE0803-03-5DE11-A | OBSOLETE | 1 | Zynq UltraScale+ XCZU5EV-1SFVC784E | - | 2GB | 128MB | MPU Core | - | B2B | |||
 |
TE0720-03-64I63MA | - | |
1516 | 0.00000000 | Trenz Electronic GmbH | TE0720 | Bulk | Discontinued at SIC | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0720-03-64I63MA | 1 | ARM Cortex-A9 | - | 512MB | 8GB | MCU, FPGA | Zynq-7000 (Z-7020) | Samtec LSHM | |||||
|
TE0712-02-200-1I3 | - | |
8485 | 0.00000000 | Trenz Electronic GmbH | TE0712 | Bulk | Obsolete | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | download | ROHS3 Compliant | Not Applicable | 1686-TE0712-02-200-1I3 | 3A991D | 8471.50.0150 | 1 | Artix-7 A200T | 200MHz | 1GB | 32MB | FPGA Core | - | Samtec LSHM | |||
 |
TE0711-01-35-2C | 124.9500 | |
27 | 0.00000000 | Trenz Electronic GmbH | TE0711 | Bulk | Active | 0°C ~ 70°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | TE0711 | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | Artix-7 A35T | 100MHz | - | 32MB | FPGA Core | - | Samtec LSHM | ||
|
TE0808-05-9BE81-A | 1.0000 | |
6066 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | - | 2.990" L x 2.050" W (76.00mm x 52.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0808-05-9BE81-A | 1 | - | - | 4GB | 128MB | MPU Core | - | - | |||||
 |
TE0808-05-9BE21-AK | 1.0000 | |
5765 | 0.00000000 | Trenz Electronic GmbH | TE0808 | Bulk | Active | 0°C ~ 85°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | TE0808 | - | ROHS3 Compliant | 1 (Unlimited) | 1686-TE0808-05-9BE21-AK | 5A002A TRE | 8471.50.0150 | 1 | Zynq UltraScale+ XCZU9EG-1FFVC900E | - | 2GB | 128MB | MPU Core | - | B2B | ||
|
TE0720-04-62I33ML | 350.7000 | |
2379 | 0.00000000 | Trenz Electronic GmbH | - | Bulk | Active | -40°C ~ 85°C | 1.970" L x 1.570" W (50.00mm x 40.00mm) | - | ROHS3 Compliant | Not Applicable | 1686-TE0720-04-62I33ML | 1 | ARM® Cortex®-A9 | - | 1GB | 32MB | Ethernet Core | - | Board-to-Board (BTB) Socket | |||||
 |
TE0745-02-45-1C | - | |
5631 | 0.00000000 | Trenz Electronic GmbH | TE0745 | Bulk | Obsolete | 0°C ~ 70°C | 2.050" L x 2.990" W (52.00mm x 76.00mm) | download | 1 (Unlimited) | REACH Unaffected | 3A991D | 8471.50.0150 | 1 | ARM® Cortex®-A9 | 1GB | 32MB | MCU, FPGA | Zynq-7000 (Z-7045) | Samtec UFPS |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)